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Land grid array package socketRelated Patent Categories: Electrical Connectors, With Coupling Movement-actuating Means Or Retaining Means In Addition To Contact Of Coupling Part, For Dual Inline Package (dip), Movement-actuating Or Retaining Means Comprises Cover PressLand grid array package socket description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20060141840, Land grid array package socket. Brief Patent Description - Full Patent Description - Patent Application Claims
BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention generally relates to the art of electrical connectors and, more particularly, to a land grid array (LGA) socket to provide electrical connection between an LGA package and an electrical substrate, such as a printed circuit board (PCB). [0003] 2. Background of the Invention [0004] Integrated circuit packages are generally classified as pin grid array (PGA) packages, ball grid array (BGA) packages and land grid array (LGA) packages depending on the shape of contacting section of the terminals. An integrated circuit package with conductive pads arranged on a bottom surface thereof in a land grid array is known as an LGA package. [0005] Connectors for removably connecting an LGA package with a PCB are known as LGA sockets. Basically, an LGA socket includes a socket body and a plurality of terminals embedded in the socket body. Each terminal has a contacting section and an opposite connecting section. Under compression, the contacting section of the terminal is resiliently deflected from its natural state and electrically registered with a conductive pad on the LGA package. Thus, a flow of electrical signals is established between the LGA package and the PCB. [0006] For example, typically, an LGA socket includes a socket body having a plurality of terminals, a metallic stiffener attached to the socket body, and a load plate and a load lever pivotally assembled to opposite ends of the stiffener, respectively. While the load plate is actuated to press on the LGA package, the load plate will move in a direction away from the load lever, which will cause the LGA package to slide relative to the socket body. The movement of the LGA package will cause the terminals to be offset relative to electrical pads defined on the LGA package. As a result, normal electrical connection between the socket and the LGA package is damaged. [0007] Therefore, there is a heretofore unaddressed need in the industry to address the aforementioned deficiencies and inadequacies. SUMMARY OF THE INVENTION [0008] In a preferred embodiment of the present invention, an LGA socket includes a socket body having a number of terminals, a stiffener attached to the socket body, and a load plate and a load lever pivotally mounted to two ends of the stiffener, respectively. The load plate defines a pair of pivotal portions mounted to the stiffener to enable the load plate to rotate between an open position and a closed position. Each pivotal portion includes a bearing tongue and a stopper. The stopper resists against the stiffener for preventing the load plate from moving relative to the socket body in a horizontal direction. [0009] Other features and advantages of the present invention will become more apparent to those skilled in the art upon examination of the following drawings and detailed description of preferred embodiment, in which: BRIEF DESCRIPTION OF THE DRAWINGS [0010] FIG. 1 depicts an exploded, isometric view of an LGA socket in accordance with a preferred embodiment of the present invention; [0011] FIG. 2 depicts a bottom view of a stiffener shown in FIG. 1, wherein a socket body is engaged with the stiffener; [0012] FIG. 3 depicts an assembled, isometric view of the LGA socket of FIG. 1; and [0013] FIG. 4 depicts a side view of the LGA socket of FIG. 3, wherein the stiffener of the LGA socket is fastened to a PCB via a plurality of bolts. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT [0014] Reference will now be made to describe the preferred embodiment of the present invention in detail. [0015] As shown in FIG. 1 and FIG. 3, an LGA socket 10 (hereinafter, simply referred to as "socket") in accord with a preferred embodiment of the present invention is used to establish electrical connection between an LGA package (not shown) and an electrical substrate, such as a PCB 20. The socket 10 includes a socket body 30 embedded with a plurality of terminals 40. A stiffener 50 is attached to the socket body 30. A load plate 60 is pivotally mounted on one end of the stiffener 50. A load lever 70 is pivotally supported on an opposite end of the stiffener 50. [0016] Individual elements of the socket 10 will now be described in greater detail. As shown in FIG. 1, the socket body 30 is molded from resin or the like and is shaped in the form of a rectangular frame. A top section of the socket body 30 has an electrical area 304 that is defined by straight peripheral sidewalls 308. The electrical area 304 includes a supporting surface 305 and a mounting surface 306 opposite to the supporting surface 305. A plurality of passageways 307 for receiving the terminals 40 are defined in a matrix pattern throughout the supporting surface 305 and the mounting surface 306. [0017] Each terminal 40 includes a contacting section (not numbered) to be resiliently and electrically mated with a conductive pad on the LGA package and an opposite soldering section (not numbered) to be connected to a circuit pad arranged on the PCB 20. [0018] The stiffener 50 is formed by stamping and bending a single sheet of metal into a rectangular plate. The stiffener 50 includes a planar bottom wall 502. Side edges of the bottom wall 502 are bent upward to form a rear wall 504, a front wall 508 and a pair of lateral walls 506 between the rear wall 504 and the front wall 508. [0019] The bottom wall 502 has a large rectangular opening 503a defined by straight edges 503b. The rectangular opening 503a has a dimension that permits the socket body 30 to press-fit therein. Two pairs of through-holes 505 corresponding to mounting holes 202 defined in the PCB 20 are defined at each corner of the bottom wall 502. The through-holes 505 are symmetrically disposed along a front-rear direction. A pair of slots 507 for partially receiving the load plate 60 is provided at the joints of the bottom wall 502 and the two lateral walls 506. Each of the slots 507 extends along the bottom wall 502 in a front-rear direction. [0020] The front wall 508 includes a pair of generally L-shaped retaining elements 510 that project upward and are bent inward. The retaining elements 510 are spaced apart from one another. Continue reading about Land grid array package socket... Full patent description for Land grid array package socket Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Land grid array package socket patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Land grid array package socket or other areas of interest. ### Previous Patent Application: Electrical card connector Next Patent Application: Electrical connectors with positioning mechanism Industry Class: Electrical connectors ### FreshPatents.com Support Thank you for viewing the Land grid array package socket patent info. 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