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Laminate body, and method for manufacturing thin substrate using the laminate body


Title: Laminate body, and method for manufacturing thin substrate using the laminate body.
Abstract: Provided is a laminated body comprising a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a laminated body comprising a substrate to be ground, a curable silicone adhesive layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the adhesive layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support. ...
- St. Paul, MN, US
Inventors: Carl R. KESSEL, Larry D. Boardman, Richard J. Webb
USPTO Applicaton #: #20080014532


The Patent Description & Claims data below is from USPTO Patent Application 20080014532, Laminate body, and method for manufacturing thin substrate using the laminate body.

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stats Patent Info
Application #
US 20080014532 A1
Publish Date
01/17/2008
Document #
File Date
12/31/1969
USPTO Class
Other USPTO Classes
International Class
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Drawings
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