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J. Mike Amerson, Williams Morgan & Amerson, P.C. patentsThe following is a sampling of recent J. Mike Amerson, Williams Morgan & Amerson, P.C. patent applications (USPTO Patent Application #, Patent Title) sorted by month.
April 2008 - J. Mike Amerson, Williams Morgan & Amerson, P.C. patents
20080081403 - Method for reducing crystal defects in transistors with re-grown shallow junctions by appropriately selecting crystalline orientations
March 2008 - J. Mike Amerson, Williams Morgan & Amerson, P.C. patents
20080054415 - n-channel field effect transistor having a contact etch stop layer in combination with an interlayer dielectric sub-layer having the same type of intrinsic stress
20080059527 - System and method for standardized process monitoring in a complex manufacturing environment
January 2008 - J. Mike Amerson, Williams Morgan & Amerson, P.C. patents
20080023692 - Transistor having a strained channel region including a performance enhancing material composition
20080026487 - Method of forming an etch indicator layer for reducing etch non-uniformities
20080026531 - Field effect transistor and method of forming a field effect transistor
20080026572 - Method for forming a strained transistor by stress memorization based on a stressed implantation mask
20080003825 - Method of patterning gate electrodes by reducing sidewall angles of a mask layer
20080003830 - Reducing contamination of semiconductor substrates during beol processing by providing a protection layer at the substrate edge
December 2007 - J. Mike Amerson, Williams Morgan & Amerson, P.C. patents
20070278484 - Method and test structure for estimating electromigration effects caused by porous barrier materials
20070278596 - Method of increasing transistor drive current by recessing an isolation trench
November 2007 - J. Mike Amerson, Williams Morgan & Amerson, P.C. patents
20070254461 - Transistor having an embedded tensile strain layer with reduced offset to the gate electrode and a method for forming the same
October 2007 - J. Mike Amerson, Williams Morgan & Amerson, P.C. patents
20070228377 - Semiconductor device comprising soi transistors and bulk transistors and a method of forming the same
August 2007 - J. Mike Amerson, Williams Morgan & Amerson, P.C. patents
20070178690 - Semiconductor device comprising a metallization layer stack with a porous low-k material having an enhanced integrity
20070179652 - Method and system for scheduling a stream of products in a manufacturing environment by using a simulation process
July 2007 - J. Mike Amerson, Williams Morgan & Amerson, P.C. patents
20070166982 - Method of forming a metal layer over a patterned dielectric by wet chemical deposition including an electroless and a powered phase
20070152343 - Semiconductor device comprising a contact structure with increased etch selectivity
May 2007 - J. Mike Amerson, Williams Morgan & Amerson, P.C. patents
20070123009 - Technique for increasing adhesion of metallization layers by providing dummy vias
20070123043 - A semiconductor device comprising a copper alloy as a barrier layer in a copper metallization layer
20070123044 - Method of forming an insulating capping layer for a copper metallization layer by using a silane reaction
20070096195 - Technique for providing multiple stress sources in nmos and pmos transistors
20070096148 - Embedded strain layer in thin soi transistors and a method of forming the same
March 2007 - J. Mike Amerson, Williams Morgan & Amerson, P.C. patents
20070044544 - Method and apparatus for determining surface characteristics by using spm techniques with acoustic excitation and real-time digitizing
February 2007 - J. Mike Amerson, Williams Morgan & Amerson, P.C. patents
20070023918 - Technique for forming a copper-based contact layer without a terminal metal
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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with J. Mike Amerson, Williams Morgan & Amerson, P.C. in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for J. Mike Amerson, Williams Morgan & Amerson, P.C. with additional patents listed. Browse our Agent directory for other possible listings.
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