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Invertible, pluggable module for variable i/o densitiesRelated Patent Categories: Electrical Connectors, Preformed Panel Circuit Arrangement, E.g., Pcb, Icm, Dip, Chip, Wafer, Etc., Within Distinct Housing Spaced From Panel Circuit ArrangementInvertible, pluggable module for variable i/o densities description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20060292901, Invertible, pluggable module for variable i/o densities. Brief Patent Description - Full Patent Description - Patent Application Claims [0001] This application is a continuation application of prior application Ser. No. 10/608745 filed Jun. 27, 2003, now allowed. FIELD OF THE INVENTION [0002] The present invention relates generally to storage systems, and more particularly to a flexible architecture for providing variable I/O densities. BACKGROUND OF THE INVENTION [0003] A typical disk array may have one or more interfaces for communicating with a host server system, and one or more interfaces for communicating with the disk drives. The interfaces for communicating with the host might use any of various different host communication technologies, for example, 10 gigabit Ethernet or 10 gigabit Fibrechannel or ISCSI. The interfaces for communicating with the disks might use and of various storage channel technologies, for example, 2 Gigabit Fibrechannel or SATA. As storage technology improves, disk drives continue to become smaller and denser. Storage channel technologies continue to increase in speed, and new storage technologies are continually introduced. Storage systems therefore continue to be re-designed in order to take advantage of the smaller, denser drives and higher speed technologies to provide systems offering larger amounts of storage space that are more quickly accessible. [0004] The disk array systems of today typically consist of a single board that contains control logic and I/O interface logic. Or, a system might include several boards containing control logic and I/O interface logic in a manner whereby the I/O interface logic cannot be changed once the system is manufactured. Thus, if a customer currently has a 2 Gigabit Fibrechannel interface, but wants to upgrade to a 10 Gigabit Fibrechannel interface, the entire chassis must be replaced. Furthermore, many different types of chassis must be manufactured--one for each possible combination of disk and host I/O interfaces. [0005] It would be advantageous to provide a storage system architected such that a storage chassis could accept different types of I/O modules such that various technologies and I/O densities can be installed in a storage chassis. SUMMARY OF THE INVENTION [0006] In accordance with the principles of the invention, innovative apparatus and methods are employed to provide a highly flexible storage system. A system in accordance with the invention includes a circuit board and a plurality of pluggable modules coupled to the circuit board. The pluggable modules are insertable through side-by-side slots in an enclosure in which the circuit board resides. A first pluggable module is coupled to the circuit board via a first connector, while a second pluggable module is coupled to the circuit board via a second connector such that the pluggable module is laterally offset from the first pluggable module. [0007] According to an implementation, the first and second connectors are right angle connectors, and the second right angle connector is inverted relative to the first right angle connector. [0008] According to an alternate implementation, a riser board is coupled to the circuit board. The riser board includes two rows of connectors. The first pluggable module is coupled to the circuit board via a first connector in the first of the two rows of connectors, while the second pluggable module is coupled to the circuit board via a second connector in the second of the two rows of connectors. [0009] More particularly, the first and second pluggable modules are I/O modules for transporting high speed differential signals, and wherein the first pluggable module includes several XFP connectors, and wherein the second pluggable module includes several SFP connectors. The second pluggable module includes several SFP connectors arranged on both sides of the pluggable module. [0010] The various aspects of the invention are advantageously employed to produce a storage system wherein many different types of I/O modules may be plugged in through slots in a storage enclosure and wherein different connector heights can be accommodated. BRIEF DESCRIPTION OF THE DRAWINGS [0011] In order to facilitate a fuller understanding of the present invention, reference is now made to the appended drawings. These drawings should not be construed as limiting the present invention, but are intended to be exemplary only. [0012] FIG. 1 is a representation of a storage system including several storage enclosures. [0013] FIG. 2 is a rear view of a storage processor enclosure. [0014] FIG. 3 is a perspective view of the interior of the storage processor enclosure, showing a motherboard and several pluggable I/O modules. [0015] FIG. 4A is a side view of an XFP pluggable module connected to the motherboard. [0016] FIG. 4B is a perspective view of an XFP pluggable module. [0017] FIG. 5A is a side view of an SFP pluggable module connected to the motherboard. [0018] FIG. 5B is a perspective view of an SFP pluggable module. [0019] FIG. 6 is an overhead view of an XFP and SFP module plugged into a backplane. [0020] FIG. 7 is a representation of a pinout for the right angle connectors on the XFP and SFP pluggable modules. Continue reading about Invertible, pluggable module for variable i/o densities... Full patent description for Invertible, pluggable module for variable i/o densities Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Invertible, pluggable module for variable i/o densities patent application. ### 1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. 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