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Integrated sensor and electronics package


Abstract: An integrated sensor and electronics package wherein a micro-electromechanical sensor die is bonded to one side of the package substrate, one or more electronic chips are bonded to an opposite side of the package substrate, internal electrical connections run from the sensor die, through the package substrate, and to the one or more electronic chips, and input/output connections on the package substrate are electrically connected to one or more of the electronic chips. ...


USPTO Applicaton #: #20050199971 - Class: 257414000 (USPTO) - Class 257 

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Related Patent Categories: Active Solid-state Devices (e.g., Transistors, Solid-state Diodes), Responsive To Non-electrical Signal (e.g., Chemical, Stress, Light, Or Magnetic Field Sensors)
The Patent Description & Claims data below is from USPTO Patent Application 20050199971, Integrated sensor and electronics package.




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