Integrated photonic circuits with vertical connections

Title: Integrated photonic circuits with vertical connections

Related Patent Categories: Optical Waveguides, Integrated Optical Circuit

Brief Patent Description - Full Patent Description - Patent Claims

The Patent Description & Claims data below is from USPTO Patent Application 20060215952, Integrated photonic circuits with vertical connections.

1. A process to manufacture an integrated photonic device, said photonic device comprising vertically disposed waveguides optically connected by an angled implantation, comprising the steps of: patterning and etching a photonic waveguide onto a substrate; putting down a cladding layer over said waveguide and substrate; coating said cladding layer with a photoresist; patterning said photoresist with holes, said holes being slightly offset from said waveguide; implanting nitrogen into said holes; stripping said photoresist; and annealing said nitrogen, said annealing activating said nitrogen and forming a SiON angled channel connecting said waveguide with an outer surface of said cladding.

2. The process to manufacture an integrated photonic device according to claim 10, wherein said channel forms an angle of about 50 degrees with said substrate.

3. The process to manufacture an integrated photonic device according to claim 10, wherein said channel forms an angle of less than 50 degrees with said substrate.

4. The process to manufacture an integrated photonic device according to claim 10, wherein said nitrogen is injected into said holes in two or more doses.

5. The process to manufacture an integrated photonic device according to claim 10, further comprising the step of putting down a second waveguide on said outer surface of said cladding, said second waveguide being optically coupled to said channel and said photonic waveguide.

Brief Patent Description - Full Patent Description - Patent Claims

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Integrated optical systems for generating an array of beam outputs
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Optical waveguides

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