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05/17/07 - USPTO Class 417 |  69 views | #20070110592 | Prev - Next | About this Page  417 rss/xml feed  monitor keywords

Integrated liquid cooling system

USPTO Application #: 20070110592
Title: Integrated liquid cooling system
Abstract: An integrated liquid cooling system for removing heat from a heat-generating component includes a base (10), a pump (20) mounted in the base and a heat-dissipating member (30) communicating with the pump and coupling with the base. The pump includes a casing (21) having a chamber (212). A rotor (22), a partition seat (23) and a stator (24) are in turn received in the chamber. A top cover (25) is attached on the casing. The casing includes a bottom plate (214) having a bottom surface. The bottom surface of the bottom plate contacts the heat-generating electronic component for absorbing heat generated by the electronic component. (end of abstract)



Agent: PCe Industry, Inc. Att. Cheng-ju Chiang Jeffrey T. Knapp - Fullerton, CA, US
Inventors: TAY-JIAN LIU, CHAO-NIEN TUNG, CHUEN-SHU HOU
USPTO Applicaton #: 20070110592 - Class: 417313000 (USPTO)

Related Patent Categories: Pumps, Combined

Integrated liquid cooling system description/claims


The Patent Description & Claims data below is from USPTO Patent Application 20070110592, Integrated liquid cooling system.

Brief Patent Description - Full Patent Description - Patent Application Claims
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FIELD OF THE INVENTION

[0001] The present invention relates generally to a liquid cooling system for dissipation of heat from heat-generating components, and more particularly to an integrated liquid cooling system suitable for removing heat from electronic components of computers.

DESCRIPTION OF RELATED ART

[0002] With continuing development of the computer technology, electronic packages such as central process units (CPUs) are generating more and more heat that is required to be dissipated immediately. The conventional heat dissipating devices such as combined heat sinks and fans are not competent for dissipating so much heat any more. Liquid cooling systems have thus been increasingly used in computer technology to cool these electronic packages.

[0003] A typical liquid cooling system generally comprises a heat-absorbing member, a heat-dissipating member and a pump. These individual components are connected together in series so as to form a heat transfer loop. In practice, the heat-absorbing member is maintained in thermal contact with a heat-generating component (e.g., a CPU) for absorbing heat generated by the CPU. The liquid cooling system employs a coolant circulating through the heat transfer loop so as to continuously bring the thermal energy absorbed by the heat-absorbing member to the heat-dissipating member where the heat is dissipated. The pump is used to drive the coolant, after being cooled in the heat-dissipating member, back to the heat-absorbing member.

[0004] In the typical liquid cooling system, the heat-absorbing member, the heat-dissipating member and the pump are connected together generally by a plurality of connecting tubes so as to form the heat transfer loop. However, the typical liquid cooling system has a big volume and occupies more room in a computer system, and is not adapted to a small room of a notebook PC. Furthermore, the liquid cooling system has many connecting tubes with a plurality of connections, which is prone to lead to a leakage of the coolant so that the system has a low reliability and a high cost. Moreover, the heat-absorbing member, the heat-dissipating member and the pump are to be located at different locations when mounted to the computer system. In this situation, mounting of the liquid cooling system to the computer system or demounting of the liquid cooling system from the computer system is a burdensome and time-consuming work.

[0005] Therefore, it is desirable to provide a liquid cooling system which overcomes the foregoing disadvantages.

SUMMARY OF THE INVENTION

[0006] An integrated liquid cooling system in accordance with an embodiment of the present invention for removing heat from a heat-generating electronic component includes a base, a pump mounted in the base and a heat-dissipating member communicating with the pump and coupling with the base. The pump includes a casing having a chamber. A rotor, a partition seat and a stator are in turn received in the chamber. A top cover is attached on the casing. The casing comprises a bottom plate having a bottom surface. The bottom surface of the bottom plate contacts the heat-generating electronic component for absorbing heat generated by the electronic component. The base, the pump and the heat-dissipating member are connected together in series to thereby form a heat transfer loop, without the necessity of using any connecting tube. Thus, these individual components of the liquid cooling system are assembled together without any connecting tubes. The integrated liquid cooling system is compact in structure and has a low cost, high reliability and increased heat-dissipating effect.

[0007] Other advantages and novel features of the present invention will become more apparent from the following detailed description of preferred embodiment when taken in conjunction with the accompanying drawings, in which:

BRIEF DESCRIPTION OF THE INVENTION

[0008] FIG. 1 is an assembled, isometric view of a liquid cooling system in accordance with a preferred embodiment of the present invention;

[0009] FIG. 2 is an exploded view of FIG. 1, but shown from another aspect;

[0010] FIG. 3 is an isometric view of a heat-dissipating member of the liquid cooling system of FIG. 2;

[0011] FIG. 4 is an exploded view of a pump of the liquid cooling system of FIG. 2;

[0012] FIG. 5 is a cross-sectional view of the pump of FIG. 2;

[0013] FIG. 6 is an exploded view of a pump of a liquid cooling system in accordance with a second embodiment of the present invention;

[0014] FIG. 7 is an assembled, cross-sectional view of the pump of FIG. 6;

[0015] FIG. 8 is an exploded view of a pump of a liquid cooling system in accordance with a third embodiment of the present invention;

[0016] FIG. 9 is an assembled, cross-sectional view of the pump of FIG. 8;

[0017] FIG. 10 is an isometric view of a rotor of the liquid cooling system of FIG. 8;

[0018] FIG. 11 is an isometric view of a rotor in accordance with an alternative embodiment of the present invention;

[0019] FIG. 12 is an exploded view of a pump and a base of a liquid cooling system in accordance with a fourth embodiment of the present invention;

[0020] FIG. 13 is an exploded view of a pump and a base of a liquid cooling system in accordance with a fifth embodiment of the present invention; and

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