| Integrated circuit temperature sensing device and method -> Monitor Keywords |
|
|
 
Integrated circuit temperature sensing device and methodIntegrated circuit temperature sensing device and method description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20060238212, Integrated circuit temperature sensing device and method. Brief Patent Description - Full Patent Description - Patent Application Claims
[0001] This application is a divisional of U.S. patent application Ser. No. 10/920,531, filed on Aug. 17, 2004, now pending, which claims priority from U.S. Provisional Application No. 60/548,303, filed on Feb. 27, 2004, the contents of which are herein incorporated by reference in their entirety. FIELD OF THE INVENTION [0002] This invention relates to integrated circuit testing sockets and more particularly to the sensing of the temperature of an integrated circuits in an integrated circuit testing socket. BACKGROUND OF THE INVENTION [0003] Integrated circuit (IC) packages must be tested after their manufacture, normally at elevated temperatures, which is typically a burn-in process. During that process, it is often necessary to control the temperature of ICs, sensors, and other elements. Techniques for doing so have been widely practiced for many years. The system normally includes a heater (or cooler) and a temperature sensor. Temperature control modules and temperature sensors of many types are widely sold for these purposes. A typical application is the control of the temperature of ICs for a burn-in process because of the temperature sensitivity of the ICs. [0004] Two such examples of heating and sensing ICs in a socket can be found in U.S. Pat. No. 5,164,661 to Jones and U.S. Pat. No. 5,911,897 to Hamilton. As shown in FIG. 1, in Hamilton, a temperature sensor 10 is positioned within an insulated sensor housing 12 such that the sensor 10 protrudes from the housing 12 to contact the integrated circuit being tested. The sensor housing 12 is located in an opening in the heat sink 14. [0005] In both Hamilton and Jones, the temperature sensor directly contacts the integrated circuit when the socket is closed. The direct contact between the temperature sensor can cause damage to the integrated circuit because of the point loading of the relatively small temperature sensor on the integrated circuit when the socket is clamped closed. Damage to the temperature sensor can also be caused by the direct contact of the integrated circuit to the sensor. [0006] Thus, it would be advantageous to have a temperature measuring arrangement that could accurately measure the temperature of an integrated circuit during active thermal control of the integrated circuit while providing a way to protect both the integrated circuit and the temperature measuring device from damage caused intimate contact of the two. [0007] The foregoing and other objects, features and advantages of the invention will become more readily apparent from the following detailed description of a preferred embodiment of the invention which proceeds with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS [0008] FIG. 1 is a side elevation view of a prior art integrated circuit testing socket. [0009] FIG. 2 is a perspective view of an integrated circuit testing socket with a temperature sensing device and integrated circuit according to the invention. [0010] FIG. 3 is a partial cross-sectional view of a portion of the integrated circuit testing socket of FIG. 1 showing the temperature sensing device positioned in a temperature control block. [0011] FIG. 4 is an exploded perspective view of the temperature sensing arrangement of FIG. 1. DETAILED DESCRIPTION [0012] FIG. 2 shows an integrated circuit temperature sensing device 20 according to the invention in an integrated circuit testing socket 23. Integrated circuits include individual dies and IC packages and the term integrated circuit (IC) used throughout this specification encompasses all forms of integrated circuits. The testing socket 23 can be a socket designed to receive an IC 26 for testing which includes, burning-in, testing and programming of the IC 26. [0013] The IC testing socket 23 includes temperature control block 24 for directly controlling the temperature of the IC during testing. The IC testing socket 23 generally comprises a base 40 connected to a testing board 42 and a lid 44. The preferred form of IC testing socket is described in further detail in U.S. Provisional Application No. 60/548,303. However, particulars of construction of the IC testing socket are not necessary to the present invention and so need not be described further herein. For example, the present invention can be incorporated into other IC testing sockets such as described in U.S. Pat. No. 5,911,897 to Hamilton and shown in FIG. 1. [0014] The temperature control block 24 is positioned in the lid 44 so that when the IC testing socket 23 is in a closed position, the temperature control block 24 thermally contacts the IC 26. The temperature control block 24 then effects a change in the temperature of the IC 26 by conducting heat to or from the IC 26. Thus, the temperature control block 24 can be a heater or a cooler. [0015] The IC temperature sensing device 20 is shown located within the temperature control block 24 positioned so as to thermally contact the IC 26 when the IC testing socket is in a closed position. [0016] FIG. 3 shows a partial cross-sectional view of the IC testing socket 23 of FIG. 2 showing the IC temperature sensing device 20 positioned within the temperature control block 24. FIG. 4 shows an exploded perspective view of the temperature sensing device 20. [0017] Referring to FIGS. 3 and 4, the IC temperature sensing device includes a temperature sensor 30, such as a thermistor, in electrical communication with devices capable of converting the temperature sensor signals into useable form. One such device can be a microprocessor controller that acts as a controller, responding to the temperature sensor 30 and driving the temperature control block 24. [0018] The temperature sensor 30 is positioned within a cavity 32 of the thermally conductive sensor housing 34. The cavity 32 is shown here as being cylindrical, reflecting the overall shape of the temperature sensing device 20. The cavity 32 has a single opening at a first end of the sensor housing 34 to allow the temperature sensor to be in communication with devices like a microprocessor controller or off-board controller. When the IC testing socket 23 is in a closed position, the sensor housing 34 is in thermal contact with the IC 26. Because the sensor housing 34 is thermally conductive, the sensor housing 34 is able to provide a thermally conductive path between the IC 26 and the temperature sensor 30. [0019] The cavity 32 is formed as a blind bore which includes an open first end and a conically shaped termination 36 at a second end of the sensor housing 34. The conically shaped termination 36 has a thickness which allows for a short thermal path for a fast transient response from the IC 26 to the temperature sensor 30. A suitable thickness for producing the short thermal path is 3 mm when the sensor housing 34 is formed of a metal comprising copper or aluminum. [0020] A thermal insulator 38 surrounds the sensor housing 34 to thermally isolate the temperature sensor 30 from the temperature control block 24. The second end of the sensor housing 34 is exposed from the thermal insulator 38 to allow the sensor housing 34 to thermally contact the IC 26 when the IC testing socket 23 is in a closed position. Continue reading about Integrated circuit temperature sensing device and method... Full patent description for Integrated circuit temperature sensing device and method Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Integrated circuit temperature sensing device and method patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Integrated circuit temperature sensing device and method or other areas of interest. ### Previous Patent Application: Vertical microprobes for contacting electronic components and method for making such probes Next Patent Application: Contact probe, probe socket, electrical characteristic measuring device, and method for pushing the contact probe against object to be measured Industry Class: Electricity: measuring and testing ### FreshPatents.com Support Thank you for viewing the Integrated circuit temperature sensing device and method patent info. IP-related news and info Results in 0.71131 seconds Other interesting Feshpatents.com categories: Software: Finance , AI , Databases , Development , Document , Navigation , Error 174 |
 * Protect your Inventions * US Patent Office filing 
PATENT INFO |
|
