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12/15/05 - USPTO Class 228 | 133 views | #20050274774 | Prev - Next | About this Page

Insulation paper with high thermal conductivity materials

Title: Insulation paper with high thermal conductivity materials

Related Patent Categories: Metal Fusion Bonding, Process

Brief Patent Description - Full Patent Description - Patent Claims

The Patent Description & Claims data below is from USPTO Patent Application 20050274774, Insulation paper with high thermal conductivity materials.

What is claimed is:

1. A high thermal conductivity paper comprising: a host matrix; and high thermal conductivity materials intercalated into said host matrix; wherein said high thermal conductivity materials are comprised of at least one of nanofillers, diamond like coatings directly on said host matrix, and diamond like coatings on said nanofillers.

2. The high thermal conductivity paper of claim 1, wherein said host matrix is mica.

3. The high thermal conductivity paper of claim 1, wherein said high thermal conductivity materials comprise 0.1-65% by volume of said high thermal conductivity paper.

4. The high thermal conductivity paper of claim 3, wherein said high thermal conductivity materials comprise 1-25% by volume of said high thermal conductivity paper.

5. The high thermal conductivity paper of claim 1, wherein said the resistivity of said high thermal conductivity paper is about 10.sup.12-10.sup.16 Ohm cm and the thermal conductivity is at least 500-1200 W/mK.

6. The high thermal conductivity paper of claim 1, wherein said nanofiller have an aspect ratio greater than 5.

7. The high thermal conductivity paper of claim 1, wherein said nanofiller comprises dendrimers.

8. The high thermal conductivity paper of claim 1, wherein said high thermal conductivity paper is combined into a high thermal conductivity electrical insulation tape.

9. An electrically insulating tape comprising: a mica paper layer with intercalated high thermal conductivity materials; a glass fiber backing layer; an interface between said mica paper layer and said glass fiber backing layer; and resin impregnated through said mica paper layer and said glass fiber backing layer; wherein said high thermal conductivity materials are comprised of at least one of nanofillers, diamond like coatings directly on said host matrix, and diamond like coatings on said nanofillers; wherein said high thermal conductivity materials comprise 1-25% by volume of said mica paper.

10. A method of making high thermal conductivity paper comprising: obtaining a substrate; intercalating high thermal conductivity materials onto said substrate; producing a paper product from said substrate; wherein said high thermal conductivity materials comprise nanofillers that are intercalated into said substrate by at least one of introducing a solvent containing said nanofillers onto said substrate then evaporating said solvent, and adding said nanofillers as a dry powder to said substrate, wherein said dry powder contains a polymer, then melting said dry powder onto said substrate.

11. The method of claim 10, wherein said nanofillers have a DLC.

12. The method of claim 10, wherein said high thermal conductivity paper is combined into a high thermal conductivity electrical insulation tape.

13. A method of making high thermal conductivity paper comprising: obtaining a substrate; intercalating high thermal conductivity materials onto said substrate; and producing a paper product from said substrate; wherein said high thermal conductivity materials comprise a surface coating that is dispersed onto said substrate by deposition.

14. The method of claim 13, wherein said surface coating is a DLC.

15. A method of making high thermal conductivity paper comprising: obtaining a substrate; introducing said substrate into a paper making slurry; adding high thermal conductivity materials to said paper making slurry such that said high thermal conductivity materials intercalate into said substrate; and running said slurry though a paper making process; wherein said high thermal conductivity materials comprise nanofillers that intercalate into said substrate by using the slurry as a solvent.

16. A method of making high thermal conductivity paper comprising: obtaining a host matrix; and introducing high thermal conductivity materials onto said host matrix; wherein said host matrix is a formed paper and wherein the introduction of high thermal conductivity materials increase the thermal conductivity of said formed paper.

17. The method of claim 16, wherein said high thermal conductivity materials comprise nanofillers that are intercalated into said substrate by mixing said nanofillers with a solvent, impregnating said solvent onto said host matrix, and evaporating said solvent.

18. The method of claim 16, wherein said high thermal conductivity materials comprise a surface DLC that is added to said host matrix by deposition.

19. The method of claim 16, wherein said high thermal conductivity paper is combined into a high thermal conductivity electrical insulation tape.

20. The method of claim 19, wherein said is combined into a high thermal conductivity electrical insulation tape prior to intercalation of at least some of said high thermal conductivity materials.

Brief Patent Description - Full Patent Description - Patent Claims

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