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Insulation paper with high thermal conductivity materials


Abstract: The present invention provides for a high thermal conductivity (HTC) paper that comprises a host matrix, such as mica, and HTC materials intercalated into the host matrix. The HTC materials are comprised of at least one of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. ...


USPTO Applicaton #: #20050274774 - Class: 228101000 (USPTO)

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Related Patent Categories: Metal Fusion Bonding, Process
The Patent Description & Claims data below is from USPTO Patent Application 20050274774, Insulation paper with high thermal conductivity materials.

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