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Ic socketRelated Patent Categories: Electrical Connectors, With Coupling Movement-actuating Means Or Retaining Means In Addition To Contact Of Coupling Part, For Dual Inline Package (dip), Movement-actuating Or Retaining Means Comprises Cover PressIc socket description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20050287858, Ic socket. Brief Patent Description - Full Patent Description - Patent Application Claims
FIELD OF THE INVENTION [0001] The present invention relates to an IC socket and more particularly, to an IC socket that has a guide member for use during insertion of an IC package. BACKGROUND OF THE INVENTION [0002] A first example of a known conventional IC socket, is disclosed in Japanese Unexamined Patent Publication No. 6(1994)-151025 (FIG. 1, FIG. 3). This IC socket comprises a housing that holds a large number of contacts and has an IC package positioning base and a rotatable cover plate for pressing an IC package against the positioning base. [0003] A second example of a known IC socket, is disclosed in Japanese Unexamined Patent Publication No. 5 (1993)-174924 (FIG. 1, FIG. 3). This IC socket comprises a housing that holds a large number of contacts and has a PGA (Pin Grid Array) type IC package positioning base. [0004] In the first known IC socket, the top of the positioning base is open. Therefore, there is a possibility that a corner of an IC package will strike the contacts of the IC socket, causing them to buckle or become deformed, if the IC package is dropped during mounting onto the IC socket or the like. In addition, there is a possibility that the IC package will not be accurately placed in a predetermined position, and will be mounted in an inclined manner. [0005] In the second known IC socket, the IC package is of the PGA type. Therefore, the contacts of the IC socket are not exposed at an IC package mounting surface thereof. Accordingly, there is no possibility that the contacts will buckle or become deformed by a corner of the IC package, even if the IC package is dropped. However, in the case that the IC package is mounted in an inclined manner, it is difficult to correct the incorrect mounting state thereof. In the case that connections are established while the IC package is mounted in an inclined manner, there is a possibility that pins of the IC package will become deformed. SUMMARY OF THE INVENTION [0006] The present invention has been developed in view of the foregoing circumstances. It is an object of the present invention to provide an IC socket which is capable of guiding an IC package to the proper position therefore on a mounting surface with good mounting workability, while preventing buckling and deformation of contacts. [0007] It is another object of the present invention to provide an IC socket in which a guide member is stably urged upward, without increasing the number of parts. [0008] The IC socket of the present invention comprises a number of electrical contacts; an insulative socket housing for holding the electrical contacts arranged in a matrix in an IC package mounting surface; an openable/closable cover plate, which is positioned above an IC package to be placed on the IC package mounting surface and a lever for driving the cover plate in a closing direction to press the IC package onto the IC package mounting surface. Furthermore the IC socket includes a guide member for guiding the IC package onto the IC package mounting surface. The guide member is constituted by a pair of parallel guide rails and a link member that links corresponding ends of the guide rails, attached to the socket housing. Spring arms provided on each of the guide rails and the link member urge the guide member upward from the socket housing, Regulating members are provided for regulating upward movement of the guide member at a position at which the guided IC package is not in contact with the electrical contacts, provided on the socket housing and the guide member. The regulating members may be formed as latch protrusions on the socket housing or engaging pieces on the guide member. BRIEF DESCRIPTION OF THE DRAWINGS [0009] FIG. 1 is a perspective view of the IC socket of the present invention, having an IC package mounted thereon. [0010] FIGS. 2A and 2B illustrate the IC socket of FIG. 1, wherein FIG. 2A is a plan view, and FIG. 2B is a side view. [0011] FIG. 3 is an exploded perspective view of the IC socket of FIG. 1. [0012] FIGS. 4A, 4B, and 4C illustrate a socket housing of the IC socket of the present invention, wherein FIG. 4A is a plan view, FIG. 4B is a sectional view taken along line 4b-4b of FIG. 4A, and FIG. 4C is a sectional view taken along line 4c-4c of FIG. 4A. [0013] FIGS. 5A, 5B, 5C, 5D, and 5E illustrate a guide member which is utilized in the IC socket of the present invention, wherein FIG. 5A is a plan view, FIG. 5B is a front view, FIGS. 5C and 5D are side views, and FIG. 5E is a rear view. [0014] FIGS. 6A, 6B, and 6C illustrate a state in which the guide member is mounted on the socket housing, wherein FIG. 6A is a plan view, FIG. 6B is a side view, and FIG. 6C is a front view. [0015] FIGS. 7A, 7B, and 7C illustrate the steps of inserting the IC package into the IC socket of the present invention, wherein FIG. 7A illustrates an initial insertion state, FIG. 7B illustrates an intermediate insertion state, and FIG. 7C illustrates a complete insertion state. [0016] FIGS. 8A, 8B, and 8C are sectional views that illustrate the relationship between the guide member and the socket housing, wherein FIG. 8A illustrates a normal state in which the guide member is attached to the socket housing, FIG. 8B illustrates a state in which insertion of the IC package is complete, and FIG. 8C illustrates a state in which an electrical connection has been established between the IC package and the IC socket DETAILED DESCRIPTION OF THE EMBODIMENT(S) [0017] Hereinafter, a preferred embodiment of the IC socket of the present invention will be described in detail with reference to the attached drawings. FIG. 1, FIG. 2A and FIG. 2B illustrate an IC socket 1 of the present invention with an IC package 100 mounted thereon. The IC socket 1 comprises: a socket housing 2 (hereinafter, simply referred to as "housing"), which is to be mounted on a printed circuit board 150 (hereinafter, simply referred to as "circuit board", refer to FIG. 2B); a metallic reinforcing member 4, which is attached to the housing 2; a guide member 6 (refer to FIG. 3), which is attached to the housing 2; a cover plate 8, for pressing the IC package 100, such as a CPU, which is placed on the housing 2; and a lever 10, for driving the cover plate 8. The IC socket 1 illustrated in FIG. 1, FIG. 2A and FIG. 2B has the LGA (Land Grid Array) type IC package 100 completely mounted thereon. That is, FIG. 1, FIG. 2A and FIG. 2B illustrate a state in which an electrical connection is established between the IC package 100 and the IC socket 1. [0018] Next, the IC socket 1 will be described in further detail with reference to FIG. 3. Note that in the following description, reference will be mainly made to FIG. 3, and other figures will be referred to as necessary. First, the housing 2 will be described with combined reference to FIG. 4A, FIG. 4B, and FIG. 4C. Note that in FIG. 3 and FIG. 4A, only a portion of contact cavities are illustrated, and the rest are omitted. The housing 2 is integrally molded from an insulative resin or the like, and has a substantially rectangular planar shape. A rectangular IC package mounting surface 12 is provided at the central portion of the housing 2. Peripheral walls 14 in the form of a rectangular frame are formed so as to surround the IC package mounting surface 12. [0019] A large number of electrical contacts 90 (refer to FIG. 8), which are to be electrically connected to contacts (not shown) of the IC package 100, are provided in the IC package mounting surface 12, arranged in a matrix. That is, contact cavities 16 that penetrate through the housing 2 in the vertical direction are provided in the IC package mounting surface 12, arranged in a matrix. The electrical contacts 90 are inserted and fixed within the contact cavities 16. Continue reading about Ic socket... Full patent description for Ic socket Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Ic socket patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. 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