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10/04/07 - USPTO Class 029 |  82 views | #20070226996 | Prev - Next | About this Page  029 rss/xml feed  monitor keywords

Hybrid integrated circuit device and method of manufacturing the same

USPTO Application #: 20070226996
Title: Hybrid integrated circuit device and method of manufacturing the same
Abstract: An object of the present invention is to provide a method of manufacturing a hybrid integrated circuit device, in which multiple circuit boards are manufactured from one large metal board by dicing. The hybrid integrated circuit device of the present invention includes a circuit board with a surface provided with an insulating layer, and conductive patterns provided on the insulating layer. Circuit elements are electrically connected to the conductive patterns. Further, each side surface of the circuit board includes a first inclined portion extending obliquely downward from a peripheral portion of the surface of the circuit board, and a second inclined portion extending obliquely upward from a back surface of the circuit board and formed to be larger than the first inclined portion. (end of abstract)



Agent: Watchstone P+d, PLC - Washington, DC, US
Inventors: Masahiko MIZUTANI, Mitsuru NOGUCHI, Nobuhisa TAKAKUSAKI
USPTO Applicaton #: 20070226996 - Class: 029832000 (USPTO)

Related Patent Categories: Metal Working, Method Of Mechanical Manufacture, Electrical Device Making, Conductor Or Circuit Manufacturing, On Flat Or Curved Insulated Base, E.g., Printed Circuit, Etc., Assembling To Base An Electrical Component, E.g., Capacitor, Etc.

Hybrid integrated circuit device and method of manufacturing the same description/claims


The Patent Description & Claims data below is from USPTO Patent Application 20070226996, Hybrid integrated circuit device and method of manufacturing the same.

Brief Patent Description - Full Patent Description - Patent Application Claims
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