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High pressure pump for cooling electronicsRelated Patent Categories: Pumps, Condition Responsive Control Of Pump Drive Motor, With Plural Separate Drive Motors For Single Pump UnitHigh pressure pump for cooling electronics description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20070020107, High pressure pump for cooling electronics. Brief Patent Description - Full Patent Description - Patent Application Claims
BACKGROUND [0001] Bare electronic chips typically need to be packaged in a package that provides an electric circuit between each electrical connection of the chip and an external connector such as a pin or a ball extending from the package to external circuitry such as a printed-circuit board. The circuit side of the chip typically provides pads that are connected to the chip's packaging using, for example, solder-ball connections, which provide connections for electrical power and for input-output signals. A package typically has a non-conductive substrate (such as a plastic film or layer, or a ceramic layer) with conductive traces (wires) on or in a surface of the substrate. Either solder-ball connections or wirebond connects a chip to the package. Some packages include multiple chips, such as one or more logic or processor chips, one or more communications chips (such as for a cell phone or wireless local-area network (LAN)), and/or one or more memory chips, such as a FLASH-type reprogrammable non-volatile memory. Optionally, a cover or encapsulant is used to enclose parts or all of the chip or chips. [0002] The circuitry on the chip, particularly a very fast chip such as a microprocessor, generates a considerable amount of heat. The heat generated must be removed or the chip can be damaged or ruined. Typically, the circuitry and electrical connections for a chip are provided on one face of the chip. A heat sink or other heat-removing device is attached to the opposite or back side of the chip. In some instances, the heat produced by a chip is removed by a passive cooling system. A passive cooling system uses air to cool or remove heat from the chip. Ambient air can be used. In other instances, a fan is used to move air through or past the heat sink to remove heat from the heat sink, and the chip. [0003] Passive cooling systems remove from the chip. Sometimes the passive cooling systems can not keep the chip below a specified temperature. A liquid cooling system can be used to cool the chip. A pump is used to move the liquid through a heat exchanger. In instances where the heat exchanger inludes closely spaced plates or small openings, the amount of power needed to move the liquid through such a heat exchanger requires very high pressure. Many pumps use ball bearings to support the rotating shaft of the pump. A pump producing high pressure translates into high radial loads on the bearings of the pump. As a result, the ball bearings have a limited life which translates into a limited life for the cooling system and a less reliable processor. If the pump uses a sleeve bearing, the life of the pump and the processor is even more limited and less reliable. BRIER DESCRIPTION OF THE DRAWINGS [0004] FIG. 1 is a schematic view of a liquid cooling system for removing heat from a chip package, according to an example embodiment. [0005] FIG. 2 is a perspective cut-away schematic view of the chip package, according to an example embodiment. [0006] FIG. 3 is a top schematic view of a cooling-plate base, according to an example embodiment. [0007] FIG. 4 is an end schematic view of a cooling-plate base, according to an example embodiment. [0008] FIG. 5 is a side schematic view of a chip package base, according to an example embodiment. [0009] FIG. 6 is a schematic view of a pump, according to an example embodiment. [0010] FIG. 7 is cut-away schematic view of the second electric motor of the pump, along line 7-7 in FIG. 6, according to an example embodiment. [0011] FIG. 8 is a schematic view of a pump, according to another example embodiment. [0012] FIG. 9 is a flow diagram of a method for pumping fluid, according to an example embodiment. [0013] FIG. 10 is a schematic diagram of a computer system, according to an example embodiment. DESCRIPTION OF PREFERRED EMBODIMENTS [0014] In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings that form a part hereof, and in which are shown by way of illustration specific embodiments in which some embodiments of the invention may be practiced. It is understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the present invention. [0015] FIG. 1 is a schematic view of a liquid cooling system 200 for a chip or die 99 that produces a high amount of heat, according to an example embodiment. The cooling system 200 includes a cold plate 101, a pump 600 and a heat removal device, such as a plurality of cooling fins 220. The cold plate 101 and the pump 600 are in fluid communication with each other. A series of fluid pathways or tubes connect the pump 600 to the cold plate 101, and the cold plate 101 back to the pump 600. The plurality of fins 220 are placed on the exterior surface of the fluid path or tubing 230. The fluid path 230 or tubing forms a loop. The pump 600 moves a cooling fluid or coolant through the tubing or fluid path 230. [0016] The pump 600 includes rotors or impellers for moving the fluid or coolant. The pump 600 moves cool fluid through the tubing or fluid path 230 to the cold plate 101. The pump also produces a pressure which forces the fluid across the cold plate 101. The cold plate 101 includes an inlet manifold 111, and an outlet manifold 112. The coolant is heated as it moves through the cold plate 101. The heated coolant is moved through the tubing to the plurality of fins 220 attached to an external surface of the tubing 230. Ambient air can be used to cool the fluid, or coolant, at the portion of the tubing or fluid path 230 that includes the plurality of fins 220. In some example embodiments, a cooling fan 240 is positioned near the plurality of fins 220 to move a greater volume of air over the plurality of fins 220 and carry more heat away from the coolant, or cooling fluid traveling through the tubing or fluid path 230. The coolant within the fluid path or tubing 230 is cooler as it exits the plurality of fins 220 than when the coolant entered the portion of the fluid path or tubing carrying the plurality of fins 220. [0017] The cooled coolant moves to the pump 600 where it is then pumped again to and through the cold plate and through the loop of tubing associated with the fluid path 230. It should be noted that the plurality of fins 220 can take on any type of form. The fins can be any shape that enhances the transfer of heat from the fluid in the tubing and from the tubing. A heat exchanger or the like could also be substituted for the plurality of fins 220. [0018] A chip package 100 includes a semiconductor chip or die 99 which is attached to a substrate 212. The chip package also includes the cold plate 101. The package protects the chip or die 99 and also spaces the connectors 199 between the chip and the substrate 212 out in a grid pattern or other pattern that is less dense as depicted by connectors 98 on the substrate 212. The die or chip 99 is the component that produces heat. The die or chip 99 is in thermal contact or thermal communication with the cold plate 101 in the liquid cooling system 200. The liquid or coolant in the tubing 230 and in the cold plate 101 is separate from the die 99 and the substrate 212. The die or chip 99 generates heat during its operation. The heat produced is transferred to the liquid coolant in the tubing 230 and specifically in the cold plate 101. The cold plate 101 and the liquid coolant passing through the cold plate remove a sufficient amount of heat from the die or semiconductor 99 so as to prevent a shortened life. In other words, enough heat is removed from the semiconductor or chip 99 so that the chip or semiconductor 99 will not fail prematurely. Removal of heat from the semiconductor or chip 99 enhances the reliability of the semiconductor or chip 99 and the computing system in which the semiconductor or chip 99 is used. [0019] FIG. 2 is a perspective cut-away schematic view of a chip package 100, used in an example embodiment. Electronics chip 99 (e.g., one having an information processor or computer, communications circuitry, memory, and/or input/output interface functions) is in direct contact with cold plate 101. Chip 99 includes circuitry 95 (the source of most of the heat to be removed) and connectors 98 (such as solder-ball connectors, pads, or pins) used for power and signals. The cooling channels 114 and manifolds (or plennums) 111 and 112 are created in a separate silicon wafer, which is diced into a plurality of cold-plate bases 110. [0020] FIG. 3 is a top schematic view of a cold-plate base 110, FIG. 4 is an end schematic view of a cooling-plate base 110, and FIG. 5 is a side schematic view of a chip package 100, according to an example embodiment. The dotted line in the center of FIG. 3 represents where chip 99 is located, in some embodiments. Now referring to FIGS. 2-5, the chip package 100 will be further detailed. Cold plate 101 includes a cold-plate base 110 and cover 120, bonded together to seal in the cooling fluid. In some embodiments, the cooling fluid is water. In other embodiments, the cooling fluid is alcohol, an inert fluorinated hydrocarbon, fluoro-chloro-carbon, helium, potassium formate, liquid metal and/or other suitable cooling fluid (either liquid or gas). In some embodiments, cold-plate base 110 includes inlet tube 131 attached to cooling base 110 and in fluid communication through opening 133 with inlet manifold 111, and outlet tube 132 attached to cooling base 110 and in fluid communication through opening 134 with outlet manifold 112. [0021] In some embodiments, a plurality of deep parallel grooves (microchannels) 114 are formed between thin walls 113. The microchannels 114 receive fluid from inlet manifold 111 at one of their ends (e.g., their left ends in FIG. 1), and deliver the fluid to outlet manifold 112 at their opposite ends. In some embodiments, inlet manifold 111 and outlet manifold 112 are etched to a greater depth than are microchannels 114. In other embodiments, microchannels 114 are formed by sawing rather than etching. The microchannels 114 are made as deep as it is economical to make them, in order to increase the exposed surface area of walls 113 that act as cooling fins. 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