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High frequency moduleHigh frequency module description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20070120732, High frequency module. Brief Patent Description - Full Patent Description - Patent Application Claims
[0001] This application is a continuation of application Ser. No. 11/070,231, filed Mar. 3, 2005, which in turn is a continuation of application Ser. No. 09/934,481, filed Aug. 23, 2001. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to a high frequency module for use with high frequency band, such as the microwave band or millimeter-wave band, applications, such as in a radar apparatus, communications apparatus, or other apparatus operating in a high frequency band. [0004] 2. Description of the Prior Art [0005] FIG. 1 is a perspective view of a conventional high frequency module. FIG. 1 shows a metal chassis 1; a waveguide terminal 2 for carrying high frequency RF signals, such as microwave signals, along the substrate thickness of the chassis 1, to and from a waveguide (not shown in the figure) connected to the bottom surface of the chassis 1; a package 3 including a high frequency circuit; and connection lines 4 for carrying RF signals and consisting of a dielectric substrate formed with microstrip lines on the top surface. FIG. 2 shows the configuration of the package 3, with the right side a perspective view of the package 3 and the left side a perspective exploded view of the package. The package 3 comprises a carrier 5 provided underneath the package 3; dielectric substrates 6 mounted on the carrier 5; a feed-through terminal 7 for carrying RF signals between a high frequency circuit 9 and the connection line 4 and enabling the maintaining an airtight atmospheric integrity for the package 3; a seal 8 having a frame shape and made of metal; the high frequency circuit 9, such as a monolithic microwave IC (MMIC) or high frequency resistor; bias and control signal pins 10 for inputting and outputting DC signals from and to the high frequency circuit 9; and a metal cover 11 joined onto the top surface of the seal 8. [0006] The configuration of such a conventional high frequency module will be described next. The conventional high frequency module shown in FIG. 1, comprises a plurality of packages 3, which are connected via connection lines 4, positioned on the chassis 1 having a plurality of the waveguide terminals 2. Furthermore, the package 3 has laminated onto the metal carrier 5 a plurality of the dielectric substrates 6, on which the feed-through terminal 7 and the seal 8 are positioned, in such a manner that a cavity is provided within the seal 8. In this cavity is mounted the high frequency circuit 9. A slot is provided in the side of the seal, and in this slot the feed-through is positioned and sealed so that RF signals can be communicated to and from the connection lines 4, while maintaining the atmospheric integrity inside the package 3. Furthermore, the connection lines 4 are connected to the waveguide terminals 2 to carry RF signals between the high frequency circuit 9 and the waveguide terminals 2. The RF signals carried from the connection lines 4 to the waveguide terminals 2 are carried within the waveguide terminals 2 in waveguide mode, and the bias and control signals to the high frequency circuit 9 are obtained via the bias and control signal pins 10 provided underneath the dielectric substrate 6. The cover 11 is then joined onto the seal 8 by soldering, adhesion, or resistance welding, to seal the package 3. However, because a plurality of packages 3 are positioned on the chassis 1 in this manner, the signal loss due to the connection lines 4 for connecting between the respective packages is large and the performance as a high frequency module degrades. Furthermore, when positioning the connection lines 4 on a chassis as large as the chassis 1 and connecting the packages 3 with the connection lines 4, connection is commonly performed by applying wire bonding using thermo-compression bonding, which introduces unfavorable assembly operations, such as, for example, the heating of the entire chassis 1 to a temperature of 150.degree. C. for a long heating time, poor handling of the chassis 1, and so forth. Furthermore, even where a plurality of the packages 3 are used, cost reduction is difficult. Even when the plurality of packages have a common function, each package must still be individually equipped with that same function. In other words, a common function cannot be integrated, and cost can not be lowered through mass production. Therefore, conventional high frequency modules have problems such as performance degradation, unfavorable assembly operations, and high cost. [0007] As described above, because conventional high frequency modules comprise a plurality of packages, problems include the degradation of characteristics in the connection lines; unfavorable assembly operations during mounting and connection of the connection lines; high cost; and so forth. SUMMARY OF THE INVENTION [0008] In light of the above, it is an object of the present invention to solve these problems, and, in a high frequency module having a plurality of waveguide terminals, to reduce the number of packages inside comprising high frequency circuits, improve performance, simplify assembly operations, and lower overall cost. [0009] One aspect of the present invention is a high frequency module comprising a first dielectric substrate provided with transmission lines for carrying bias signals or IF signals, and a first and a second waveguides; a second dielectric substrate laminated on the first dielectric substrate and provided with the first and second waveguides, and a first and a second cavity positioned apart from each other; a third dielectric substrate laminated on the second dielectric substrate and having a third cavity, inside which is positioned the first cavity, and a fourth cavity, inside which is positioned the second cavity, positioned apart from the third cavity and having a slot for communicating to the third cavity, with the first and second waveguides respectively provided outside the third and fourth cavities; a metal conductor provided so as to seal the third and fourth cavities; a plurality of first high frequency circuits installed within the first cavity and connected to the transmission lines via through-holes provided on the second dielectric substrate; a plurality of second high frequency circuits installed within the second cavity and connected to the transmission lines via through-holes provided on the second dielectric substrate; a first connection line provided within the communicating slot and connected between the first and second high frequency circuits; and a second and a third connection line for respectively connecting the first and the second high frequency circuits with the first and second waveguides. [0010] According to this first aspect of the present invention, the high frequency module configured in the related art from a plurality of packages can be integrated so as to obviate connection lines between the packages, thereby enabling miniaturization of the high frequency module, improvement in the ease of assembly, performance improvement, cost reduction, and so forth. [0011] Furthermore, in a second aspect of the present invention, the above-mentioned second and third connection lines carry signals on the front and back sides of the above-mentioned second dielectric substrate between the connection lines carrying RF signals and the waveguides carrying RF signals. [0012] Furthermore, in a third aspect of the present invention, the above-mentioned second and third connection lines are positioned within the slot formed in the above-mentioned third dielectric substrate, and are coupled to waveguides formed by through-holes provided on the above-mentioned first and second dielectric substrate. [0013] According to the second and third aspects, feed-throughs are obviated, the configuration can be simplified, and signal loss due to feed-throughs can be reduced, thereby enabling further improvement in the characteristics. [0014] Furthermore, in a fourth aspect of the present invention, the element corresponding to the third dielectric substrate in the above-mentioned first aspect can be configured from a metal conductor. [0015] According to this configuration, the first and second cavities in the first aspect are configured from a metal conductor and space is ensured to provide a slot including the first connection line so that coupling of high frequency signals between cavities can be further suppressed, thereby enabling further improvement in the characteristics. [0016] Furthermore, according to a fifth aspect of the present invention, on the bottom surface of the high frequency module is provided a metal carrier having a coupling member for coupling with external apparatus. [0017] According to this configuration, the degree of freedom of mechanical fastening with another apparatus, such as an antenna, increases and fastening is simplified, thereby increasing the degree of freedom in the design and improving the ease of assembly. [0018] Furthermore, according to a sixth aspect of the present invention, a plurality of holes having continuity to ground are provided near the periphery of one cavity of the above-mentioned first to fourth cavities so as to enclose the cavity. [0019] According to this configuration, metallization can be easily obtained for suppressing leakage of RF signals. [0020] Furthermore, according to a seventh aspect of the present invention, a plurality of through-holes split vertically in half and having continuity to ground is embedded in the periphery of one cavity of the above-mentioned first to fourth cavities. [0021] According to this configuration, the hole spacing can be shortened in comparison to the configuration of the sixth aspect so that leakage of RF signals can be further suppressed. [0022] Furthermore, in an eighth aspect of the present invention, the high frequency module comprises a first oscillator for outputting a high frequency modulating signal; a power divider for dividing the power of the output of the above-mentioned first oscillator; a multiplier for doubling the frequency of one output of the above-mentioned power divider and outputting a transmitting signal; a second oscillator for outputting an intermediate frequency signal into two directions; an even harmonic high frequency mixer for outputting a signal having frequencies of the sum and difference of the doubled frequency of the other output of the above-mentioned power divider and the output frequency of the above-mentioned second oscillator; amplifiers positioned to correspond to the number of existing waveguides and for performing low-noise amplification of receiving signals obtained from respective waveguides; a power combiner for combining the power of the outputs of the above-mentioned waveguides; a first fundamental mixer for receiving and converting the frequency of the output of the above-mentioned power combiner and the output of the above-mentioned even harmonic high frequency mixer and outputting an IF signal; and a second fundamental mixer for receiving and converting the frequency of the IF signal that is output from the above-mentioned first fundamental mixer and the other output of the above-mentioned second oscillator and outputting a video signal; wherein the above-mentioned first oscillator, power divider, multiplier, even harmonic high frequency mixer, amplifiers, and first fundamental mixer are mounted within the above-mentioned first and second cavities. 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