Heating inventions 04/07

20070092848 - Tilting heating apparatus and on-the-spot heat treatment system for heating object: The present invention relates to a tilting heating apparatus in which a heating container is not lowered below the level of a tilting base when the heating container is tilted with its opening faced upward and an on-the-spot heat treatment system for a heating object. The present invention comprises a... Agent: Duane Morris, LLPIPDepartment

20070087299 - Heat treatment jig for semiconductor silicon substrate: This invention provides a heat treatment jig for semiconductor silicon substrates, which, in respective heat treatment of hydrogen annealing or argon annealing, can handle enlargement of the diameter of wafers to be treated and can also prevent slipping and dislocations that occur as a result of the stress caused by... Agent: Darby & Darby P.C.

20070082311 - Method for controlling heating apparatus: A method for controlling a heating apparatus whereby the heating apparatus is started up effectively with limited power consumption. A heating priority is determined by multiplying the temperature deviation in each zone by a heat capacity coefficient specific for each zone. The heating priority of each zone is determined alternatively... Agent: Darby & Darby P.C.

20070082312 - Method of charging fine-grained metals into an electric-arc furnace: In a method of charging fine-grained metals, in particular directly reduced iron (DRI), into an electric-arc furnace (1), the metal is supplied via a downpipe (12) to an opening (10) provided in the furnace roof (4), is introduced into the furnace (1) through this opening (10) as bulk material stream... Agent: Morgan & Finnegan, L.L.P.

20070082313 - Wafer holder, heater unit having the wafer holder, and wafer prober having the heater unit: A wafer holder less susceptible to deformation even under high load and having high heat-insulating effect and hence capable of improving positional accuracy, improving thermal uniformity and rapid heating and cooling of chips, as well as a heater unit including the wafer holder and a wafer prober including the heater... Agent: Mcdermott Will & Emery LLP

20070082314 - Low contact sic boat for silicon nitride stress reduction: A vertical wafer boat for supporting at least one semiconductor wafer, formed by a process includes forming a plurality of angled support grooves into a plurality of support members with a groove-making machine. Each support member extends along a longitudinal axis and each of the support grooves is spaced apart... Agent: Texas Instruments Incorporated