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  Heat exchanger easy mount systemRelated Patent Categories: Heat Exchange, Resilient Vibration Damper Isolating Exchanger ElementHeat exchanger easy mount system description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20070209781, Heat exchanger easy mount system. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS REFERENCE TO RELATED APPLICATIONS [0001] Reference is made to pending U.S. patent application Ser. No. 10/688,587 filed Oct. 18, 2003 for a detailed description of cooling systems and various heat transfer units and heat exchangers and their operation. Reference is also made to pending U.S. patent application Ser. No. 11/361,943 filed Feb. 27, 2006 for a detailed description of quick connectors for use with cooling systems. BACKGROUND OF THE INVENTION Description of the Related Art [0002] At the heart of data processing and telecommunication devices are processors and other heat-generating components which are becoming increasingly more powerful and generating increasing amounts of heat. As a result, more powerful cooling systems are required to prevent these components from thermal overload and resulting system malfunctions or slowdowns. [0003] Traditional cooling approaches such as heat sinks and heat pipes are unable to practically keep up with this growing heat problem. As these components become increasingly more powerful, the size and weight of air-cooled solutions become more problematic as well. In smaller housings or rack mounted systems, the space required for air-cooled solutions becomes unacceptable. Cooling systems which use a liquid or gas to cool these heat generating components are becoming increasingly needed and more viable. These systems utilize heat transfer units thermally coupled to the heat generating components for absorbing or extracting heat from the heat generating components into a coolant flowing there through. The coolant, now heated, is directed to a heat exchanger where heat is dissipated from the coolant, creating cooled coolant and returned to the heat transfer unit to repeat the cycle. [0004] Liquid cooling for these heat generating components is a more viable approach to this heat problem. A typical liquid cooling system employs one or more heat transfer units thermally coupled to the heat generating components for absorbing heat from the components into the liquid coolant and a heat exchanger which dissipates heat from the coolant and returns cooled liquid to the heat transfer units. [0005] The heat transfer unit typically comprises a housing with a cavity there through for the coolant to flow through. The contact surface (with the heat generating components) must have excellent thermal transfer capability and a wide variety of materials can be used such as copper. [0006] For today's powerful microprocessors, for example, a bulky, heavy air cooled solution such as a heat sink or heat pipe dissipater must then be coupled to heat generating component and to the motherboard for fastening which often causes problems such as breakage of the motherboard from the substantial forces that must be generated to secure the entire assembly and even shipping damage from inertia due to the heavy weight of the air cooled cooling devices. [0007] The cost and complexity of final assembly of motherboards and systems with these large, air cooled solutions also becomes problematic with space problems and expensive, and often damaging, processes for securing the air cooled system to the heat generating component and to the motherboard. [0008] The cost and complexity of final assembly of a powerful cooling solution using liquid or gas is a concern, particularly with respect to the heat exchanger units. Heat exchange units must have sufficient surface area to dissipate the heat generated by the heat generating components. Consequently they must be a certain size and bulk. [0009] Moreover, it is highly desirable to mount the heat exchange units within the system casing or housing. However with the form factors of the system casings shrinking, this becomes increasingly problematic. The assembly time and complexity of this process can be significant. [0010] Additionally, care must be taken to insure that heat exchange units are securely fastened and do not come loose or otherwise cause damage, particularly in the shipping process. [0011] Another concern is the elimination or minimization of noise and vibration of the heat exchange units in operation. [0012] Thus, there is a need in the art for a method and apparatus for space-efficient and cost-effective mounting systems for heat exchange units. [0013] There is also a need in the art for a method and apparatus for simple and cost-effective assembly of these cooling systems. [0014] There is also a need in the art for a method and apparatus for secure mounting of the heat exchange units and for methods and apparatus to ensure low noise and low vibration operation of the heat exchange units. SUMMARY OF THE INVENTION [0015] A method and apparatus for mounting a heat exchange unit to an electronic system housing comprising one or more appendages extending from the heat exchange unit or the system housing; one or more appendage holes in the electronic system housing or the heat exchange unit, respectively, and aligned to receive the tabs; and wherein when the appendages are aligned with the holes and inserted therein, the heat exchange unit is mounted and secured to the electronic system housing. [0016] The method and apparatus for mounting a heat exchange unit to an electronic system housing as described above within the housing of the electronic system. [0017] The method and apparatus for mounting a heat exchange unit to an electronic system housing as described above further comprising one or more guide pins extending from the heat exchange unit or the system housing; one or more guide pin holes in the housing or the heat exchange unit, respectively, aligned to receive the guide pins; and wherein the guide pins are inserted into the guide pin holes when the appendages are inserted into the appendage holes, the guide pins providing further stability for the heat exchange unit mounted to the housing. [0018] The method and apparatus for mounting a heat exchange unit to an electronic system housing as described above further comprising one or more shock absorbers disposed between the heat exchange unit and the housing. [0019] The method and apparatus for mounting a heat exchange unit to an electronic system housing as described above wherein the shock absorbers are aligned to reduce shocks associated with movement of the electronic system; to reduce noise of the heat exchange unit in operation; and/or reduce the transmission of any vibration of the heat exchange unit in operation to the electronic system housing. [0020] The method and apparatus for mounting a heat exchange unit to an electronic system housing as described above wherein the shock absorbers are coupled to the guide pins. Continue reading about Heat exchanger easy mount system... Full patent description for Heat exchanger easy mount system Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Heat exchanger easy mount system patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Heat exchanger easy mount system or other areas of interest. ### Previous Patent Application: Combined fluid-air evaporator and novel switching concept for a heat pump in a ventilating apparatus Next Patent Application: System and method for cooling a server-based data center with sub-ambient cooling Industry Class: Heat exchange ### FreshPatents.com Support Thank you for viewing the Heat exchanger easy mount system patent info. IP-related news and info Results in 1.39053 seconds Other interesting Feshpatents.com categories: Medical: Surgery , Surgery(2) , Surgery(3) , Drug , Drug(2) , Prosthesis , Dentistry |
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