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11/13/08 - USPTO Class 165 |  1 views | #20080277095 | Prev - Next | About this Page  165 rss/xml feed  monitor keywords

Heat exchanger assembly

Title: Heat exchanger assembly




Brief Patent Description - Full Patent Description - Patent Claims

The Patent Description & Claims data below is from USPTO Patent Application 20080277095, Heat exchanger assembly.


1. A heat exchanger, comprising: a plurality of MCC microchannel tubes, each microchannel tube of the plurality of microchannel tubes having at least one microchannel fluid passage defined therein and having a chord, the chord being the orthogonal distance from a leading edge to a trailing edge, each microchannel tube of the plurality of microchannel tubes being disposed such that the chord is less than orthogonally disposed relative to a heat exchanger plane.

2. The heat exchanger of claim 1, the chord of each microchannel tube of the plurality of microchannel tubes being disposed at an angle relative to the heat exchanger plane that is between ten and sixty degrees.

3. The heat exchanger of claim 1, the angled disposition of the chord resulting in an increased length of the chord, the increased length dimension of the chord providing for improved thermal performance by means of the resulting greater heat exchange surface area of a respective microchannel tube.

4. The heat exchanger of claim 1, providing for improved thermal performance by means of an increased surface area of each microchannel tube resulting from the angled disposition that results from the chord being less than orthogonally disposed relative to the heat exchanger plane.

5. The heat exchanger of claim 1, including a plurality of fins extending between adjacent microchannel tubes, the fins having heat exchange surfaces, the heat exchange surfaces being less than orthogonally disposed with respect to the sides of the respective adjacent microchannel tubes.

6. The heat exchanger of claim 5, the heat exchange surfaces of the fins being disposed at an angle relative to the heat exchanger plane that is less than a right angle and greater than forty-five degrees.

7. The heat exchanger of claim 5, providing for improved thermal performance by means of the angled disposition resulting of the heat exchange surfaces of the fins being less than orthogonally disposed relative to the heat exchanger plane, thereby resulting in a greater heat exchange surface of the fins.

8. The heat exchanger of claim 5, providing for improved thermal performance by means of an increased surface area of the fin heat exchange surface resulting from the angled disposition that results from the heat exchange surface of the fins being less than orthogonally disposed relative to the heat exchanger plane resulting in a greater microchannel surface area as compared to an orthogonally disposed radiator elements of the fins.

9. The heat exchanger of claim 1, each of the plurality of microchannel tubes being formed with curved sides.

10. The heat exchanger of claim 1, each of the plurality of microchannel tubes being formed in an airfoil shape.

11. A heat exchanger, comprising: a plurality of microchannel tubes; and a plurality of fins disposed between adjacent microchannel tubes, the fins having heat exchange surfaces, the heat exchange surfaces being less than orthogonally disposed with respect to a side of an adjacent microchannel tube.

12. The heat exchanger of claim 11, the heat exchange surfaces of the fins being disposed at an angle relative to the heat exchanger plane that is less than a right angle and greater than forty-five degrees.

13. The heat exchanger of claim 11, providing for improved thermal performance by means of the angled disposition resulting of the heat exchange surfaces of the fins being less than orthogonally disposed relative to the heat exchanger plane, thereby resulting in a greater heat exchange surface of the fins.

14. The heat exchanger of claim 11, providing for improved thermal performance by means of an increased surface area of the fin heat exchange surface resulting from the angled disposition that results from the heat exchange surface of the fins being less than orthogonally disposed relative to the heat exchanger plane resulting in a greater microchannel surface area as compared to an orthogonally disposed radiator elements of the fins.

15. A method of forming a heat exchanger, comprising: forming a plurality of microchannel tubes, defining at least one microchannel fluid passage in each microchannel tube of the plurality of microchannel tubes; providing a microchannel dimension being a chord, the chord being the orthogonal distance from a leading edge to a trailing edge; and disposing each microchannel tube of the plurality of microchannel tubes such that the chord is less than orthogonally disposed relative to a heat exchanger plane.

16. The method of claim 15, including forming each of the plurality of microchannel tubes with curved sides.

17. The heat exchanger of claim 15, including forming each of the plurality of microchannel tubes in an airfoil shape.

18. The method of claim 15, including providing for improved thermal performance by means of the angled disposition resulting from the chord being less than orthogonally disposed relative to the heat exchanger plane resulting in a greater microchannel surface area as compared to an orthogonally disposed microchannel.

19. The method of claim 15, including extending a plurality of fins between adjacent microchannel tubes, the fins having heat transfer surfaces, and disposing the heat transfer surfaces less than orthogonally with respect to a side of a respective adjacent microchannel tube.

20. The method of claim 17, including disposing the heat transfer surfaces of the fins at an angle relative to the heat exchanger plane that is less than a right angle and greater than forty-five degrees.

Brief Patent Description - Full Patent Description - Patent Claims

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Patent Applications in related categories:

20090283244 - Stacked and redundant chip coolers - A cooler includes a base layer, a cooling layer including at least one inlet slot and at least one outlet slot for flowing a coolant across a cooling structure including a plurality of staggered fins arranged in rows and columns, wherein fins of adjacent columns are staggered, and at least ...


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Previous Patent Application:
Miniature heat-dissipating fan device
Next Patent Application:
Method for providing an optimum heat exchange within an assemby consisting of a heat-conducting absorbing plate and a heat transfer fluid
Industry Class:
Heat exchange

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