|Heat exchange patents - Monitor Patents|
USPTO Class 165 | Browse by Industry: Previous - Next | All
02/2010 | Recent | 13: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | 12: Dec | Nov | Oct | Sep | Aug | July | June | May | April | Mar | Feb | Jan | 11: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | 10: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | | 09: Dec | Nov | Oct | Sep | Aug | Jl | Jn | May | Apr | Mar | Fb | Jn | | 2008 | 2007 |
Heat exchange February patent applications/inventions, industry category 02/10Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 02/25/2010 > patent applications in patent subcategories. patent applications/inventions, industry category
20100044004 - Fin inspection method of a heat exchanger: A fin inspection method comprising a step of having an imaging device capture an image of the core and inputting into an image processing device the image data for storage, a step of setting a first region in the image data in which an image of the entire core is... Agent: Oliff & Berridge, PLC
20100044005 - Coolant pumping system for mobile electronic systems: A coolant pumping system for a mobile electronic system includes a coolant reservoir containing a coolant, a heat exchanger member fluidly connected to the coolant reservoir, and a mass moveably mounted to the mobile electronic system. The mass is moved along at least one axis in response to at least... Agent: Cantor Colburn LLP-ibm Europe
20100044006 - Active transparent or translucent enclosures with energy control capacity: An enclosure is made out of transparent or translucent panes which form a chamber (1) through which a liquid flows in closed circuit and which interchanges energy with the inner and outer environments, a heat exchanger (2) in contact with the liquid, a circulation pump (3), and a hydrostatic pressure... Agent: Merchant & Gould PC
20100044007 - Radiator core support: A radiator core support 1 has a condenser 10 which is arranged at a front side thereof, and pipes 30 and 31, of the condenser 10, vehicle-side connecting end portions of which pass through a through-hole 8 formed on the radiator core support 1 in a state where the end... Agent: Foley And Lardner LLP Suite 500
20100044008 - Portable environmentally robust enclosure optimized for size, weight, and power dissipation: An enclosed electronic apparatus including a first continuous heat-transfer band forming at least a portion of the exterior surface of the enclosure, with continuous lateral edges on either side thereof, and mounting points on an internal side of the continuous heat transfer band to which a printed circuit board assembly... Agent: Ostrolenk Faber Gerb & Soffen
20100044009 - Annular heat dissipating device: An annular heat dissipating device, comprises an annular body; a periphery of the annular body being formed with a plurality of trenches and recesses; which are alternatively arranged. an inner middle area of the annular body having a seat plate for installing at least one heat source; a plurality of... Agent: Shyh-ming Chen
20100044010 - Manifold with multiple passages and cross-counterflow heat exchanger incorporating the same: A manifold having multiple chambers for use in a cross-counterflow heat exchanger assembly includes a first member having arms extending from a base to arm ends. A second member is secured to the first member to define the manifold. The second member includes an inner plate edge that defines a... Agent: Delphi Technologies, Inc.
20100044012 - Apparatus and method for transferring heat: A heat transfer apparatus (20) and method comprises first (R2/D2) and second (R1/D1) heat transfer units. A heat exchanger (30) has a first portion (32) thereof arranged between the first and second units, and a second portion (34) that is thermally connected to the first portion and not arranged between... Agent: Brinks Hofer Gilson & Lione
20100044011 - Heating device: The invention relates to a heating device comprising at least one heat exchanger that spirals helically around a spiral axis, is traversed by a heating medium and is configured as a flat tube comprising ends of the spiral on the feed flow and return flow sides and heating medium connections,... Agent: The Webb Law Firm, P.C.
20100044013 - Radiator of automobile: Disclosed is a radiator which can simplify the structure, cut down weight and costs, and reduce assembly process by coupling a plurality of core portions to a single header and a single tank portion. Furthermore, by arranging the plurality of core portions in a front-rear direction, the structure is simplified... Agent: Morgan, Lewis & Bockius LLP (sf)
20100044014 - Flat-plate loop heat conduction device and manufacturing method thereof: A flat-plate loop heat conduction device and a manufacturing method thereof. The flat-plate loop heat conduction device includes an upper flat plate and a lower flat plate overlapping and mating with each other. Complementary partial evaporation sections, partial vapor transfer pipes, partial condensing sections and partial condensing transfer pipes are... Agent: Rosenberg, Klein & Lee
20100044015 - Heat sink: A fluid-cooled heat sink (1) for electronic components having a heat exchanger (2) which can be associated with at least one electronic component (3), the heat exchanger having at least one channel (6) with an inlet (7) and an outlet (8) for a cooling fluid. The heat exchanger (2) having... Agent: Cohen, Pontani, Lieberman & Pavane LLP
20100044016 - Multistage cooling of electronic components of an aircraft: The invention discloses the multistage cooling of an aircraft electronic system (2) with at least one electronic component which delivers heat. The multistage feature results from the use of a plurality of circuits for transferring the waste heat. An internal coolant (14) circulating in a closed circuit which is thermally... Agent: Barnes & Thornburg LLP
20100044017 - Exhaust fan: An exhaust fan includes a fan frame, a fan, and a shielding plate. The fan frame defines a hollow shell, the hollow shell defines an air flow passage with an air inlet and an air outlet. The fan is received in the hollow shell, the fan includes a hub and... Agent: PCe Industry, Inc. Att. Steven Reiss
20100044018 - Porous layer: Heat exchange device with a boiling surface comprising porous surface layer arranged on a solid substrate, the porous surface layer comprises a porous wall structure defining and separating macro-pores that are interconnected in the general direction normal to the surface of the substrate and have a diameter greater than 5... Agent: King & Spalding
20100044019 - Heat exchanger: Heat is exchanged between exhaust gas passing through a plurality of tubes and cooling water passing through a plurality of passages defined outside of the plurality of tubes layered with each other. A heat exchanger includes a temperature decreasing portion arranged in a predetermined area on an outer surface of... Agent: Harness, Dickey & Pierce, P.L.C
20100044020 - Hydrogen gas-cooling device: A hydrogen gas-cooling device of the present invention includes, a heat exchanger that perform beat exchange between a hydrogen gas and a liquefied gas to cool a hydrogen gas; and a head tank that stores the liquefied gas supplied to the heat exchanger, wherein the heat exchanger has double pipe... Agent: Nixon & Vanderhye, PC
20100044021 - Heat exchanger with plates: A heat exchanger comprises a set of plates defining between them circuits for a fluid flowing alternately via seals mounted between each pair of two adjacent plates. Each plate including at least one guiding cut formed at least at one of the ends thereof for guiding each plate inside a... Agent: Heslin Rothenberg Farley & Mesiti PC
20100044022 - Air-to-air cooling assembly: An air-to-air cooling assembly is disclosed. The air-to-air cooling assembly includes an inlet tank having an inlet configured to receive an air flow, and a wall forming a space within the inlet tank. The air-to-air cooling assembly also includes a perforated plate disposed adjacent the inlet of the tank and... Agent: Caterpillar/finnegan, Henderson, L.L.P.
20100044023 - Heat exchanger systems & fabrication methods: A heat exchanger with multiple tubes whose ends are connected with connectors to provide a flow path for heat exchange fluid through the heat exchanger. This Abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader to quickly ascertain the subject... Agent: Guy Mcclung
20100044024 - Apparatus and method for controlled cooling: An apparatus for controlled cooling and a control method related to controlled cooling of hot plate or strip shaped metal. The apparatus comprises a header fitted with a first valve which allows air to escape from the header and prevents cooling fluid escaping from the header when being filled and... Agent: Ostrolenk Faber Gerb & Soffen02/18/2010 > patent applications in patent subcategories. patent applications/inventions, industry category
20100038051 - Combined thermal protection and surface temperature control system: The invention relates to a combined thermal protection and surface temperature control apparatus. In one embodiment, a combined thermal protection and surface temperature control apparatus comprises a porous member having an entrance side, a separate exit side, and a plurality of thermally conductive plugs disposed in the porous member. One... Agent: NovatechIPLaw
20100038052 - Geothermal hybrid heat exchange system: A geothermal hybrid heat exchange system is provided. The system includes a heat pump having a first fluid port and a second fluid port, a fluid reservoir, and at least one earth loop. A first end of the earth loop is connected to the first fluid port of the heat... Agent: Robert A. Parsons
20100038054 - Heat dispensing unit for memory chip: A heat dispensing unit includes two heat dispensing plates between which the chip is clamped. Each heat dispensing plate includes multiple ridges extending from an outside thereof and two clamps clamp two ends of the two heat dispensing plates. Each clamp includes two side plates and a flexible plate which... Agent: Wei-hau Chen
20100038055 - Heat dispensing unit for memory chip: A heat dispensing unit includes two heat dispensing plates between which the chip is clamped. Each heat dispensing plate includes two connection plates bending from two ends thereof and the two connection plates have a connection piece or a connection port so that when the two heat dispensing plates are... Agent: Wei-hau Chen
20100038053 - Sustainable endothermic heat stripping method and apparatus: A sustainable system for cooling at least one electronic device, for example a Light Emitting Diode (LED), and preferably a plurality of electronic devices, using at least one heat absorbing material contained within a housing that it is in thermal communication with said electronic devices. Said heat absorbing materials may... Agent: Cantor Colburn, LLP
20100038057 - Heat dissipation device: A heat dissipation device for cooling an electronic device mounted on a printed circuited board, comprises a heat spreader contacting the electronic device, a fin assembly comprising a plurality of fins, a supporting bracket contacting the heat spreader and supporting the fin assembly, and a heat pipe extending through the... Agent: PCe Industry, Inc. Att. Steven Reiss
20100038056 - High performance compact heat exchanger: A high performance compact heat exchanger includes a base plate with evaporator channels for cooling a heat source adjacent to the base plate. A condenser is connected to the base plate and includes fins with channels therein for the coolant. A pump delivers the coolant to the evaporator channels of... Agent: Iandiorio Teska & Coleman
20100038058 - Heat sink and cooling and packaging stack for press-packages: A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds... Agent: General Electric Company Global Research
20100038059 - Reinforced thermal module structure: A reinforced thermal module structure includes a heat pipe, a radiating base, and a radiating fin assembly. The heat pipe includes a conducting section and a heat-dissipating section. The conducting section is in contact with and connected to the radiating base, and the heat-dissipating section is extended through and connected... Agent: Nikolai & Mersereau, P.A.
20100038060 - Heat dissipation device capable of collecting air: A heat dissipation device capable of collecting air includes a fan, a heat sink and an air collecting hood. The top of the heat sink is joined to the fan. The air collecting hood is disposed to surround the heat sink. It is characterized in that the air collecting hood... Agent: G. Link Co., Ltd
20100038061 - Tube shields having a thermal protective layer: A tube shield, and method of manufacturing the tube shield, having a support structure with an external surface, an internal surface, and an edge, and a thermal protective layer on at least one surface of the shield support structure. The thermal protective layer is composed of a filler, one or... Agent: Johnston, Holroyd & Associates
20100038062 - Heat exchanger assembly, in particular for a high-temperature nuclear reactor: The invention relates to an assembly for exchanging heat between first and second fluids, the assembly comprising a central manifold communicating with one of the inlet and the outlet for the first fluid; an annular manifold disposed around the central manifold and communicating with the other one of the inlet... Agent: Connolly Bove Lodge & Hutz LLP
20100038063 - Heat exchanger, use, and manufacturing process for a heat exchanger: A heat exchanger is provided for heat transfer between a first fluid, particularly charge air or an exhaust gas, and a second fluid, particularly a coolant, which has: a block for the separated and heat-exchanging guiding of the first and second fluid, the block which has a number of flow... Agent: Muncy, Geissler, Olds & Lowe, PLLC
20100038064 - Reinforced thermal module structure: A reinforced thermal module structure includes a radiating fin assembly, a radiating base, and at least one heat pipe. The radiating fin assembly consists of a plurality of stacked and spaced radiating fins, each of which has at least two notches. The heat pipe includes a conducting section in contact... Agent: Nikolai & Mersereau, P.A.
20100038065 - Thermal conducting principle and device for prestressed clamping type multi-layered structure: The present invention discloses that the relay thermal conductor being made of material having better thermal conductivity coefficient is heat transfer coupled with the heating or cooling first thermal body at one end or face thereof, and is coupled with interface thermal conductor having higher specific heat capacity at the... Agent: Bacon & Thomas, PLLC
20100038066 - Thermal conducting principle and device for prestressed clamping type multi-layered structure: The present invention discloses that the relay thermal conductor being made of material having better thermal conductivity coefficient is heat transfer coupled with the heating or cooling first thermal body at one end or face thereof, and is coupled with interface thermal conductor having higher specific heat capacity at the... Agent: Bacon & Thomas, PLLC
20100038067 - Climate control system: There is a climate control system for open-seat vehicles. The climate control system includes a control module and a heating module operationally coupled to an interface portion of the open-seat vehicle. The heating module includes a device for converting power to heat when activated. The heating module also includes a... Agent: Advantia Law Group02/11/2010 > patent applications in patent subcategories. patent applications/inventions, industry category
20100032130 - Vehicle with heating element: The invention concerns a large vehicle 200 comprising a passenger compartment 210 which is equipped with at least one long heating element 300 which is arranged to operatively heat passengers and the passenger compartment 210 The heating element 300 comprises of: at least two exothermic channels 310, 320 which are... Agent: Harness, Dickey & Pierce, P.L.C
20100032132 - Personal cooling systems and related methods: Personal cooling systems and related methods are disclosed. According to an aspect, a personal cooling system comprises a fluid cooling chamber defining an interior for containing cooling fluid. The system also comprises a pump including an output nozzle. The pump is adapted to displace the cooling fluid from the interior... Agent: Law Offices Of Bentley J. Olive, PLLC
20100032131 - Portable climate control system: Presented herein is a portable climate control system that enables user-adjustable air temperature manipulation and is suitable for indoor and outdoor use, comprising a portable housing; at least one fan disposed on said housing for moving an air supply through the housing; a core disposed within the housing, that contains... Agent: The Law Office Of Michael E. Kondoudis
20100032133 - Heat pump with intercooler: A heat pump refrigerant system is provided with at least two sequential stages of compression. An intercooler is positioned intermediate the two stages. The refrigerant flowing through the intercooler. is cooled by a secondary fluid such as ambient air. The intercooler is positioned to be in a path of air... Agent: Carlson, Gaskey & Olds, P.C.
20100032134 - Heat sink assembly: An assembly includes a circuit board and a heat sink apparatus attached to the motherboard. The heat sink apparatus has at least two screws, and a first mistake-proof structure. A plurality of screw holes are defined in the circuit board corresponding to the screws. The circuit board has a second... Agent: PCe Industry, Inc. Att. Steven Reiss
20100032136 - Cooler module: A cooler module formed of a heat sink and a cooling fan is disclosed. A heat receiving base member of the heat sink has a flat bottom center contact surface and a plurality of bottom sloping surfaces (or one tapered bottom surface) obliquely upwardly extended from the border of the... Agent: Kwo Ger Metal Technology
20100032135 - Heat dissipation device: A heat dissipation device (100) includes a fin assembly (10) having a plurality of fins (12). Each fin includes a locking tab (126b) with a connecting end (1268), a free end (1269), a hole (1261) adjacent to the connecting end, a hook (1262) adjacent to the free end, and a... Agent: PCe Industry, Inc. Att. Steven Reiss
20100032138 - Heat pipe with flat end and method of manufacturing the same: The invention is to provide a method for making a heat pipe with a flat end. The method comprises the steps of (a) providing a first tube, including a first open end and a second open end; (b) providing a second tube, including a third open end and a flat... Agent: Thomas, Kayden, Horstemeyer & Risley, LLP
20100032137 - Thermally conductive module: A thermally conductive module includes a base seat, a thermally conductive copper block and a heat pipe. A side face of the base seat is arranged an accommodation slot, a lateral side of which is arranged a fixing slot. The thermally conductive copper seat is inset into the fixing slot... Agent: Hdls Patent & Trademark Services
20100032139 - Wind-guiding cover: A wind guiding cover applied to an electronic device is provided, which has an air inlet portion and an air outlet portion opposing to the air inlet portion. A heat exchange zone is formed between the air inlet and the air outlet, and an airflow disturbing portion, adjacent to the... Agent: Edwards Angell Palmer & Dodge LLP
20100032141 - cooling system utilizing carbon nanotubes for cooling of electrical systems: A cooling system to cool the airflow through a electrical system includes a CNT heat exchanger module disposed within a housing of the electrical system, a cooling device configured to receive a coolant, a unit board disposed within the housing of the electrical system, and an air flow device configured... Agent: Osha Liang L.L.P./sun
20100032143 - microheat exchanger for laser diode cooling: A microheat exchanging assembly is configured to cool one or more heat generating devices, such as integrated circuits or laser diodes. The microheat exchanging assembly includes a first ceramic assembly thermally coupled to a first surface, and in cases, a second ceramic assembly thermally coupled to a second surface. The... Agent: Haverstock & Owens LLP
20100032142 - Liquid cooled rack with optimized air flow rate and liquid coolant flow: A cooling system for a rack-mount server including at least one blade includes a liquid cooling line, a pump connected to the liquid cooling line, at least one heat exchanger connected to the liquid cooling line, a fan module, a control module connected to the fan module and the pump,... Agent: Osha Liang L.L.P./sun
20100032140 - Liquid cooled rack with optimized liquid flow path driven by electronic cooling demand: A cooling system for a rack-mount server including at least one blade includes a liquid cooling line, at least one adjustable valve connected to the liquid cooling line, at least one heat exchanger connected to the at least one adjustable valve, a control module connected to the at least one... Agent: Osha Liang L.L.P./sun
20100032144 - Heat dissipation device: A heat dissipation device comprises a heat sink, a fan located over the heat sink, a fan holder sandwiched between the heat sink and the fan and a plurality of fasteners fixing the fan holder on the heat sink and the heat sink on a printed circuit board. The fan... Agent: PCe Industry, Inc. Att. Steven Reiss
20100032145 - Heat conduction unit with improved laminar: A heat conduction unit having an improved laminar is provided. The heat conduction unit of the present invention includes a pair of exhaust and intake layers crossing each other for exchanging heat between exhaust and intake airflows; and a laminar interposed between the exhaust and intake layers and having a... Agent: Ipla P.A.
20100032146 - Method and arrangement for heat treatment of substrates: To provide a method and an arrangement for heat treatment of substrates which allow continuously adjustable cooling rates over a wide temperature range with simultaneously largely homogeneous temperature distribution over the area of the heating/cooling plate, a cooling/heating plate is provided containing a multiplicity of cooling/heating pipes running parallel to... Agent: Heslin Rothenberg Farley & Mesiti PC
20100032147 - Heat exchanger having winding micro-channels: A micro-channel heat exchanger suited for use in large-area cold plates includes a heat transfer member having winding micro-channels, a manifold, and a cover plate. The micro-channels' winding design is defined by a nonlinear flow axis that may include a plurality of short pitch and small amplitude undulations, which cause... Agent: Bainwood Huang & Associates LLC
20100032148 - Plate heat exchanger: The invention relates to a plate heat exchanger that includes a plurality of first and second heat exchanger plates provided beside each other for forming a plate package having a surrounding edge side and first plate interspaces for a first medium and second plate interspaces for a second medium. A... Agent: Fish & Richardson P.C.
20100032149 - Heat exchanger and method of manufacturing the same: The present invention provides, among other things, a heat exchanger including a plurality of tubes providing a flow path for a first fluid, a fin supported between two of the plurality of tubes and positioned along a flow path for a second fluid. Together, the fin and the plurality of... Agent: Michael Best & Friedrich LLP
20100032150 - Microscale cooling apparatus and method: A method and system for providing a heat sink assembly are described. The assembly includes a two-phase heat sink, a condenser, and a pump. The two-phase heat sink may include flow micro-channels that accommodate the flow of boiling coolant and cross-connect channel(s) that at least partially equilibrate a pressure field... Agent: Virtual Law Partners LLP02/04/2010 > patent applications in patent subcategories. patent applications/inventions, industry category
20100025006 - Electric vehicle thermal management system: A method for managing thermal loads within an electric vehicle using an efficient thermal management system (100) that utilizes a single heat exchanger (133) is provided. A refrigeration subsystem (103) cools the heat exchanger (133). A first coolant loop (139) in thermal communication with the heat exchanger (133) is used... Agent: Telsa Motors, Inc.
20100025007 - Cooler assembly for a vehicle cooling system: The invention concerns a cooler assembly for a vehicle cooling system, with a cooling unit pivotally attached to a retaining element. The retaining element is slidable in a lengthwise direction along a guide element which is attached to the cooling system, so that the cooling unit can be moved from... Agent: Deere & Company
20100025008 - Geothermal heating, ventilating and cooling system: An apparatus for modifying an atmosphere for use in a conditioned zone of a structure. The apparatus typically includes an underground air conduit system to take advantage of geothermal conditions to modify the temperature of air and water vapor flowing through the apparatus. A drain is typically provided for removal... Agent: Luedeka, Neely & Graham, P.C.
20100025009 - Thermal management system: A thermal management system for operating near a temperature T. The system includes a sheet-like spacer having a plurality of passageways. A degassed working fluid is disposed as a liquid within the passageways of the spacer. A flexible and substantially impermeable sheet-like envelope forms a sealed compartment enclosing the spacer... Agent: Ornl-utb-luedeka, Neely & Graham
20100025010 - Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages: A cooling apparatus, system and like method for an electronic device includes a plurality of heat producing electronic devices affixed to a wiring substrate. A plurality of heat transfer assemblies each include heat spreaders and thermally communicate with the heat producing electronic devices for transferring heat from the heat producing... Agent: Scully, Scott, Murphy & Presser, P.C.
20100025011 - Vehicle air conditioner: Provided is a vehicle air conditioner capable of maintaining comfortable temperature-controlling properties by improving the air mixing performance while reducing separation in the air channel to increase the air flow rate and reduce noise. In a vehicle air conditioner (1) employing an air-mix method in which airflow which passed through... Agent: Westerman, Hattori, Daniels & Adrian, LLP
20100025014 - Heat dissipating device and fin assembly thereof: A fin assembly includes a plurality of fins interconnected together. Each of the fins includes a main body defining a plurality of openings and a plurality of locking units formed on the main body beside the plurality of openings, respectively. Each of the locking units includes an extension tab, a... Agent: PCe Industry, Inc. Att. Steven Reiss
20100025013 - Heat dissipation device: An exemplary heat dissipation device includes a plurality of parallel fins, a heat pipe extending through the fins, and a guiding structure formed on each of the fins. An airflow channel is formed between every two neighboring fins for an airflow flowing therethough. The guiding structure is formed for guiding... Agent: PCe Industry, Inc. Att. Steven Reiss
20100025012 - Heat sink assembly: A heat sink assembly includes a base, a fin group located at a top of the base, a heat pipe connecting the base with the fin group, a fan mounted on a side of the fin group and a supporting bracket mounted on the base and supporting the fan. The... Agent: PCe Industry, Inc. Att. Steven Reiss
20100025015 - Dissipation utilizing flow of refrigerant: A heat dissipating device includes a chamber with an evaporation portion and a condensation portion, the chamber including a refrigerant. The chamber further includes an evaporation portion scraping brush provided corresponding to the evaporation portion, the evaporation portion scraping brush being able to sweep relative to an inner surface of... Agent: Birch Stewart Kolasch & Birch
20100025016 - Apparatus and method employing heat pipe for start-up of power plant: An apparatus to facilitate a start-up operation of a combined cycle or rankine cycle power plant is provided and includes a plurality of heat pipes, each of which respectively includes a first portion in thermal communication with exhaust emitted from a heat source and a second portion in thermal communication... Agent: Cantor Colburn, LLP
20100025017 - Fan module: A fan module including a fan frame, at least one fan unit, and a plurality of resilient pins is provided. The fan frame is provided with an accommodation space therein and is disposed with a plurality of mounting slots thereon. The fan unit is disposed in the accommodation space and... Agent: J C Patents
20100025018 - Heat dissipation device: An exemplary heat dissipation device includes a heat pipe and a plurality of fins. Each fin includes a main body and two edges bent from the main body. The edges of a rear fin contact a front adjacent fin. The main body defines a through hole receiving the heat pipe... Agent: PCe Industry, Inc. Att. Steven Reiss
20100025019 - Heat exchanger for cooling semiconductor chip and method of manufacturing the same: Behavior of a vapor bubble that emerges should be controlled to improve operational stability and reliability of a phase shift heat exchanger having a microchannel. The heat exchanger has a dual layer structure and includes a material that is elastically deformed according to pressure difference between the layers. The layers... Agent: Mr. Jackson Chen
20100025021 - Heat dissipation utilizing flow of refrigerant: A heat pipe heat dissipating device includes a chamber; a rotary shaft positioned within the chamber; an isolating member affixed to the rotary shaft; and a nozzle provided on the isolating member, wherein the nozzle directs the flow of a refrigerant vapor and prompts the rotary shaft and the isolating... Agent: Birch Stewart Kolasch & Birch
20100025020 - Installation for the temperature treatment of products stored on pallets or similar: The invention concerns an installation for the temperature treatment of products placed on pallets or similar, including at least one chamber, means for the introduction of a pallet, means for conveyance of the pallet between an entrance and an exit, and means for blowing air through the products on a... Agent: Kenyon & Kenyon LLP
20100025022 - Fan assembly: A fan assembly for use in an electronic device is provided. The fan assembly includes a housing, a fan, a throttle valve, and a regulator. The housing has an outlet. The fan is disposed in the housing and adapted to provide an air current. The air current generates an air... Agent: Jianq Chyun Intellectual Property Office
20100025023 - Heat exchanger, exhaust gas recirculation system, and use of a heat exchanger: A heat exchanger, particularly an exhaust gas heat exchanger, for transferring heat in two stages between a first fluid and a second and third fluid that have different temperatures is provided. The heat exchanger comprises a block for separately conducting the first as well as the second and third fluid... Agent: Muncy, Geissler, Olds & Lowe, PLLC
20100025024 - Heat exchanger and method: A heat exchanger including a first flow path for a first working fluid, a second flow path for a second working fluid, a tube at least partially defining one of the first and second flow paths, and a corrugated insert secured to the tube and positioned along the first flow... Agent: Michael Best & Friedrich LLP
20100025026 - Fatigue-proof plate heat exchanger: Plate heat exchanger for indirect heat exchange between at least two liquid and/or gaseous media with an essentially parallelepiped-shaped base (8), means for feeding and removing the media (headers 6, 6a, 7), and a number of passages (14), arranged essentially like stacks, for indirect heat exchange between media that respectively... Agent: Millen, White, Zelano & Branigan, P.C.
20100025025 - Heat exchanger and manufacturing method of the same: There is disclosed a heat exchanger capable of suppressing the increase of a pressure drop while improving a non-uniform rate distribution of a fluid. A heat exchanger T of the present invention is constituted of flat plates 1, 2 each having an inflow port 15 of the fluid on one... Agent: Mcdermott Will & Emery LLP
20100025027 - Heat exchanger with collecting tube, collecting tube, and method for producing the same: A heat exchanger, in particular a condenser or gas cooler, having a collecting tube which has a wall and which can be produced by deformation of a single metal strip, which collecting tube has, in its base, at least one row of openings in which heat exchanger tubes, each of... Agent: Michael Best & Friedrich LLP
20100025028 - Heat exchanger with receiver tank: In a heat exchanger with a receiver tank, a coupling member and an adapter member constitute a connecting member that connects the receiver tank and the heat exchanger, where the connecting member has header connecting portions respectively connected with a concentrating part and a supercooling part of one of headers... Agent: Foley And Lardner LLP Suite 500
20100025029 - Heat exchanger tube and method of forming the same: Flat heat exchanger tubes having two narrow and two broad sides are shown and described, wherein the flat tubes can be manufactured from two continuous strips having a relatively large curve on one longitudinal edge of the strips and having a relatively small curve on the other longitudinal edge of... Agent: Michael Best & Friedrich LLP
20100025030 - Heat conductive plate structure: A heat conductive plate structure includes a base metal plate having a seating portion; a coupling layer disposed above the base metal plate around the seating portion; an electric conduction layer disposed above the coupling layer around the seating portion to define a clearance therebetween; a coupling film disposed above... Agent: Rosenberg, Klein & Lee
20100025031 - Multiple tanks water thermal storage system and its using method: A multiple-tank water thermal storage system and its using method belong to energy saving technology. The multiple-tank water thermal storage system includes at least two water tanks. There are an upper diffuser (2) and a lower diffuser (5) provided in each said water tank. The upper and lower diffusers (2,... Agent: Michael Best & Friedrich LLPPrevious industry: Metal founding
Next industry: Wells
RSS FEED for 20131205:
Integrate FreshPatents.com into your RSS reader/aggregator or website to track weekly updates.
For more info, read this article.
Thank you for viewing Heat exchange patents on the FreshPatents.com website. These are patent applications which have been filed in the United States. There are a variety ways to browse Heat exchange patent applications on our website including browsing by date, agent, inventor, and industry. If you are interested in receiving occasional emails regarding Heat exchange patents we recommend signing up for free keyword monitoring by email.
FreshPatents.com Support - Terms & Conditions
Results in 0.43042 seconds