|Heat exchange patents - Monitor Patents|
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Heat exchange November recently filed with US Patent Office 11/09Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 11/26/2009 > 17 patent applications in 11 patent subcategories.
20090288800 - Cooling and heating cabinet device of rear seat for vehicles using thermoelectric element: The present invention relates to a cooling and heating cabinet device of a rear seat side for a vehicle using a thermoelectric module that is mounted between rear seats of a vehicle, having cooling and heating functions and further having an arm-resting function irrespective of its activation as the cooling... Agent: Fulbright & Jaworski, LLP
20090288801 - Capillary pumped diphasic fluid loop passive thermal control device with thermal capacitor: The thermal control device comprises at least one capillary pumped diphasic fluid loop, comprising, in a known manner, an evaporator extracting the heat from a so-called hot source and connected via a vapour pipe to a condenser in which the condensation of the fluid vapour releases thermal energy transmitted to... Agent: Miller, Matthias & Hull
20090288802 - Heat sink for chips: A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and a second heat dispensing unit is fixed on a top of the base board. The base... Agent: Wei-hau Chen
20090288803 - Heat sink for chips: A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and two engaging portions are connected to two ends of the base board. A second heat dispensing... Agent: Wei-hau Chen
20090288804 - Heat sink for chips: A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and a second heat dispensing unit is fixed on a top of the base board. The base... Agent: Wei-hau Chen
20090288805 - Semiconductor package with a chip on a support plate: A semiconductor package includes a support plate made of an electrically non-conducting material. Electrical connection vias are formed outside a chip fixing region provided on the front face of the support plate. Electrical connection wires connect pads on a front of the chip to pads on the front of the... Agent: Gardere Wynne Sewell LLP Intellectual Property Section
20090288807 - Blowerless heat exchanger based on micro-jet entrainment: A blowerless heat exchanger apparatus based on micro-jet entrainment is disclosed. The heat exchanger apparatus incorporates a number of fins regularly spaced apart from each other and parallel to each other, thus letting air currents flow in the space defined between them. A dense array of micro-jet nozzles can be... Agent: Honeywell International Inc. Patent Services
20090288806 - Heat radiating unit: A heat radiating unit in the form of a heat sink includes a contact section arranged on a central portion of an end face of the heat sink for contacting with a heat source, and having more than one extension plate outward extended therefrom; a first heat-dissipating section composed of... Agent: Nikolai & Mersereau, P.A.
20090288808 - Quick temperature-equlizing heat-dissipating device: A quick temperature-equalizing heat-dissipating device includes a hermetic container, a metallic sheet, and two metallic nets. The hermetic container contains a liquid working medium and has an internal top side and an internal bottom side. The metallic sheet is mounted inside the hermetic container, having a plurality of pores running... Agent: Bacon & Thomas, PLLC
20090288809 - Method of manufacturing electrical discharge surface treatment-purpose electrode and electrical discharge surface treatment-purpose electrode: An object of the present invention is to provide an electrical discharge surface treatment-purpose electrode that stabilizes properties and a film-forming rate of a coating made by surface treatment that uses the electrode showing a narrow distribution in physical properties such as a composition and resistance. A method of manufacturing... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.
20090288810 - Heat radiating fin: A heat radiating fin includes a flat body, two flange portions formed at two opposite edges of the flat body, and two inward bent locking ends formed at two lateral ends of each of the flange portions to space from the flat body by a distance. When two or more... Agent: Nikolai & Mersereau, P.A.
20090288811 - Aluminum plate-fin heat exchanger utilizing titanium separator plates: A plate fin heat transfer device utilizes titanium plate members and aluminum dividers. The solid bar may be titanium, aluminum or an alloy of either. The titanium plate members may have a thermal conductivity of approximately 50 or 100 BTU/Hr/ft/F/in and dramatically reduce matrix conduction of heat within the plate... Agent: Honeywell/shimokaji Patent Services
20090288812 - Turbulizers and method for forming same: Disclosed is a method of forming a heat exchanger turbulizer apparatus including a member having a longitudinal axis, a lateral width and a plurality of strips including first strips and second strips, each strip extending widthwise and being corrugated longitudinally so as to form a plurality of laterally spaced-apart sections... Agent: Ridout & Maybee LLP
20090288813 - Structure of heat exchange apparatus for gas boiler: A heat exchange apparatus of a high-load bottom-up-type condensing gas boiler is disclosed. In the gas boiler system having a ventilator attached to a lower part of a combustion chamber, the heat exchange apparatus structured in such a manner that a Venturi path for achieving a high-pressure and high-velocity flow... Agent: Hoffmann & Baron, LLP
20090288815 - Heat-dissipating device without injection pipe and method of making the same: A heat-dissipating device without any injection pipe, which includes an upper cover plate and a lower cover plate. The upper cover plate is combined with the lower cover plate, wherein a crevice and an internal space are formed between the upper and lower cover plates. The crevice is sealed by... Agent: Bacon & Thomas, PLLC
20090288814 - Mixed carbon foam/metallic heat exchanger: A heat exchanger includes a thermally-conductive fluid barrier having first and second surfaces, at least one first type of foam element placed in thermally-conductive contact with the first surface of the thermally-conductive fluid barrier and having a first coefficient of thermal expansion and at least one second type of foam... Agent: Tung & Associates / Randy W. Tung, Esq.
20090288816 - Integrated thermo-electric system: A system for controlling the temperature of a passenger cabin has a tube for receiving a heat transfer fluid from an engine and a number of heating coils being thermally connected to the tube. The system also has a number of thermo-electric heat pumps connected to the tube. The heat... Agent: Ohlandt, Greeley, Ruggiero & Perle, LLP11/19/2009 > 17 patent applications in 11 patent subcategories.
20090283242 - Thermo-chemical heat pump and methods of generating heat from a gas stream: A method of generating heat from a gas stream includes providing a first gas stream having a first temperature and a moisture content approximately saturating the gas stream, removing the moisture content from the first gas stream to form a second gas stream having a second temperature greater than the... Agent: Michael Winfield Goltry
20090283243 - Heat dissipation device: A securing structure of a heat dissipation device for an electronic component includes a fastener and a securing arm. The fastener includes a bolt and a spring surrounding the bolt. The bolt includes a main portion, a bottom fixing portion and a top head portion. An aperture extends inwardly from... Agent: PCe Industry, Inc. Att. Steven Reiss
20090283244 - Stacked and redundant chip coolers: A cooler includes a base layer, a cooling layer including at least one inlet slot and at least one outlet slot for flowing a coolant across a cooling structure including a plurality of staggered fins arranged in rows and columns, wherein fins of adjacent columns are staggered, and at least... Agent: F. Chau & Associates, LLC
20090283245 - Wet/dry cooling tower and method: An atmospheric cooling tower apparatus includes a housing structure having an air inlet and an air outlet, a first evaporative heat transfer media disposed in the housing, and a closed coil heat transfer media disposed in the housing. A water distribution assembly is disposed above the evaporative heat transfer media... Agent: Baker & Hostetler LLP
20090283246 - Cooling fin structure and heat-dissipating module thereof: A cooling fin structure and a heat-dissipating module thereof are provided. The cooling fin structure includes a plate. The plate extends bilaterally to form a first guiding portion and a second guiding portion with a first included angle between the first guiding portion and the plate and a second included... Agent: Nikolai & Mersereau, P.A.
20090283247 - Evaporator unit: An evaporator unit includes an evaporator configured to evaporate a refrigerant, and a capillary tube configured to decompress the refrigerant. The capillary tube has two longitudinal ends bonded to the evaporator. At least one position of a middle portion between the two longitudinal ends of the capillary tube is fixed... Agent: Harness, Dickey & Pierce, P.L.C
20090283248 - Temperature managing for electronic components: A method and arrangement for managing the temperature of an electronic component. A reservoir holds a tempering liquid. A pressurizing device pressurizes the liquid, and provides the liquid to a spraying device, which sprays the liquid onto the electronic component. A heat remover cools the liquid when thermal energy is... Agent: Ericsson Inc.
20090283249 - Dual pipe heat exchanger of boiler for house heating and hot water: Disclosed is a double pipe heat exchanger for a boiler supplying heating water and hot water, which can prevent water from being condensed even if cold heating water or cold water is introduced into an inlet of the heat exchanger in the boiler for supplying heating water and hot water... Agent: Lahive & Cockfield, LLP Floor 30, Suite 3000
20090283250 - High strength and high thermal conductivity heat transfer apparatus: A heat transfer apparatus includes a first protective layer of a first metallic material, a second protective layer of a second metallic material, and a heat transfer layer bonded between the first protective layer and the second protective layer. The heat transfer layer is made of a metal matrix composite,... Agent: Carlson, Gaskey & Olds, P.C.
20090283251 - Heat flow device: A device comprises equipment (501) with a heat source having a maximum thermal operation condition, a cold part (502) relative to the equipment and an element (503) capable of transmitting the heat from the equipment to the cold part. The element (503) is capable of causing the transmitted heat to... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.
20090283253 - Device for evaporating calciferous water by means of electrical heating: Apparatus for evaporating calciferous water by means of electrical heating includes an injection nozzle connected to a spray hose arranged in the upper third of an evaporator immediately above a thermostat that is disposed on the bottom side of the evaporator, the distance between the injection nozzle and the thermostat... Agent: Jordan And Hamburg LLP
20090283252 - Gas heater: A method and apparatus for heating or cooling a fluid. An inlet conduit coupled to a plurality of distribution nozzles in fluid communication with a channel at the periphery of the apparatus. An insert and a sleeve cooperatively define a thin gap, in fluid communication with the channel, through which... Agent: Patterson & Sheridan, LLP - - Appm/tx11/12/2009 > 17 patent applications in 11 patent subcategories.
20090277601 - Multi-stage cooling system: A cooling system is provided having a first heat exchanger configured to remove heat from at least a portion of a first fluid and a second heat exchanger configured to remove heat from a portion of a second fluid. The second heat exchanger is located downstream of the first heat... Agent: Caterpillar/finnegan, Henderson, L.L.P.
20090277602 - Temperature equalization air supply system of natural thermal energy with intermediate thermal storage: The method and equipment having an intermediate thermal storage between the temperature equalizer and the natural thermal matrix to provide equalized temperature by utilization of natural thermal energy, wherein the intermediate thermal storage is installed between the targeting subject for temperature adjustment and the natural thermal matrix to promote the... Agent: Bacon & Thomas, PLLC
20090277603 - Temperature equalization air supply system of natural thermal energy with intermediate thermal storage: The method and equipment having an intermediate thermal storage between the temperature equalizer and the natural thermal matrix to provide equalized temperature by utilization of natural thermal energy, wherein the intermediate thermal storage is installed between the targeting subject for temperature adjustment and the natural thermal matrix to promote the... Agent: Bacon & Thomas, PLLC
20090277604 - Display unit and vending machine having the same: A display unit and a vending machine having the same. The display unit includes a display panel to display an image, a circuit board to control the display panel, a board bracket installed at a rear of the display panel and formed with a receiving section to receive the circuit... Agent: Stanzione & Kim, LLP
20090277605 - Cold aisle isolation: A data center cooling solution providing techniques for using baffles, doors and roof sections to prevent warm air from being entrained into a cold aisle in a data center, wherein the data center generally contains an air cooling system and a raised floor structure. The raised floor structure is configured... Agent: Townsend And Townsend And Crew, LLP
20090277606 - Heat exchanger support and method of assembling a heat exchanger: A heat exchanger that includes a heat exchanger core including a plurality of stacked tubes defining a fluid flow path, a housing substantially surrounding the heat exchanger core, and an elastomeric member positioned between the heat exchanger housing and the heat exchanger core and deformable to allow movement of one... Agent: Michael Best & Friedrich LLP
20090277607 - Heat sink memory chip: A heat sink for chips includes two heat dispensing units and each heat dispensing unit includes multiple fins between which passages are defined. Each heat dispensing unit includes a flat surface defined in an inside thereof and a heat conducting member is connected to the flat surface. The chip is... Agent: Wei-hau Chen
20090277608 - Thermal control via adjustable thermal links: An apparatus for thermal control includes a first component; a second component; an adjustable thermal link disposed between the first component and the second component; and a controller for selectively varying a thermal conductance of the adjustable thermal link. A method of controlling a temperature includes sensing a temperature of... Agent: Hewlett-packard Company Intellectual Property Administration
20090277609 - Tunable thermal link: Disclosed is a device whereby the thermal conductance of a multiwalled nanostructure such as a multiwalled carbon nanotube (MWCNT) can be controllably and reversibly tuned by sliding one or more outer shells with respect to the inner core. As one example, the thermal conductance of an MWCNT dropped to 15%... Agent: Peters Verny , L.L.P.
20090277611 - Air-cooled radiator assembly for oil-filled electrical quipment: A radiator section of a radiator is provided that has a plate that defines a plurality of ducts for the flow of a fluid therethrough. A first one of the ducts has only four convex ridges and only two concave furrows. Also, a second one of the ducts located closer... Agent: J. Bennett Mullinax, LLC
20090277610 - Pallet platform with cool air tower: A cooling system for perishable items.... Agent: Bernard W. Tillman, Jr.
20090277612 - Underwater cooling assembly: A lightweight underwater cooling assembly with a high cooling capacity comprises: an assembly of heat exchanger tubes (4) arranged in a submerged refrigerant boiling chamber (5); a thin walled water cooled condenser (6) in which refrigerant vaporized in the boiling chamber (5) is condensed and from which condensed refrigerant is... Agent: Shell Oil Company
20090277614 - Heat dissipating device and heat conduction structure thereof: The heat conduction structure includes a first heat conduction plate, a second heat conduction plate and at least one heat pipes. The second heat conduction plate is positioned below the first heat conduction plate. A pair of walls extends from two opposite edges of the second heat conduction plate. The... Agent: Hdls Patent & Trademark Services
20090277615 - Heat dissipation device: A heat dissipation device includes a substrate, a fin assembly located on the substrate, a plurality of heat pipes connecting the substrate and the fin assembly, and a fan fixed on the substrate by a clip. The fin assembly includes a first fin unit, a second fin unit, and a... Agent: PCe Industry, Inc. Att. Steven Reiss
20090277613 - Geometrically reoriented low-profile phase plane heat pipes: A cooling system for removing heat from at least one heat generating component with a first low-profile phase plane heat pipe having a geometrically reoriented surface adapted for receiving heat from the at least one heat generating component along a first section of the geometrically reoriented surface, and having a... Agent: Winstead PC
20090277617 - Liquid cooling system with automatic pump speed control: A system comprising a fan tachometer module, a conversion module, and a pump tachometer module. The fan tachometer module is adapted to measure a speed of a cooling fan. The conversion module is in communication with the fan tachometer module, and is adapted to convert the speed of the cooling... Agent: Larson Newman & Abel, LLP
20090277616 - Method and apparatus of water cooling several parallel circuit cards each containing several chip packages: A cooling or heat transfer apparatus and method is disclosed for cooling an electronic device. The apparatus includes a heat producing electronic device which may include an electronic circuit card with many heat sources. A heat transfer device is connected to the heat producing electronic device which is thermally communicating... Agent: Scully, Scott, Murphy & Presser, P.C.
20090277618 - Condensate heat exchanger: A condensate heat exchanger is provided for recovering heat from condensate draining from a condensate boiler.... Agent: Wolf Greenfield & Sacks, P.C.
20090277619 - Air conditioning unit and air conditioning system comprising the same: An air conditioning system is provided. Air is pulled-in/exhausted from/into an indoor space or indoor and outdoor spaces using one fan. Thus, a configuration of the air conditioning system can be further simplified.... Agent: Mckenna Long & Aldridge LLP
20090277620 - Heat dissipation device: A heat dissipation device for dissipating heat from a plug-in electronic component, such as a memory is provided. The heat dissipation device includes a base frame, a moving frame, and a retaining cover. The base frame is disposed at one side of the electronic component. The moving frame is movably... Agent: Workman Nydegger 1000 Eagle Gate Tower
20090277621 - Cooling element: Cooling element, with multiple cooling disks (16, 17) arranged in an array to restrict flow interspaces for the air to be cooled. Cooling disks (16) extending to the inlet side for the air to be cooled, and shorter cooling disks (17) not extending to the inlet side, are arranged alternating... Agent: Dennison, Schultz & Macdonald
20090277622 - Air flow controller for electrical equipment holder: A fan is controlled to remove or provide air from or to an equipment enclosure as a function of a difference in pressure between a front and back of a rack of equipment.... Agent: Schwegman, Lundberg & Woessner, P.A.11/05/2009 > 17 patent applications in 11 patent subcategories.
20090272511 - System and method for aquifer geo-cooling: A geo-cooling system of specified cooling capacity for cooling a known heat load is disclosed. The system includes a cool water aquifer, a cool water production well and a heated water injection well. The cool water production well is open to the cool water aquifer and in hydrologic communication with... Agent: Orrick, Herrington & Sutcliffe, LLPIPProsecution Department
20090272512 - Liquid cooling heat dissipating device: The present invention discloses a liquid cooling heat dissipating device for at least one heat source. The liquid cooling heat dissipating device comprises a base, at least a cooling fin and a liquid cooling module. The device is characterized in that the cooling fin is disposed on the first area... Agent: Hudak, Shunk & Farine, Co., L.p.a.
20090272513 - Methods and systems for controlling temperature in a vessel: A method and system for preheating a vessel that includes an area of excess heat and a flow of purge fluid that is channeled to an area to be purged wherein the purge fluid is deficient of heat are provided. The system includes a cooling tube assembly positioned between the... Agent: John S. Beulick (17851) Armstrong Teasdale LLP
20090272514 - Power supply and heat-dissipating method of the power supply: A power supply is mounted in a case for a computer and has a shell, a blower assembly and multiple electrical components. The shell has a rear surface, a heat sink chamber, an electrical component chamber, an air inlet and an air outlet. The chambers have front end communicating with... Agent: Pai Patent & Trademark Law Firm
20090272515 - Heat exchanger using air and liquid as coolants: A heat exchanger suitable for a vehicle includes a plurality of tubular first members arranged in a row and forming elongate gaps. These members form passageways for flow of a first fluid for heat exchange with cooling air flowing through the gaps. The first members and gaps form a primary... Agent: Ridout & Maybee LLP
20090272516 - Method of determining a size of a heat exchanger for a vehicle: The present invention relates to a heat exchanger for a vehicle, and more particularly, to a highly efficient thin heat exchanger for reducing the weight of a vehicle body and enhancing heat radiation performance. In the present invention, there is provided an optimal design range for maximizing heat radiation performance... Agent: The Webb Law Firm, P.C.
20090272517 - Facility for cooling a detection device and detection device: A facility is disclosed for cooling a detection device. In at least one embodiment, the facility includes at least one first cooling unit, through which a thermal contact to the detection device is able to be established and through which heat arising during operation of the detection device is able... Agent: Harness, Dickey & Pierce, P.L.C
20090272518 - Air conditioner having cooling and heating functions: Disclosed is a cooling and heating air conditioner capable of performing heating more stably, preventing frost formation on coils of an outdoor unit even at subzero temperature in winter by using first and second heat exchangers and an auxiliary expansion valve. The air conditioner according to the present invention comprises... Agent: Gwips Peter T. KwonPrevious industry: Metal founding
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