Heat dissipation device

1. Field of the Invention

The present invention relates generally to heat dissipation devices, and more particularly to a heat dissipation device for cooling a heat-generating electronic device.

2. Description of Related Art

With advancement of computer technology, electronic devices operate at a high speed. It is well known that the more rapidly the electronic devices operate, the more heat they generate. If the heat is not dissipated duly, the stability of the operation of the electronic devices will be impacted severely. Generally, in order to ensure the electronic device to run normally, a heat dissipation device is used to dissipate the heat generated by the electronic device.

Typically, the heat dissipation device comprises a base formed from aluminum and contacting with the electronic device, a plurality of fins arranged on the base and a plurality of bent heat pipes embedded in the base. Heat absorbed by a central portion of the base from the electronic device is evenly distributed over the base and then transferred to the fins to be dissipated into ambient air to positively cool down the heat electronic device. However, the heat dissipating efficiency of the heat dissipation device is determined by heat conductivity of the base; as a result, the base made of a material having comparatively low conductivity such as aluminum unduly affects a performance of the dissipating efficiency of the heat dissipation device. To improve the heat dissipating efficiency, the base may be made of a material with a comparatively high conductivity such as copper; however, it would significantly add cost and weight of the heat dissipation device to replace the whole base with a copper base. Furthermore, to embed the heat pipes in the base, the base has to be provided with corresponding receiving grooves, thereby complicating the manufacture and increasing the cost of the base.

What is needed, therefore, is a heat dissipation device having an outstanding capability of heat dissipation whilst cost and weight thereof do not increase too much.

A heat dissipation device adapted for removing heat from a heat-generating electronic device, includes a base, a first fin unit arranged on a top surface of the base. The base includes a base plate, a spreader and a heat pipe group sandwiched between the base plate and the spreader. The base plate defines therein an opening. The heat pipe group has an inserting protrusion which protrudes upwardly from a top surface of the heat pipe group and is embedded in the opening of the base plate, and a receiving recession which recesses upwardly from a bottom surface of the heat pipe group and receives therein the spreader.

Other advantages and novel features of the present invention will become more apparent from the following detailed description of an embodiment/embodiments when taken in conjunction with the accompanying drawings.

Referring to FIG. 1, a heat dissipation device in accordance with a preferred embodiment of the present invention is illustrated. The heat dissipation device is adapted for removing heat from a heat-generating electronic device (not shown) and comprises a base 10 contacting with the heat-generating electronic device, a first fin unit 20 arranged on a top of the base 10 and a second fin unit 30 attached to a bottom of the base 10.