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01/03/08 | 25 views | #20080001145 | Prev - Next | USPTO Class 257 | About this Page  257 rss/xml feed  monitor keywords

Handler for testing packaged chips

USPTO Application #: 20080001145
Title: Handler for testing packaged chips
Abstract: A handler for testing packaged semiconductor chips includes a tray-transferring apparatus. Transferring members in the form of rods with external screw threads hold sides of the tray. The rods are rotated together to move the trays in a longitudinal direction. A driving unit rotates the rods together. The tray-transferring apparatus does not apply vibration to the tray during transit. Thus, it is possible to minimize the likelihood that chips contained in the tray are ejected due to vibration generated during transfer of the tray. (end of abstract)
Agent: Ked & Associates, LLP - Chantilly, VA, US
Inventors: Sung Yong Chu, Sung Mun Park, Yong Jin Lim
USPTO Applicaton #: 20080001145 - Class: 257048000 (USPTO)
Related Patent Categories: Active Solid-state Devices (e.g., Transistors, Solid-state Diodes), Test Or Calibration Structure
The Patent Description & Claims data below is from USPTO Patent Application 20080001145.
Brief Patent Description - Full Patent Description - Patent Application Claims  monitor keywords

BACKGROUND

[0001] 1. Field

[0002] The application discloses a handler for testing semiconductor chips, and more particularly, a handler equipped with a tray-transferring apparatus capable of transferring a tray containing the semiconductor chips in a smooth, speedy manner.

[0003] 2. Background

[0004] After semiconductor chips have been formed and packaged, they are usually subjected to a series of environmental, electrical, and reliability tests. These tests vary in type and specifications, depending on the customer and use of the semiconductor chips. The tests may be performed on all of the chips in a lot, or on selected samples.

[0005] Environmental tests, such as temperature cycling, are performed to weed out leaking and defective packages. During temperature cycling testing, the semiconductor chips are loaded into a chamber and cycled between two temperature extremes. The number of cycles may reach several hundred. The high and low temperatures vary with the device. During the temperature cycling, any weakness in the seal, die attachment, or bonding will be aggravated and detected, in later electrical tests.

[0006] A handler for performing these tests is equipped with a chamber into which the semiconductor chips are loaded for temperature cycling. The chamber is typically equipped with an electric heater, and a liquefied nitrogen injecting system for cooling. These systems allow the semiconductor chips to be subjected to the temperature extremes, high and low.

[0007] The packaged chips are typically mounted on test trays. The test trays are then placed within the chamber during the temperature cycling. Usually, multiple trays are in the temperature cycling chamber at any given time. Test trays are inserted into one side of the chamber and are removed from the opposite side of the chamber. Temperature cycling occurs continuously as the test trays move from the input side to the output side.

[0008] In related art handlers, two or more holding rods and transferring rods act as a tray transferring apparatus to move the trays from the input side of the chamber to the output side of the chamber. The holding rods and transferring rods support sides of the trays and physically move the trays within the chamber. Teeth are provided at regular intervals along the holding rods and transferring rods. The holding and transferring rods are provided within the chamber, and extend between the inlet and the outlet of the chamber. The holding and transferring rods are rotatable so that they can rotate the protruding teeth into and out of engagement with the test trays. The teeth also act to support the trays in the upright position.

[0009] When the holding rods supporting the trays are rotated, the teeth formed on the holding rods are rotated downward so that they no longer block movement of the trays. The transferring rods, whose teeth are engaged with the trays, are then moved forward in the direction in which the trays are to move. As a result, the teeth formed on the transferring rods push the trays forward by one step. The holding rods are then reverse rotated so that they again support the trays, and the transferring rods are rotated so that the teeth in the transferring rods no longer engage the trays. Thus allows the transferring rods to be moved backwards in a direction opposite to the tray travel direction. When the transferring rods have been moved back, they are reverse rotated so that the teeth on the transferring rods again engage the trays. At this point, the cycle can be repeated to move the trays forward by another step.

[0010] When the tray finally reaches the end of the chamber, the tray is released from the teeth formed on the holding rod and the transferring rod pushes the tray, onto guide rails provided to an inside wall of the chamber.

[0011] The conventional tray-transferring apparatus is equipped with two or more holding and transferring rods at high and low positions within the chamber. Driving units have to be provided to drive the two or more holding and transferring rods. This makes a configuration of the tray-transferring apparatus complicated.

[0012] Furthermore, the holding and transferring rods must be rotated in directions opposite to each other, and the transferring rods must also be moved backwards and forwards in a straight line. The rotary and linear motion of the holding and transferring rods makes the configuration of the tray-transferring apparatus complicated.

BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The embodiments will be described in detail with reference to the following drawings in which like reference numerals refer to like elements, and wherein:

[0014] FIG. 1 is a cross-sectional view illustrating a tray-transferring apparatus;

[0015] FIG. 2 is a perspective view illustrating the main components of the tray-transferring apparatus of FIG. 1; and

[0016] FIG. 3 is another perspective view illustrating main components of the tray-transferring apparatus of FIG. 1 from a different angle.

DETAILED DESCRIPTION

[0017] In this embodiment, three transferring bars are used. However, in alternate embodiments, other numbers of transferring bars could be provided.

[0018] In the disclosed handler, transferring bars 10 are provided to extend from the internal front side of the chamber 1 to the internal rear side of the chamber 1. Each transferring bar has a screw thread 11a on its external surface. Edges of trays `T` are inserted into the screw groove 11 of the threads 11a. In the illustrated embodiment, the chamber has two transferring bars supporting a lower side of the trays `T` and one transferring bar supporting a upper side of the trays `T`. Ends of the transferring bars are rotatably supported by two bushings 13, which are provided at two lateral sides of the chamber 1, respectively.

[0019] A driving unit, which synchronously rotates the transferring bars 10, is provided on an external side of the chamber 1. The driving unit includes a motor 21, a drive pulley 22 connected to a shaft of the motor 21, and driven pulleys 23 connected to ends of each of the transferring bars 10. A belt 24 connects the drive pulley 22 and the driven pulleys 23. The belt 24 transmits rotary motion of the drive pulley 22 to the driven pulleys 23.

[0020] The motor 21 can be rotated in both directions, clockwise and counterclockwise. The motor 21 includes a servo motor giving positional control. An idler pulley 25 keeps the belt 24 at the correct tension.

[0021] A pair of guiding bars 30, guide and support lateral sides of the trays `T` in such a manner that the tray `T` moves forwards and backwards in a straight line. Guiding bars 30 are provided on both lateral sides of the chamber 1, respectively. The guiding bars 30 are provided in parallel with the transferring bars.

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Organic thin film transistor substrate and fabrication method therefor
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