| Guiding fin heat sink -> Monitor Keywords |
|
|
  Guiding fin heat sinkUSPTO Application #: 20060102325Title: Guiding fin heat sink Abstract: The present invention is a guiding fin heat sink, where a heat-dissipation unit is stuck on a CPU by a base and the unit has guiding channels passing through two ends; heat pipes are located between the base and the unit at one end, the other end is made penetrating through the guiding channels, and one end surface of the guiding channels is corresponding to an opening on a side wall of a computer case; and, after the heat of the CPU is absorbed by the base, it is directed to the heat-dissipation unit and the heat pipes and is carried to the outside of the computer case by an air flow made a fan between the case and the unit, so that no heat re-cycling is in the case and better heat dissipation efficiency is obtained. (end of abstract)
Agent: Troxell Law Office PLLC - Falls Church, VA, US Inventors: Nien-Lun Li, Yun-Yeu Yeh, To Hsu, Hung-Chung Chu, Cheng-Hsing Lee USPTO Applicaton #: 20060102325 - Class: 165104330 (USPTO) Related Patent Categories: Heat Exchange, Intermediate Fluent Heat Exchange Material Receiving And Discharging Heat, Liquid Fluent Heat Exchange Material, Cooling Electrical Device The Patent Description & Claims data below is from USPTO Patent Application 20060102325. Brief Patent Description - Full Patent Description - Patent Application Claims
FIELD OF THE INVENTION [0001] The present invention relates to a heat sink and its method thereof; more particularly, relates to a guiding fin heat sink and its method where heat generated by a CPU can be directly dissipated out from the computer case to prevent from heat recycling and to obtain better heat-dissipation efficiency. DESCRIPTION OF THE RELATED ART [0002] A heat sink according to a prior art, as shown in FIG. 5, comprises a heat-dissipation unit and a fan thereon. The heat-dissipation unit comprises a base and a plurality of fins extended up from the base. When utilizing, the base is stuck on a CPU of a main board so that heat generated by the CPU on operating is transmitted to the fins through the base; an air flow is directed to the fins to carry out the heat; and then, the air flow with the heat is absorbed by another fan on the computer case to be flown out for heat dissipation. [0003] The above heat sink according to the prior art utilizes a fan to guide an air flow to the fins for heat dissipation. But, because the air flow is directly directed to the base and the fins by the fan, when the air flow with heat is flown from between the fins, the air flow with heat will be remained in the computer case. And, because the another fan on the computer case is far from the heat-dissipation device on the main board, when the air flow with heat is not yet absorbed and blown out of the computer case by the another fan on the computer case, the air flow with heat will be directly directed to the base and the fins so that a heat recycling and bad heat-dissipation efficiency occurs. SUMMARY OF THE INVENTION [0004] Therefore, the main purpose of the present invention is that: absorbing heat generated by a CPU through a base and guiding it to a heat-dissipation unit and more than one heat pipe; and dissipating the heat in the heat-dissipation unit and the heat pipe out to the outside of a computer case, to prevent from heat re-cycling in the computer case and to achieve better heat dissipation efficiency. [0005] In order to achieve the above purpose, the present invention is a guiding fin heat sink and a method thereof, where the sink comprises a base, a heat-dissipation unit deposed on a surface of the base, more than one heat pipe deposed between the base and the heat-dissipation unit, and a fan on an end-surface at a side of the heat-dissipation unit; and the method comprises the following steps: [0006] (a) obtaining a heat-dissipation unit which is deposed on a CPU of a main board by a base [0007] (b) Corresponding more than one guiding channel of the heat-dissipation unit to an opening on a side wall of a computer case; and [0008] (c) Deposing a fan on the opening of the computer case, where, after absorbing heat generated by the CPU through the base, the heat is directly directed out of the computer case by the fan. [0009] Accordingly, the heat generated by the CPU can be absorbed by the base to be directed to the heat-dissipation unit and the heat pipe and then to be directly directed out of the computer case by the fan. BRIEF DESCRIPTION OF THE DRAWINGS [0010] The present invention will be better understood from the following detailed descriptions of the preferred embodiments according to the present invention, taken in conjunction with the accompanying drawings, in which [0011] FIG. 1 is a perspective view according to a first embodiment of the present invention; [0012] FIG. 2 is a top view according to the first embodiment of the present invention; [0013] FIG. 3A is a view showing a status of use according to the first embodiment of the present invention; [0014] FIG. 3B is a view showing a status of use according to a second embodiment of the present invention; [0015] FIG. 4 is a view showing a status of use according to a third embodiment of the present invention; and [0016] FIG. 5 is a perspective view according to a prior art. DESCRIPTION OF THE PREFERRED EMBODIMENTS [0017] The following descriptions of the preferred embodiments are provided to understand the features and the structures of the present invention. [0018] Please refer to FIG. 1 through FIG. 4, which are a perspective view, a top view, and a view showing a status of use, according to the first embodiment of the present invention; and views showing a status of use according to a second embodiment and a third embodiment of the present invention. As shown in the figures, the present invention is a guiding fin heat sink, comprising a base 1, a heat-dissipation unit 2, more than one heat pipe 3 and a fan 4, where heat absorbed by the base 1 can be transmitted to the heat-dissipation unit 2 and the heat pipe 3 and then can be directly directed out of a computer case by the fan 4. [0019] The base 1 can be made of alumni, copper, alumni alloy or copper alloy which has better heat dissipation efficiency. Continue reading... Full patent description for Guiding fin heat sink Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Guiding fin heat sink patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Guiding fin heat sink or other areas of interest. ### Previous Patent Application: Cooling device using multiple fans and heat sinks Next Patent Application: Radially shaped heat pipe Industry Class: Heat exchange ### FreshPatents.com Support Thank you for viewing the Guiding fin heat sink patent info. IP-related news and info Results in 3.49534 seconds Other interesting Feshpatents.com categories: Daimler Chrysler , DirecTV , Exxonmobil Chemical Company , Goodyear , Intel , Kyocera Wireless , |
||
