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  Grinding mount holder assembly, apparatus and method for manufacturing a sampleUSPTO Application #: 20070184755Title: Grinding mount holder assembly, apparatus and method for manufacturing a sample Abstract: Provided are a grinding mount holder assembly and an apparatus and method for manufacturing a sample using the grinding mount holder assembly. In an embodiment, the grinding mount holder assembly includes a mount in which a sample is fitted, a holder in which the mount is inserted, and a base on which the holder is installed so that it is capable of rotating. The base has a pressing member for pressing down the mount inserted in the holder. First one surface of the sample is exposed to one or more grinding wheels for grinding and polishing. Then the sample is flipped to expose the other side to the grinding wheels by rotating the holder 180 degrees within the base, and pressing the now-flipped sample downward through the holder until it is forced against the grinding wheel. (end of abstract)
Agent: Marger Johnson & Mccollom, P.C. - Portland, OR, US Inventor: Bok-Kyoung PARK USPTO Applicaton #: 20070184755 - Class: 451 11 (USPTO) The Patent Description & Claims data below is from USPTO Patent Application 20070184755. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS-REFERENCE TO RELATED APPLICATIONS [0001]This U.S. non-provisional patent application claims priority under 35 U.S.C. .sctn.119 of Korean Patent Application No. 10-2006-12187, filed on Feb. 8, 2006, the entire contents of which are hereby incorporated by reference. BACKGROUND [0002]The embodiments disclosed herein relate to a grinding mount holder assembly, and more particularly, to a grinding mount holder assembly used for manufacturing a semiconductor sample, and an apparatus and method for manufacturing a semiconductor sample using the grinding mount holder assembly. [0003]Because the size of the semiconductor device has been greatly reduced, a transmission electronic microscope (TEM) is often widely used to analyze semiconductor device defects. To analyze the semiconductor using the TEM, a semiconductor sample for a TEM analysis must be prepared. The sample manufacturing process must be precise to process a target analyzing point of a semiconductor wafer that is very thin (e.g., 50 nm). Therefore, manufacturing the semiconductor sample for the TEM analysis requires a great deal of labor and time. Considering the rapid growth of the semiconductor industry, there is a need to quickly perform a precise process for a TEM analysis sample. [0004]In a conventional method of manufacturing the semiconductor sample for the TEM analysis, stack, cutting, grinding, dimpling, and ion-milling processes are generally performed in this order. The grinding process includes a front surface grinding process, a mirror surface polishing process, and a rear surface grinding process. That is, since the sample is ground through the front surface grinding, mirror surface polishing, and rear surface grinding processes, two mounts (one is for the front and rear surface grinding processes and the other is for the mirror surface polishing process) are necessary. In addition, since the sample moves three times in the conventional grinding process, the number of process steps increases. Therefore, according to the conventional method, a great deal of labor and time is required to manufacture the semiconductor sample for the TEM analysis. SUMMARY [0005]Embodiments presented here provide a grinding mount holder assembly that can reduce time and labor for performing a grinding process, and an apparatus and method for manufacturing a sample using the grinding process. [0006]Embodiments provide grinding mount holder assemblies having a mount holder that can rotate by 180.degree.. [0007]In other embodiments, grinding mount holder assemblies may include: a mount in which a sample is fitted; a holder in which the mount is inserted; and a base on which the holder is installed to be capable of rotating, the base having a pressing or biasing member adapted to press down the mount inserted in the holder. [0008]In some embodiments, the mount may have a space for exposing only one surface of the sample. The holder may have a space in which the mount is inserted, the space of the holder having upper and lower opened ends. The base may include a fixing part for rotatably fixing the holder. The holder may include a groove in which the fixing part is fitted. [0009]In still other embodiments, grinding mount holder assemblies may include: a cylindrical mount having a cylindrical end wall on which one of front and rear surfaces of a sample is fixed, and a cylindrical vertical wall enclosing a side surface of the sample, the mount mounting the sample so that the other of the front and rear surfaces of the sample is exposed; a cylindrical holder having a vertical wall defining a cylindrical opened space in which the mount is inserted and provided at an outer-middle portion with a groove; and a base having a cylindrical vertical wall defining a cylindrical space in which the holder is rotatably installed and having a fixing part fitted in the groove and a pressing member for pushing out the mount inserted in the cylindrical opened space of the holder. [0010]In some embodiments, the holder may have an inner diameter equal to or greater than a diameter of the mount and a height greater than that of the mount. The pressing member may be cylindrical to push the mount in the cylindrical open space of the cylindrical holder. The holder may rotate about an axis of the fixing part. The fixing part may be a screw. [0011]In still yet other embodiments, grinding mount holder assemblies may include: a mount in which a sample is fitted so that one of front and rear surfaces of the sample is exposed; a holder having an inner space having upper and lower opened ends, the mount being inserted in the inner space of the holder; a base to which the holder is rotatably screw-coupled; wherein a pressing member for pressing down the mount inserted in the holder, the pressing member being provided in the base, wherein the grinding mount holder assembly allows one of the front and rear surfaces of the sample to be ground, rotates the holder 180.degree., and allows the other surface of the front and rear surfaces of the sample to be ground without replacing the mount. [0012]In some embodiments, the holder may be cylindrical so that the mount can be inserted therein to be moveable. The holder may be cylindrical and have a height greater than that of the mount. The base may include a screw rotatably fixing the holder and the holder may be provided with a groove to which the screw is coupled. [0013]In still yet another embodiments, sample manufacturing apparatuses may include: a main body having a plurality of rotational disks; an arm installed on the main body to be capable of moving leftward and rightward; and a grinding mount holder assembly installed on an extreme end of the arm to be capable of moving frontward and rearward, the grinding mount holder assembly mounting a sample being ground by the rotation of the rotational disks and reversing front and rear surfaces of the sample. [0014]In some embodiments, the grinding mount holder assembly may include: a mount in which a sample is fitted so that one of front and rear surfaces of the sample is exposed; a holder having an inner space having upper and lower opened ends, the mount being inserted in the inner space of the holder; a base to which the holder is rotatably screw-coupled; a pressing member for pressing down the mount inserted in the holder, the pressing member being provided in the base, wherein the grinding mount holder assembly allows one of the front and rear surfaces of the sample to be ground, rotates the holder 180.degree., and allows the other surface of the front and rear surfaces of the sample to be ground without replacing the mount. [0015]In other embodiments, the base may include a screw rotatably fixing the holder, and the holder may be provided with a groove to which the screw is coupled. The holder may be cylindrical so that the mount can be inserted therein to be moveable. The holder may be cylindrical and have a height greater than that of the mount. The mount may be formed of brass. [0016]In still other embodiments, methods for manufacturing a sample may include: disposing the sample fitted in a mount inserted in a holder so that a front surface of the sample faces a lapping disk by pushing the holder using a pressing member; grinding the front surface of the sample by rotating the lapping disk; mirror-polishing the front surface of the sample; rotating the holder by 180.degree. on an axis that is perpendicular to an axis of rotation of the lapping disk after the pressing member is retracted; disposing the sample so that a rear surface of the sample faces the lapping disk by pushing the pressing member; and grinding the rear surface of the sample by rotating the lapping disk. [0017]In some embodiments, one of the grinding of the front surface and the grinding of the rear surface may use a plurality of lapping disks classified by grinding thicknesses. The grinding of the rear surface may include exposing the rear surface of the sample by grinding the mount. [0018]In yet other embodiments, methods for manufacturing a sample using a grinding mount holder include providing a mount in which the sample is fitted so that a front surface of the sample is exposed, a holder in which the mount is inserted, a base to which the holder is rotatably screw-coupled, and a pressing member on the base to press down the mount inserted in the holder. The methods may include: grinding the front surface of the sample; mirror-polishing the front surface of the sample; rotating the holder having upper and lower opened ends; rotatably screw-coupling the holder to a base; rotating the holder by 180.degree.; and grinding a rear surface of the sample without replacing the mount. [0019]According to some embodiments, since the mount holder can rotate by 180.degree., the grinding and mirror surface polishing processes for the front surface of the sample and the grinding process for the rear surface of the sample can be accomplished using only one mount. Therefore, to manufacture the sample for the TEM analysis, the grinding process is automated, thereby reducing the expended time and effort, while improving the working efficiency. BRIEF DESCRIPTION OF THE FIGURES [0020]Non-limiting and non-exhaustive embodiments will be described with reference to the following figures, wherein like reference numerals refer to like parts throughout the various figures unless otherwise specified. In the figures: Continue reading... 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