| Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity -> Monitor Keywords |
|
|
  Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticityUSPTO Application #: 20060089070Title: Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity Abstract: A copper-clad laminate of a highly-elastic glass fabric base material/thermosetting resin formed of prepreg obtained by impregnating a glass fabric base material made of a glass woven fabric having a thickness of 25 to 150 μm, a weight of 15 to 165 g/m2 and a gas permeability of 1 to 20 cm3/cm2/sec. with a thermosetting resin composition and drying it. (end of abstract) Agent: Wenderoth, Lind & Ponack, L.L.P. - Washington, DC, US Inventors: Morio Gaku, Hidenori Kimbara, Nobuyuki Ikeguchi, Masakazu Motegi USPTO Applicaton #: 20060089070 - Class: 442232000 (USPTO) Related Patent Categories: Fabric (woven, Knitted, Or Nonwoven Textile Or Cloth, Etc.), Woven Fabric (i.e., Woven Strand Or Strip Material), Including A Free Metal Or Alloy Constituent, Preformed Metallic Film Or Foil Or Sheet (film Or Foil Or Sheet Had Structural Integrity Prior To Association With The Woven Fabric) The Patent Description & Claims data below is from USPTO Patent Application 20060089070. Brief Patent Description - Full Patent Description - Patent Application Claims
FIELD OF THE INVENTION [0001] The present invention relates to a highly-elastic glass fabric base copper-clad laminate. Further, it relates to a high-density glass fabric base copper-clad laminate suitable for the formation of a remarkable small-diameter penetration hole and/or via hole by irradiation with a high-output carbon dioxide gas laser in place of a mechanical drill. A printed wiring board comprising the above copper-clad laminate is suitably used mainly for a semiconductor plastic package such as a thin and small chip scale package (CSP). PRIOR ART OF THE INVENTION [0002] A conventional base material for the thin chip scale package (CSP) is mainly selected from thin sheets formed of a glass epoxy material, a polyimide film material and a ceramic material. In packages formed of these sheets, a solder ball/solder ball distance is generally 0.8 mm. In recent years, however, it is attempted to decrease the thickness, the size and the weight of a printed wiring board. Therefore, a solder ball pitch is getting smaller and smaller, so that a line/space distance is decreasing. On this account, there is required a copper-clad laminate which has an excellent surface smoothness and is suited for the formation of a fine-line circuit. Further, a penetration hole and a via hole are coming to have a small diameter, and the holes have a diameter of 0.15 mm or less. When a hole having the above small diameter is made, the problem is that the drill bents or breaks at a hole-forming time or that the processing speed is low due to the small diameter of the drill, which results in problems in productivity and reliability. Further, when there is employed a method in which holes having the same size are made in copper foils on front and reverse surfaces through negative films according to a predetermined method and a through hole reaching the front and reverse surfaces is made with a carbon dioxide gas laser, the problem is that the positions of the holes on the upper and lower surfaces deviate from each other so that it is difficult to form lands. [0003] In a conventional method, when a via hole is made in a thermosetting resin copper-clad laminate of a glass fabric base material, a copper foil on a surface is removed by etching in advance and the via hole is made by irradiation with a low-output carbon dioxide gas laser energy. In this method, however, the problem is that fluffing remains on the wall of the via hole. In addition, the above method includes the precedent step of removing the copper foil by etching, so that workability is poor. When a hole is made with a high-output carbon dioxide gas laser energy, the processing rates of the resin layer and glass layer of a hole wall differ from each other so that the roughness of the hole wall becomes large, which impair the quality of the hole. SUMMARY OF THE INVENTION [0004] It is an object of the present invention to provide a glass fabric base material/thermosetting resin copper-clad laminate which is excellent in the smoothness of a surface, has a high elasticity and is almost free from a distortion and a warpage. [0005] It is another object of the present invention to provide a glass fabric base material/thermosetting resin copper-clad laminate having a high elasticity, in which each insulation layer has a thickness of 30 to 150 .mu.m. [0006] It is further another object of the present invention to provide a glass fabric base material/thermosetting resin copper-clad laminate in which a small-diameter hole, of which the wall is highly reliable, can be formed with a high-output carbon dioxide gas laser at a high rate. [0007] According to the present invention, there is provided a copper-clad laminate of a highly-elastic glass fabric base material/thermosetting resin formed of prepreg obtained by impregnating a glass fabric base material made of a glass woven fabric having a thickness of 25 to 150 .mu.m, a weight of 15 to 165 g/m.sup.2 and a gas permeability of 1 to 20 cm.sup.3/cm.sup.2/sec. with a thermosetting resin composition and drying it. [0008] According to the present invention, further, there is provided a copper-clad laminate of a highly-elastic glass fabric base material/thermosetting resin according to the above, wherein the thermosetting resin composition contains an insulating inorganic filler in an amount of 10 to 80% by weight based on the above resin composition. [0009] According to the present invention, further, there is provided a copper-clad laminate of a highly-elastic glass fabric base material/thermosetting resin according to the above, wherein the prepreg has a glass content of 25 to 70% by weight. [0010] According to the present invention, further, there is provided a copper-clad laminate of a highly-elastic glass fabric base material/thermosetting resin according to the above, wherein a glass fabric base material/thermosetting resin layer of the copper-clad laminate has a thickness of 30 to 150 .mu.m. [0011] According to the present invention, further, there is provided a copper-clad laminate of a highly-elastic glass fabric base material/thermosetting resin according to the above, wherein the thermosetting resin composition is a resin composition containing, as an essential component, a polyfunctional cyanate ester and a prepolymer of said polyfunctional cyanate ester. DETAILED DESCRIPTION OF THE INVENTION [0012] The present invention relates to a highly-elastic glass fabric base material/thermosetting resin copper-clad laminate having at least one copper foil layer and laminate-formed by the use of prepreg obtained by impregnating a glass fabric base material particularly suitable for producing a thin, small and lightweight printed wiring board with a thermosetting resin composition. There have been found the following. When a glass woven fabric having a thickness of 25 to 150 .mu.m, a weight of 15 to 165 g/m.sup.2 and a gas permeability of 1 to 20 cm.sup.3/cm.sup.2/sec. is used as the above base material to prepare a copper-clad laminate having at least one copper foil layer, the laminate is excellent in surface-smoothness and has a high elasticity. And, when a hole having a small diameter is made in the laminate with a high-energy carbon dioxide gas laser, a hole wall in the laminate is uniform. [0013] Further, there is provided a copper-clad laminate which is further excellent in elasticity and excellent in the quality of the wall of a small-diameter hole formed with a carbon dioxide gas laser due to the incorporation of an insulating inorganic filler into the thermosetting resin composition. It is further found that when a polyfunctional cyanate ester or a prepolymer of said cyanate ester as a thermosetting resin is used as an essential component, an obtained copper-clad laminate is excellent in electric insulation properties after moisture absorption, anti-migration properties and heat resistance. Further, the hole can be made in not only a double-side copper-clad laminate but also in a multi-layered laminate obtained by the use of the same resin composition. These copper-clad boards may be preferably used even when a hole is directly made with a YAG (UV) laser. [0014] As a base material for the glass fabric base copper-clad laminate, a glass woven fabric having a thickness of 25 to 150 .mu.m, a weight of 15 to 165 g/m.sup.2 and a gas permeability of 1 to 20 cm.sup.3/cm.sup.2/sec. is provided. An insulating inorganic filler is added to a thermosetting resin such that the thermosetting resin composition preferably has an insulating inorganic filler content of 10 to 80% by weight, more preferably 20 to 70% by weight, and the resultant mixture is uniformly mixed. Further, a polyfunctional cyanate ester or a prepolymer of said cyanate ester as a thermosetting resin is used as an essential component, whereby the laminate itself of the copper-clad laminate increases in elasticity and the occurrence of a distortion, etc., is prevented when it is used for a particularly thin printed wiring board. In the formation of a hole with a carbon dioxide gas laser, there can be formed a small-diameter penetration hole and/or a via hole, of which the wall is uniform. And, there is obtained a copper-clad laminate which is excellent in heat resistance, electric insulation properties after moisture absorption, and anti-migration properties. [0015] The double-side copper-clad laminate or copper-clad multi-layered board obtained by according to the present invention is a double-side copper-clad board having a uniform structure and composition, in which a glass woven fabric is used as a base material, and the thermosetting resin composition preferably contains 10 to 80 wt %, more preferably 20 to 70% by weight, of an inorganic insulating filler. [0016] The base material can be generally selected from woven fabrics of known glass fibers. Specifically, the glass fibers include generally known glass fibers such as E, S, D, N, T and quartzes. While the weaving method thereof can be selected from known methods, a plain weaving, a mat weaving and a twill weaving are preferably used. Woven fabrics obtained by an opening of a fabric prepared by any one of these weaving methods are preferably used. The glass woven fabrics are selected from glass woven fabrics having a thickness of 25 to 150 .mu.m, a weight of 15 to 165 g/m.sup.2 and a gas permeability of 1 to 20 cm.sup.3/cm.sup.2/sec. [0017] The resin of the thermosetting resin composition used in the present invention can be selected from generally known thermosetting resins. Specific examples thereof include an epoxy resin, a polyfunctional cyanate ester resin, a polyfunctional maleimide-cyanate ester resin, a polyfunctional maleimide resin and an unsaturated-group-containing polyphenylene ether resin. These resins are used alone or in combination. In view of the form of a through hole formed by processing by the irradiation with a high-output carbon dioxide gas laser, the use of a thermosetting resin composition having a glass transition temperature of 150.degree. C. or more is preferred. In view of humidity resistance, anti-migration properties and electric characteristics after moisture absorption, the use of a polyfunctional cyanate ester resin composition is preferred. [0018] A polyfunctional cyanate ester compound which is a thermosetting resin component in the present invention refers to a compound having at least 2 cyanato groups per molecule. Specific examples thereof include 1,3- or 1,4-dicyanatobenzene, 1,3,5-tricyanatobenzene, 1,3-, 1,4-, 1,6-, 1,8-, 2,6- or 2,7-dicyanatonaphthalene, 1,3,6-tricyanatonaphthalene, 4,4-dicyanatobiphenyl, bis(4-dicyanatophenyl)methane, 2,2-bis(4-cyanatophenyl)propane, 2,2-bis(3,5-dibromo-4-cyanatophenyl)propane, bis(4-cyanatophenyl)ether, bis(4-cyanatophenyl)thioether, bis(4-cyanotophenyl)sulfone, tris(4-cyanatophenyl)phosphite, tris(4-cyanatophenyl)phosphate, and cyanates obtained by reacting novolak with cyan halide. [0019] Besides the above compound, the above resin can be also selected from polyfunctional cyanate ester compounds disclosed in Japanese Patent Publications Nos. 41-1928, 43-18468, 44-4791, 45-11712, 46-41112 and 47-26853 and JP-A 51-63149. Further, there may be used a prepolymer having a molecular weight of 400 to 6,000 and having a triazine ring formed by trimerizing cyanato group of any one of these polyfunctional cyanate ester compounds. The above prepolymer is obtained by polymerizing the above polyfunctional cyanate ester monomer in the presence of an acid such as a mineral acid or a Lewis acid, a base such as sodium alcoholate or tertiary amine, or a salt such as sodium carbonate, as a catalyst. The prepolymer partially contains unreacted monomer and is in the form of a mixture of a monomer and a prepolymer, and the prepolymer in the above form is suitably used in the present invention. When the above resin is used, generally, the resin is dissolved in an organic solvent in which it is soluble. [0020] The epoxy resin can be selected from generally known epoxy resins. Specifically, it includes a liquid or solid bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a phenol novolak type epoxy resin, a cresol novolak type epoxy resin, an alicyclic epoxy resin, a polyepoxy compound obtained by epoxidi zing the double bond of butadiene, pentadiene, vinylcyclohexene or dicyclopentyl ether, a polyol, and a polyglycidyl compound obtained by a reaction between a hydroxyl-group-containing silicone resin and epohalohydrin. These resins may be used alone or in combination. Continue reading... Full patent description for Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity or other areas of interest. ### Previous Patent Application: Simulated rip stop fabrics Next Patent Application: Method of forming multi-colored composite by pinsonic embossing Industry Class: Fabric (woven, knitted, or nonwoven textile or cloth, etc.) ### FreshPatents.com Support Thank you for viewing the Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity patent info. IP-related news and info Results in 0.28692 seconds Other interesting Feshpatents.com categories: Medical: Surgery , Surgery(2) , Surgery(3) , Drug , Drug(2) , Prosthesis , Dentistry |
||
