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  Fluidized bed cooler for electronic componentsUSPTO Application #: 20060070723Title: Fluidized bed cooler for electronic components Abstract: A fluidized bed cooler comprises a blower and a heatsink with a base and heat exchanging means. The blower comprises an electric drive with a stator and a rotor, an impeller and a casing with blower inlet and outlet. The base made as a heat spreader with a plate and provides a thermal contact with the electronic components and the heat exchanging means. The heat exchanging means are surrounded by a housing thus forms a fluidized bed chamber with inflow and outflow side openings. The fluidized bed chamber partially filled up with particulate solids and covered from both openings by intake and outtake grilled structures. The blower hydraulically connected by the inlet with the outflow side opening, so cooling gas flows through the inflow side opening, the fluidized bed chamber thus fluidizing the particulate solids, the outflow side opening, the blower inlet, the impeller and the blower outlet. (end of abstract)
Agent: Edward Lopatinsky - San Diego, CA, US Inventors: Edward Lopatinsky, Lev Fedoseyev USPTO Applicaton #: 20060070723 - Class: 165104160 (USPTO) Related Patent Categories: Heat Exchange, Intermediate Fluent Heat Exchange Material Receiving And Discharging Heat, Solid Fluent Heat Exchange Material, Fluidized Bed The Patent Description & Claims data below is from USPTO Patent Application 20060070723. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS REFERENCE TO RELATED APPLICATIONS [0001] The present application claims the benefit of priority of U.S. Provisional Patent Application No. 60/615,004, filed 10/02/2004 for Edward Lopatinsky and Lev Fedoseyev the entire content of which is incorporated herein by reference. FIELD OF THE INVENTION [0002] The present invention relates generally to heat exchange apparatuses using fluidized bed technology. More particularly, the present invention relates to active type coolers for cooling of electronic devices. The present invention is particularly, but not exclusively, useful for cooling systems for regulating the temperature of electronic components of desktop computers. BACKGROUND OF THE INVENTION [0003] The regulation of the temperature due to heat generated inside the housing of an electronic device is an important consideration during the design of an electronic device. Cooling is important because if left unchecked, heat can cause electronic devices to malfunction during use or lead to premature device failure. As improvements in processor size and speed occur, the amount of heat generated by the larger and faster processors also increases. Additionally, improved processors require larger power supplies and auxiliary components that generate increased amounts of heat and require improved systems for heat removal. [0004] Another factor that aggravates the need for improved heat removal cooling systems is the trend towards making computing devices smaller. The trend toward smaller electronic devices having larger, faster processors renders the traditional heat removal cooling systems inadequate for several reasons. [0005] In order to enhance the cooling capacity of a cooling device, an electrically powered blowers of different types such as axial, radial or crossflow are often mounted within or on top of a heatsink of the cooling device. In operation, the blower forces air to pass over fins of the heatsink, thus, cooling the heatsink by enhancing the heat transfer from the fins into the ambient air. [0006] There are known devices of these types. For example, U.S. Pat. No. 6,698,505 "Cooler for an Electronic Device" comprises a crossflow blower, No. 6,152,214 "Cooling Device and Method" comprises an axial blower and No. 6,244,331 "Heatsink with Integrated Blower for Improved Heat Transfer" and No. 6,664,673 "Cooler for Electronic Devices" comprise a radial blower. [0007] Due to the modern requirements for cooling devices, especially in respect to a combination of the thermal efficiency and an available space, the further enhancement of the cooling efficiency providing by the increasing of the blower supplied power (airflow increasing) and/or by the sufficient developing of the heat exchanging surface of the heatsink. [0008] However, mentioned increasing of the supplied power and the heat exchanging surface became in contradiction with the modern requirements for cooling devices. On the one hand, according to the requirements the supplied power is limited. And on the other hand, the increasing of the heat exchanging surface of the heatsink leads to the increasing of the volume and/or mass properties of the cooling devices and exceed the space limitations. [0009] The other way to increase sufficiently the thermal efficiency of cooling devices is the use one of heat exchange intensification methods such as fluidized bed technology. [0010] The fluidized bed (including miniaturized) technology is widely used commercially in chemical, pharmaceutical, food and other fields of industry. Usually fluidized bed technology used for drying, coating, mixing and heating/cooling a product powder. [0011] There are known devices and apparatuses using fluidizing bed technology, for example, U.S. Pat. No. 5,954,000 "Fluid Bed Ash Cooler", No. 6,214,065 "Method of Operating a Fluidized Bed Reactor System, and Fluidized Bed Reactor System" and No. 6,451,274 "Depleted UF.sub.6 Processing Plant and Method for Processing Depleted UF.sub.6". [0012] All mentioned devices comprise a fluidized bed chamber partially filled up with particulate solids and a source of airflow. When an air is passed upwards through a bed of particles a point is reached when the upward drag force exerted by the air on the particles is equal to the apparent weight of particles in the bed. At this point the particles are lifted by the air, the separation of the particles increases, and the bed becomes fluidized. But, there are non known designs of coolers for electronic components using fluidized bed technology. [0013] It would be desirable for the given space provide the fluidized bed cooler for electronic components that would overcome these problems associated with the contradiction between the necessity of further enhancement of the cooling efficiency of cooling devices and compliance with the space limitations at the same time. SUMMARY OF THE INVENTION [0014] Accordingly, it is an object of the present invention to provide a fluidized bed cooler for electronic components, which is capable to improve significantly the thermal efficiency of cooling devices. [0015] In order to achieve this task, the fluidized bed cooler for electronic components comprises a blower and a heatsink with a base and heat exchanging means. The blower comprises an electric drive with a stator and a magnetized rotor, an impeller and a casing with blower inlet and outlet. The base is made as a heat spreader with a plate and providing a thermal contact with the electronic components and the heat exchanging means. The heat exchanging means are surround by a housing thus forms a fluidized bed chamber with inflow and outflow side openings. The fluidized bed chamber partially filled up with particulate solids and covered from both openings by intake and outtake grilled structures. The blower hydraulically connected by the inlet with the outflow side opening, so cooling gas flows through the inflow side opening, the fluidized bed chamber thus fluidizing the particulate solids, the outflow side opening, the blower inlet, the impeller and the blower outlet in a series way. [0016] The heat exchanging means are spaced apart from each other at a distance of at least 20 mean sizes of the particulate solids. [0017] There are two embodiments of the present invention. First, heat exchanging means may be made as parallel vertical located fins surrounding by a box-shaped housing. For this embodiment there are two options of the base plate location. According to the first option the plate is located horizontally at a bottom part of the cooler thus serving for horizontal located electronic components. And, according to the second option, the plate is located vertically at a side part of the cooler thus serving for vertical located electronic components. [0018] According to the second embodiment of the present invention, the heat exchanging means are made as radial vertical located fins surrounding by a cylinder-shaped housing. There are two options of the base plate location, also. First, the plate is located horizontally at a bottom part of the cooler thus serving for horizontal located electronic components. And second, the plate may locate vertically at a side part of the cooler thus serving for vertical located electronic components. [0019] The heat exchanging means and the housing may further comprise electro-magnetic coils with a controller creating an alternating motive electromagnetic field and the particulate solids are made from magnetizable material thus the particulate solids realizing a recirculation motion inside the fluidized bed chamber. [0020] The foregoing and other objectives, features and advantages of the invention will be more readily understood upon consideration of the following detailed description of the invention, taken in conjunction with the accompanying drawings. Continue reading... Full patent description for Fluidized bed cooler for electronic components Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Fluidized bed cooler for electronic components patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. 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