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  Flat plate heat transfer deviceUSPTO Application #: 20070068656Title: Flat plate heat transfer device Abstract: Disclosed is a flat plate heat transfer device, which includes a thermal-conductive flat case installed between a heat source and a heat emitting unit and containing a working fluid which is evaporated with absorbing heat from the heat source and is condensed with emitting heat to the heat emitting unit; and one layer of mesh installed in the flat case and configured so that wires are woven to be alternately crossed up and down. A dispersion channel of a vapor is formed along a surface of the wire from a cross point of the mesh near the heat source, and a flow channel of a liquid is formed by means of a capillary phenomenon along a length direction of the wire from a mesh lattice near the heat emitting unit to a mesh lattice near the heat source. (end of abstract) Agent: Jones Day - New York, NY, US Inventors: Yong-Duck Lee, Young-Ho Hong, Min-Jung Oh, Hyun-Tae Kim USPTO Applicaton #: 20070068656 - Class: 165104260 (USPTO) Related Patent Categories: Heat Exchange, Intermediate Fluent Heat Exchange Material Receiving And Discharging Heat, Liquid Fluent Heat Exchange Material, Utilizing Change Of State, Utilizing Capillary Attraction The Patent Description & Claims data below is from USPTO Patent Application 20070068656. Brief Patent Description - Full Patent Description - Patent Application Claims
TECHNICAL FIELD [0001] The present invention relates to a flat plate heat transfer device capable of transferring heat by means of a working fluid circulating mechanism using evaporation and condensation without applying a separate mechanical energy, and more particularly to an improved flat plate heat transfer device capable of having a thinner structure and preventing transformation caused by an external impact. BACKGROUND ART [0002] In recent, an electronic equipment such as notebook or PDA becomes smaller and thinner along with the development of integration technique. In addition, together with the increased demands for high response of an electronic equipment and improvement of functions, energy consumption is also tending increased. Accordingly, much heat is generated from electronic parts in the electronic equipment while the equipment is operated, so various flat plate heat transfer devices are used to emit the heat outside. [0003] A traditional example of the conventional flat plate heat transfer device is a heat pipe in which a flat metal case is decompressed to a vacuum and then a working fluid is injected and sealed therein. [0004] The heat pipe is installed so that it is partially in contact with an electronic part generating heat (or, a heat source). In this case, a working fluid near the heat source is heated and evaporated, and is then dispersed to a region with a relatively lower temperature. And then, the vapor is condensed into a liquid again with emitting heat outside, and then returns to its initial position. By means of such working fluid circulating mechanism conducted in the flat metal case, the heat generated in the heat source is emitted outside, and the temperature of the electronic part may be kept in a suitable level accordingly. [0005] FIG. 1 shows that a conventional flat plate heat transfer device 10 is installed between a heat source 20 and a heatsink 30 to transfer heat from the heat source 20 to the heatsink 30. [0006] Referring to FIG. 1, the conventional flat plate heat transfer device 10 has a metal case 50 whose inner space 40 is filled by a working fluid. On an inner side of the metal case 50, a wick structure 60 is formed for providing an efficient working fluid circulating mechanism. [0007] The heat generated in the heat source 20 is transferred to the wick structure 60 in the flat plate heat transfer device 10 contacted with the heat source 20. Then, the working fluid contained at the wick structure 60 (that is acting as `an evaporating part`) approximately right above the heat source 20 is evaporated and dispersed in all directions through the inner space 40, and the working fluid is then condensed again after emitting heat at the wick structure 60 (that is acting as `a condensing part`) approximately right below the heatsink 30. The heat emitted in the condensation step is transferred to the heatsink 30, and then discharged out by means of the forced convection by a fan 70. [0008] In order to realize the aforementioned heat transfer mechanism in the flat plate heat transfer device 10, a liquid should absorb heat in the evaporating part right above the heat source 20 to be evaporated, and then move to the condensing part again. Thus, the flat plate heat transfer device 10 should basically has a sufficient space therein where the vapor may be dispersed to the condensing part. If there is no sufficient space for the working fluid to be dispersed from the evaporating part to the condensing part, the heat transfer mechanism using evaporation and condensation of the working fluid may be not appropriately realized, thereby deteriorating the performance of the heat transfer device. [0009] Meanwhile, as the thickness of the electronic equipment recently becomes smaller in recent years, a small thickness is also required for the flat plate heat transfer device. However, since the conventional flat plate heat transfer device 10 keeps its inside vacuous (or, decompressed) and does not adopt a mechanical structure capable of enduring an external impact, the metal case 50 is apt to be crushed by a trivial impact while the device is manufactured or handled, which resultantly transforms a vapor dispersion channel, thereby deteriorating a heat transfer characteristic of the product. Accordingly, the conventional flat plate heat transfer device 10 has a limitation in satisfying the current demands for a thinner structure. DISCLOSURE OF INVENTION [0010] The present invention is designed to solve the problems of the prior art, and therefore it is an object of the present invention to provide a flat plate heat transfer device with an improved inner structure, which is capable of becoming thinner with keeping the heat transfer mechanism using evaporation and condensation of a working fluid as it was, and preventing the device from being transformed by an impact possibly applied while the device is manufactured or handled. [0011] In order to accomplish the above object, the present invention provides a flat plate heat transfer device, which includes a thermal-conductive flat case installed between a heat source and a heat emitting unit and containing a working fluid which is evaporated with absorbing heat from the heat source and is condensed with emitting heat to the heat emitting unit; and one layer of mesh installed in the flat case and configured so that wires are woven to be alternately crossed up and down, wherein a dispersion channel of a vapor is formed along a surface of the wire from a cross point of the mesh near the heat source, and a flow channel of a liquid is formed by means of a capillary phenomenon along a length direction of the wire from a mesh lattice near the heat emitting unit to a mesh lattice near the heat source. [0012] Preferably, the mesh is a screen mesh with a mesh number of 10 to 60. [0013] It is also preferable that the mesh is woven by wires with a diameter of 0.12 mm to 0.4 mm. [0014] In addition, the thermal-conductive flat case preferably has a height of 0.3 mm to 1.0 mm. [0015] In case the mesh is a screen mesh, it is preferred that a length direction of a lengthwise wire among the wires is identical to a direction in which heat transfer is conducted. [0016] In case the thermal-conductive flat case is made of electrolytic copper foil, an uneven surface of the electrolytic copper foil is preferably configured as an inner side of the flat case. [0017] The mesh is made of one selected from the group consisting of metal, polymer, plastic and glass fiber. Here, the metal may be selected from the group consisting of copper, aluminum, stainless steel, molybdenum, and their alloys. [0018] The flat case is made of one selected from the group consisting of metal, conductive polymer, metal coated with conductive polymer, and conductive plastic. Here, the metal may be selected from the group consisting of copper, aluminum, stainless steel, molybdenum, and their alloys. [0019] The flat case may be sealed using a manner selected from the group consisting of laser welding, plasma welding, TIG (Tungsten Inert Gas) welding, ultrasonic welding, brazing, soldering, and thermo-compression lamination. [0020] The working fluid may be selected from the group consisting of water, methanol, ethanol, acetone, ammonia, CFC working fluid, HCFC working fluid, HFC working fluid, and their mixture. BRIEF DESCRIPTION OF THE DRAWINGS Continue reading... Full patent description for Flat plate heat transfer device Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Flat plate heat transfer device patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Flat plate heat transfer device or other areas of interest. ### Previous Patent Application: Heat transfer device Next Patent Application: Sheet -shaped heat pipe and method of manufacturing the same Industry Class: Heat exchange ### FreshPatents.com Support Thank you for viewing the Flat plate heat transfer device patent info. IP-related news and info Results in 8.64718 seconds Other interesting Feshpatents.com categories: Software: Finance , AI , Databases , Development , Document , Navigation , Error |
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