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09/13/07 - USPTO Class 075 | 40 views | #20070209475 | Prev - Next | About this Page

Flaky copper powder, method for producing the same, and conductive paste

Title: Flaky copper powder, method for producing the same, and conductive paste

Related Patent Categories: Specialized Metallurgical Processes, Compositions For Use Therein, Consolidated Metal Powder Compositions, And Loose Metal Particulate Mixtures, Compositions, Loose Particulate Mixture (i.e., Composition) Containing Metal Particles

Brief Patent Description - Full Patent Description - Patent Claims

The Patent Description & Claims data below is from USPTO Patent Application 20070209475, Flaky copper powder, method for producing the same, and conductive paste.

1. A flaky copper powder which is characterized in that comprising P.

2. The flaky copper powder according to claim 1 which is characterized in that comprising P at 10 to 200 ppm.

3. The flaky copper powder according to claim 1, which is characterized in that an average particle diameter D.sub.50 of the powder is in the range from 0.3 .mu.m to 7 .mu.m.

4. The flaky copper powder according to claim 1, which is characterized in that crystallite diameter of the powder is 25 nm or more.

5. The flaky copper powder according to claim 1 which is characterized in that an aspect ratio D.sub.1A/t of the powder, which is calculated by dividing an average particle diameter D.sub.1A (.mu.m) by a flaky copper particle thickness t (.mu.m), the average particle diameter D.sub.1A (.mu.m) and the thickness t (.mu.m) are measured from analyzing SEM images directly observed by a scanning electron microscope, is in the range from 2 to 50.

6. The flaky copper powder according to claim 1 characterized by having an SD/D.sub.50 ratio of 0.45 or less, (where D.sub.50 is a median diameter (.mu.m) calculated as 50% of volume cumulative distributions examined by a laser diffraction scattering particle size distribution measuring method).

7. The flaky copper powder according to claim 1 which is characterized in that D.sub.90/D.sub.10 ratio of 3.0 or less, (where D.sub.10 is diameter (.mu.m) at 10% of volume cumulative distributions and D.sub.90 is diameter (.mu.m) at 90% of volume cumulative distributions examined by a laser diffraction scattering particle size distribution measuring method, and SD is a standard deviation (.mu.m) of a particle size distribution examined by the same measuring method respectively).

8. A method for producing a flaky copper powder comprising four steps: a first step of preparing an aqueous solution comprising a copper salt and a complexing agent; a second step of adding an alkali hydroxide to the aqueous solution to prepare a first slurry comprising cupric oxide; a third step of adding a first reducing agent which can reduce cupric oxide into cuprous oxide to the first slurry to prepare a second slurry comprising cuprous oxide; and a fourth step of adding a second reducing agent which can reduce the cuprous oxide into copper to the second slurry to provide a flaky copper powder, which is characterized in that phosphoric acid and its salt are added in at least one of the first to third steps and/or phosphoric acid and its salt are added in the second slurry in the fourth step.

9. The method for producing a flaky copper powder according to claim 8, which is characterized in that the phosphoric acid and its salt are added in at least one of the first to third steps and/or in the second slurry in the fourth step to be a total amount of 0.001 to 3 moles as P per 1 mole of copper which present in the above described aqueous solution, the first slurry or the second slurry.

10. The method for producing a flaky copper powder according to claim 8, which is characterized in that the first slurry contains the alkali hydroxide at 1.05 to 1.50 equivalents per equivalent of the copper salt.

11. The method for producing a flaky copper powder according to claim 8, which is characterized in that the complexing agent is an amino acid.

12. The method for producing a flaky copper powder according to claim 8, which is characterized in that the first reducing agent is a reducing sugar.

13. The method for producing a flaky copper powder according to claim 8, which is characterized in that the second reducing agent is at least one selected from the group consisting of hydrazine, hydrated hydrazine, hydrazine sulfate, hydrazine carbonate and hydrazine chloride.

14. The method for producing a flaky copper powder according to claim 8, which is characterized in that the aqueous solution comprises the complexing agent at 0.005 to 10 moles per 1 mole of copper present in the aqueous solution itself, the first slurry or the second slurry.

15. The flaky copper powder according to claim 1, which is characterized in that an organic surface treatment layer is formed on the surface.

16. The flaky copper powder according to claim 15, which is characterized in that a coating rate of the organic surface treatment layer is 0.05 to 2 wt % based on the flaky copper powder.

17. A conductive paste comprising the flaky copper powder according to claim 1 and a resin.

Brief Patent Description - Full Patent Description - Patent Claims

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