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  Film peeling apparatus and method of manufacturing wiring boardUSPTO Application #: 20060076104Title: Film peeling apparatus and method of manufacturing wiring board Abstract: A film peeling apparatus including a board support section 41, a hole forming jig 51, a punch unit 21, and a film peeling mechanism. The board support section 41 supports a board 15 to which an inter-layer insulating film and carrier film has been bonded, the carrier film being arranged on a side of the insulating material opposite the board. The hole forming jig 51 has needles 57 serving as a tip-sharpened member. The needles 57 pierce a peripheral portion of the carrier film so as to form through holes. The punch unit 21 drives the hole forming jig 51 so as to piercing the carrier film by use of the needles 57. The film peeling mechanism peels off the carrier film, starting from air pockets formed around the through holes. Also disclosed is a method of manufacturing a wiring board having an insulating layer, which includes a step of peeling a carrier film from a board to which the insulating material and carrier film has been bonded. (end of abstract) Agent: Sughrue Mion, PLLC - Washington, DC, US Inventor: Masashi Inaishi USPTO Applicaton #: 20060076104 - Class: 156249000 (USPTO) The Patent Description & Claims data below is from USPTO Patent Application 20060076104. Brief Patent Description - Full Patent Description - Patent Application Claims
BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a film peeling apparatus for peeling a carrier film from a board to which an insulating material and associated carrier film has been bonded, and a method of manufacturing a wiring board which includes a step of peeling a carrier film from a board to which an insulating material and associated carrier film has been bonded. [0003] 2. Description of the Related Art [0004] Conventionally, a process of manufacturing a build-up multi-layer wiring board includes a step of bonding an insulating material to a surface of a board. Examples thereof include laminating a photosensitive resist film on the surface of the board and laminating an inter-layer film formed of a photosensitive or thermosetting insulating material on the surface of the board. In general, the outer surface of the insulating material is covered with a carrier film made of PET (polyethylene terephthalate). Accordingly, in order to begin processing of the bonded insulating material, the carrier film must be peeled from the surface of the insulating material in advance. [0005] Proposed methods for pealing off such a carrier film include a method of contacting a tacky member such as a tacky roller with a carrier film and peeling off the carrier film in this state, and a method of jetting air against a clearance between a carrier film and an insulating material and pulling off the carrier film by means of force of the air. [0006] In another proposed method for pealing off a carrier film, a portion (pealing initiation portion) where the carrier film is lifted from an insulating material is formed in a peripheral portion of the carrier film, and the carrier film is peeled off from the pealing initiation portion. In one proposed method of forming such a pealing initiation portion, a knurling roll is moved along the surface direction of a carrier film, while being rotated, so as to damage the carrier film and thereby form a pealing initiation portion (see, for example, Patent Document 1). In another proposed method of forming such a pealing initiation portion, a film pressing member is moved along the surface direction of a carrier film so as to lift the carrier film and thereby form a pealing initiation portion (see, for example, Patent Document 2). [0007] [Patent Document 1] Japanese Patent Application Laid-Open (kokai) No. 2000-86080 (FIG. 1, etc.) [0008] [Patent Document 2] Japanese Patent Application Laid-Open (kokai) No. H10-324454 (FIG. 2, etc.) [0009] 3. Problems to be Solved by the Invention [0010] However, in the case where a tacky member or air is used (i.e., the case in which a pealing initiation portion is not formed), a carrier film is peeled off in a state in which the entire carrier film closely adheres to the insulating material. In this case, because the carrier film must be peeled off against the adhesion force acting between the carrier film and the insulating material, success in peeling off the carrier film is low. [0011] Meanwhile, in the case where a knurling roll or a film pressing member is moved along the surface direction of a carrier film, the carrier film is peeled off from a pealing initiation portion. At the pealing initiation portion, no adhesion force acts between the carrier film and the insulating material, and therefore, the carrier film is more likely to be peeled off as compared with the case where a pealing initiation portion is not formed. However, if an excessively large force acts on the carrier film when the knurling roll or the film pressing member is moved, the carrier film may be torn to a considerable extent from that portion. As a result, a portion of the carrier film remains on the insulating material without being peeled off. [0012] In addition, if the force acting on the carrier film is excessively strong, the possibility of the insulating material and/or the board being damaged becomes high, resulting in a decrease in yield. Moreover, the insulating material is formed of a fragile material which collapses when it is damaged only slightly. Therefore, the possibility of a portion of the insulating material collapsing to generate debris is high. In addition, if such debris adheres to the insulating material, the thickness of the insulating material becomes non-uniform, which is a cause of reduced yield. SUMMARY OF THE INVENTION [0013] The present invention has been accomplished in view of the above problems of the prior art, and an object of the invention is to provide a film peeling apparatus and a method of manufacturing a wiring board, which apparatus and method can peel off a carrier film at a high success rate while maintaining high yield. [0014] The above objects of the present invention have been achieved by providing a film peeling apparatus for peeling a carrier film from a board to which an insulating material and carrier film has been bonded, the carrier film being arranged on a side of the insulating material opposite the board, the apparatus comprising a board support section for supporting the board; a hole forming jig having a tip-sharpened member for piercing a peripheral portion of the carrier film so as to form a through hole; jig drive means for driving the hole forming jig so as to pierce the carrier film by means of the tip-sharpened member; and a peeling mechanism for peeling off the carrier film, starting from an air pocket formed around the through hole. Notably, a needle or the like is preferably used as the tip-sharpened member. [0015] Accordingly, in the film peeling apparatus, before the carrier film is peeled off, the hole forming jig is driven so as to pierce the carrier film by use of the tip-sharpened member such as a needle to form a through hole. An air pocket can be formed around the through hole upon removal of the tip-sharpened member from the carrier film. Since no adhesive force acts between the insulating material and the portion of the carrier film where the air pocket is formed, the film peeling mechanism can readily peel off the carrier film, starting from the air pocket. Therefore, the carrier film can be peeled off at a higher success rate than in the case where a through hole is not formed. [0016] In addition, the through hole is not formed by moving the tip-sharpened member, such as a needle, along the surface direction of the carrier film, but rather by driving the hole forming jig so as to pierce the carrier film by means of the tip-sharpened member. Therefore, an area in which the insulating material or the board is damaged by the tip-sharpened member, such as a needle, can be reduced, and lowering of yield can be suppressed. In addition, because the degree of damage to the insulating material decreases, generation of debris due to adulteration of a portion of the insulating material can be suppressed. Therefore, it is possible to suppress lowering of yield caused by the adverse effects of such debris on the insulating material. [0017] The tip-sharpened member refers to a member whose tip has a sharpened shape. Specific examples thereof include a needle and a cutting tool or cutlery such as a knife. That is, the member may assume a bar-like shape or a plate-like shape as a whole, so long as its tip end has a sharp shape. A member having a sharpened tip can concentrate pressure at the tip end to a greater extent as compared with a member which does not have a sharpened tip, and can simply form a through hole with relatively small force. Notably, the most preferable tip-sharpened member is a needle, which can further reduce the area over which the insulating material and the board are damaged. [0018] Example materials which are preferably used to form the carrier film include paper and resin having flexibility. Among these, a material is preferably selected which does not damage the insulating material, is inexpensive, and is strong even when formed into a thin shape. Notably, resin and paper are preferred, from the viewpoint of easiness of reuse. Specific examples of the resin material for use as the carrier film include PET resin (polyethylene terephthalate resin), EP resin (epoxy resin), and PI resin (polyimide resin). [0019] The insulating material and associated carrier film can be formed, for example, by a method of applying a liquid insulating material to the carrier film. A method of laminating a film-shaped insulating material onto a carrier film may also be employed. [0020] Generally, the board is formed of a resin material or a ceramic material. Examples of the board mainly formed of a resin material include an EP resin (epoxy resin) board, a PI resin (polyimide resin) board, a BT (bismaleimide triazine resin) board, and a PPE (polyphenylene ether) board. Alternatively, a board formed of a composite material including one of these resins and glass fiber (glass woven fabric or glass nonwoven fabric) or organic fiber such as polyamide fiber may be used. Alternatively, a board formed of a resin-resin composite material which is formed of a fluorine-based resin matrix having a three-dimensional network structure, such as open-cell PTEE, which is impregnated with a thermosetting resin such as epoxy resin, may be used. Examples of the board mainly formed of a ceramic material include a board formed of alumina, aluminum nitride, boron nitride, silicon carbide, silicon nitride, or other suitable ceramic material. [0021] The board preferably forms a wiring board which has an insulating layer formed from the insulating material and associated carrier film, and semiconductor devices and other electronic components are mounted on such a wiring board. [0022] Preferably, the board support section includes a stop for holding the board in a set position when the jig drive means drives the hole forming jig. By virtue of this structure, a shift in the position of the board can be prevented. Thus, the through hole can be formed at a precise position by piercing the carrier film using a tip-sharpened member such as a needle. Further, the position of the board does not shift in a state where the tip-sharpened member such as a needle has reached the insulating material. Thus, the insulating material is not scratched by the tip-sharpened member and is hardly damaged. Continue reading... Full patent description for Film peeling apparatus and method of manufacturing wiring board Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Film peeling apparatus and method of manufacturing wiring board patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. 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