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USPTO Class 216 | Browse by Industry: Previous - Next | All Recent | 09: Oct | Sept | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | | 08: Dec | Nov | Oct | Sp | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | | 07: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | | 06: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Etching a substrate: processes inventionsRecently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.Listing format for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 11/12/2009 > patent applications in patent subcategories. 20090277866 - Method of enabling solder deposition on a substrate and electronic package formed thereby: An electronic package includes a substrate (110, 310, 510) and a solder resist layer (120, 320, 520) over the substrate. The solder resist layer has a plurality of solder resist openings (121, 321, 521) therein. The electronic package further includes a finish layer (130, 330, 535) in the solder resist... Agent: Intel Corporation C/o Cpa Global 20090277868 - Producing method of wired circuit board: A producing method of a wired circuit board includes a laminating step of preparing a metal supporting board, forming an insulating base layer on the metal supporting board, forming a conductive layer including a terminal portion and a plating lead continued from the terminal portion on the insulating base layer,... Agent: Akerman Senterfitt 20090277867 - Topography reduction and control by selective accelerator removal: Plating accelerator is applied selectively to a substantially-unfilled wide (e.g., low-aspect-ratio feature cavity. Then, plating of metal is conducted to fill the wide feature cavity and to form an embossed structure in which the height of a wide-feature metal protrusion over the metal-filled wide-feature cavity is higher than the height... Agent: Thomas Swenson 20090277869 - Solid state membrane channel device for the measurement and characterization of atomic and molecular sized samples: A solid state device is formed through thin film deposition techniques which results in a self-supporting thin film layer that can have a precisely defined channel bored therethrough. The device is useful in the chacterization of polymer molecules by measuring changes in various electrical characteristics as molecules pass through the... Agent: Dorsey & Whitney LLP Intellectual Property Department 20090277870 - Method of manufacturing magnetic head for perpendicular magnetic recording: A magnetic head includes a pole layer, and an encasing layer having a groove that accommodates the pole layer. A manufacturing method for the magnetic head includes the steps of forming a nonmagnetic layer that will later undergo formation of the groove therein and will thereby become the encasing layer;... Agent: Oliff & Berridge, PLC 20090277871 - Plasma mediated ashing processes that include formation of a protective layer before and/or during the plasma mediated ashing process: Processes for stripping high dose ion implanted photoresist while minimizing substrate loss. The processes generally include passivation of the substrate surface before and/or during a plasma mediated stripping process. By passivating the substrate surface before and/or during the plasma mediated stripping process, oxidation is substantially reduced during plasma stripping thereby... Agent: Cantor Colburn, LLP 20090277872 - Plasma etching method capable of detecting end point and plasma etching device therefor: The present invention relates to a plasma etching method in which a special area for detecting an end point needs not to be set and an equipment therefor. At an etching step of forming SF6 gas into plasma to etch an etching ground on a Si film, the step is... Agent: Westerman, Hattori, Daniels & Adrian, LLP 20090277873 - Dry etching method: The object of the present invention is to provide a dry etching method which permits the reduction of the amount of any etching product formed during the etching process to thus improve the in-plane etching uniformity with respect to an object to be etched. The dry etching method comprises the... Agent: Arent Fox LLP 20090277874 - Method and apparatus for removing polymer from a substrate: A method and an apparatus for removing polymer from a substrate are provided. In one embodiment, an apparatus utilized to remove polymer from a substrate includes a processing chamber having a chamber wall and a chamber lid defining a process volume, a substrate support assembly disposed in the processing chamber,... Agent: Patterson & Sheridan, LLP - - Appm/tx 20090277875 - Method for the determination of the surface occupation of a silica glass component: A method known in prior art for determining the occupation of the surface of a silica glass component with impurities comprises taking a sample, a process in which at least some of the surface of the silica glass component is brought in contact with an acidic desorption solution, and surface... Agent: Tiajoloff & Kelly 11/05/2009 > patent applications in patent subcategories.20090272714 - Method of forming an integrated circuit with mm-wave antennas using conventional ic packaging: A method of forming the integrated circuit. The method includes, in an integrated circuit package, forming each bond to or from an integrated circuit pad that is intended to be an antenna connection to be elongated compared to other bonds, and arranged in an approximately perpendicular direction to the plane... Agent: Dov Rosenfeld 20090272715 - Nanofabrication based on sam growth: The present invention relates to a process of nano fabrication based on nucleated SAM growth, to patterned substrates prepared thereby, to a nano wire or grid of nanowires prepared thereby and to electronic devices including the same. In particular, there is provided a process which comprises applying a first SAM-forming... Agent: Philips Intellectual Property & Standards 20090272716 - Process for preparing an optical preform: A method of preparing an optical preform includes the steps of: a) etching an optical preform to remove a portion of an oxide material deposited on the preform by using a gas comprising an etchant gas containing fluorine at a sufficient temperature and gas concentration to create a redeposited germanium... Agent: Corning Incorporated 20090272717 - Method and apparatus of a substrate etching system and process: Embodiments of the invention relate to a substrate etching system and process. In one embodiment, a method may include depositing material on the substrate during a deposition process, etching a first layer of the substrate during a first etch process, and etching a second layer of the substrate during a... Agent: Patterson & Sheridan, LLP - - Appm/tx 20090272718 - Methods for selective pre-coating of a plasma processing chamber: A method for processing a substrate in a plasma processing system is provided. The method includes disposing a first confinement ring set in a first position. The method also includes depositing a first coating on a first portion of the plasma processing system using a first plasma in a first... Agent: Ipsg, P.C. 20090272719 - System and method for pedestal adjustment: A pedestal positioning assembly system for use in a substrate processing system includes a pedestal rigidly attached to a pedestal shaft, a reference rigidly attached to the substrate processing system, a lateral adjustment assembly to adjust a lateral location of the pedestal relative to the reference, and a vertical adjustment... Agent: Townsend And Townsend And Crew LLP 20090272720 - Method and heating device for forming large grain size silicon material structure for photovoltaic devices: A method for forming polysilicon material for photovoltaic cells. A first silicon material characterized by a first purity level is provided. The first silicon material is subjected to a thermal process to transform the first silicon material to a molten state confined in a first spatial volume. The molten first... Agent: Townsend And Townsend And Crew, LLP 10/29/2009 > patent applications in patent subcategories.20090266788 - Method for fabricating conductive pattern on flexible substrate and protective ink used therein: The invention discloses a method for fabricating a conductive pattern on a flexible substrate. A flexible substrate having a conductive layer thereon is provided. A protective ink is screen printed on the conductive layer, wherein a portion of the conductive layer is exposed through the protective ink. The exposed portion... Agent: Lowe Hauptman Ham & Berner, LLP 20090266789 - Manufacturing method of heat-assisted magnetic head constituted of slider and light source unit: Provided is a manufacturing method of heat-assisted magnetic recording head, in which a light source unit can be easily joined to a slider with sufficiently high accuracy, under avoiding the excessive mechanical stress. The manufacturing method comprises the steps of: moving relatively the light source unit and the slider, while... Agent: Oliff & Berridge, PLC 20090266790 - Method of making a magnetoresistive reader structure: A method of making a magnetoresistive sensor includes defining a track width of a magnetoresistive element stack of the sensor with a hard mask and photoresist. Further, processes of the method enable depositing of hard magnetic bias material on each side of the stack after the hard mask used to... Agent: Patterson & Sheridan, L.L.P. 20090266791 - Implant surfaces and treatments for wear reduction: Methods and devices directed to surface treatment of implants are disclosed. In some instances, the surfaces are treated to have one or more characteristics that can impart low wear properties when the implant is utilized in a subject. As one example, a metallic surface of an implant can be treated... Agent: Nutter Mcclennen & Fish LLP 20090266792 - Fabrication methods for patterned structures: Fabrication methods for patterned structures are presented. A layer of material is provided and a patterned region and a non-patterned region are formed using a multiple thermal writing head, wherein the patterned region and the non-patterned region have different physical properties. Alternatively, the layer of material is formed on a... Agent: Quintero Law Office, PC 10/22/2009 > patent applications in patent subcategories.20090261060 - Production method of suspension board with circuit: A production method of a suspension board with circuit includes the steps of forming, on a metal supporting board, an insulating layer formed with a first opening, forming a metal thin film on the insulating layer and on the metal supporting board exposed from the first opening, forming, on a... Agent: Akerman Senterfitt 20090261061 - Method for preventing fencing during process of forming an air-bearing surface on a slider substrate: The invention provides a method for preventing fencing during process of forming an ABS on a slider substrate includes the steps of: (a) providing a slider substrate having a photo-resist covered thereon, the photo-resist having a plurality of trenches developed thereon, the plurality of trenches collectively defining an air bearing... Agent: Nixon & Vanderhye, PC 20090261062 - Carrier substrate and method of manufacturing flexible display apparatus using the same: Disclosed are a carrier substrate which can be recycled and a method of manufacturing a flexible display apparatus using the same. The carrier substrate includes a rigid substrate, an adhesive layer, and a sacrificial layer. The adhesive layer is formed on the rigid substrate and has an adhesive property. The... Agent: Haynes And Boone, LLPIPSection 20090261063 - Method for producing a nanostructure on a plastic surface: A nanostructure is produced at a surface of a substrate composed of a plastic by means of a plasma etching process. A thin layer is applied to the plastic substrate and the plasma etching process is subsequently carried out.... Agent: Slater & Matsil, L.L.P. 20090261064 - Process for bonding by molecular adhesion: The invention relates to a process for bonding by molecular adhesion of two substrates to one another during which the surfaces of the substrates are placed in close contact and bonding occurs by propagation of a bonding front between the substrates. The invention includes, prior to bonding, a step of... Agent: Winston & Strawn LLP Patent Department 20090261065 - Components for use in a plasma chamber having reduced particle generation and method of making: Components entirely of ceramic with etched surfaces wherein the etched surface has a surface roughness value or at least about 100 microinches (about 2.54 microns) Ra, and methods of forming such.... Agent: Buchanan, Ingersoll & Rooney PC 20090261066 - Apparatus and method for dry etching: The present invention herein provides an apparatus and a method for dry etching, which can solve such a problem that an object to be processed undergoes cracking during the etching procedures due to the heat deformation thereof and thermal shocks, possibly encountered when subjecting, to dry etching procedures, the object... Agent: Arent Fox LLP 20090261067 - Methods and apparatus for prototyping three dimensional objects from a plurality of layers: The present invention is directed to methods and apparatus for prototyping three dimensional objects from a plurality of sequential layers that satisfies the need for an inexpensive method for producing both appearance models and functional parts. The method of the present invention includes building cross sectional portions of a three... Agent: Robert A. Dietrich 20090261068 - Method for selectively removing coatings from metal substrates: A method for selectively removing an aluminum-poor overlay coating from a substrate of a component, which as a result of its low aluminum content is highly resistant to a selective stripping solution. The method entails diffusing aluminum into the overlay coating to form an aluminum-infused overlay coating having an increased... Agent: General Electric Company Global Research Previous industry: Bottles and jarsNext industry: Wooden receptacles ###### RSS FEED for 20091112: Integrate FreshPatents.com into your RSS reader/aggregator or website to track weekly updates. For more info, read this article. ###### Thank you for viewing Etching a substrate: processes patents on the FreshPatents.com website. These are patent applications which have been filed in the United States. 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