|Etching a substrate: processes patents - Monitor Patents|
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Etching a substrate: processes May archived by USPTO category 05/12Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 05/31/2012 > 10 patent applications in 10 patent subcategories. archived by USPTO category
20120132612 - Method for making grooves on a luminal surface of an intravascular stent: The invention relates to methods and apparatus for manufacturing intravascular stents wherein the intravascular stent has its inner surface treated to promote the migration of endothelial cells onto the inner surface of the intravascular stent. In particular, the inner surface of the intravascular stent has at least one groove formed... Agent: Advanced Bio Prosthetic Surfaces, Ltd., A Wholly Owned Subsidiary Of Palmaz Scientific, Inc.
20120132613 - Wafer-scale needle array: Methods for wafer-scale fabrication of needle arrays can include mechanically modifying a wafer to produce a plurality of vertically-extending columns. The columns are etched to round and reshape the columns into substantially uniformly shaped needles. Needle arrays having needle width non-uniformity of less than about 3% and length non-uniformity of... Agent:
20120132614 - Flexible electrical substrate: A flexible substrate layer haying metallic bus-lines and connecting stitches is formed. A trace layer haying electrical traces and thermal vias is also formed. The substrate layer and the trace layer are bonded together by way of respective thermal pathways and electrically interconnected. The resulting layer-wise assembly is configured to... Agent:
20120132615 - Manufacturing method of probe card: A manufacturing method for probe card according to the present invention includes following processes. A film is formed on the surface of a circuit board. A connecting terminal and joint member are formed by etching the film, and the surface of the joint member is polished. An inspection contacting structure... Agent: Tokyo Electron Limited
20120132616 - Method for making a pattern from sidewall image transfer: The substrate is provided with a layer of first material, a first etching mask, a covering layer and a second etching mask. The covering layer has a covered main area and an uncovered secondary area. The secondary area of the covering layer is partially etched via the second etching mask... Agent: Commissariat A L'energie Atomique Et Aux Energies Alternatives
20120132617 - Plasma etching apparatus and plasma etching method: A plasma etching apparatus includes a processing container, a depressurization unit, a placement unit, a discharge tube, an introduction waveguide tube, a gas supply unit, a transport tube, a detection window, a coherent light detection unit, and a control unit. The control unit is configured to detect an end point... Agent: Shibaura Mechatronics Corporation
20120132618 - Method and apparatus for modulating wafer treatment profile in uv chamber: A method and apparatus for providing a uniform UV radiation irradiance profile across a surface of a substrate is provided. In one embodiment, a substrate processing tool includes a processing chamber defining a processing region, a substrate support for supporting a substrate within the processing region, an ultraviolet (UV) radiation... Agent: Applied Materials, Inc.
20120132619 - Gas exhaust structure, and apparatus and method for plasma processing: A gas discharge structure, and a device and a method for plasma processing which are capable of a uniform gas discharge and have improved maintainability. A pendulum gate valve (15) is eccentrically mounted to a vacuum chamber (11) in such a manner that the center (Mc) of the area of... Agent: Mitsubishi Heavy Industries, Ltd.
20120132620 - Secure check code scanner: g
20120132621 - Metal etching method, metal etching control method and control device thereof: Disclosed is a metal etching method, a metal etching control method and a control device thereof. The metal etching control method is employed in a metal wet etching machine and comprises steps below: performing etching to a metal film and acquiring an etching end time of the metal film; multiplying... Agent: Shenzhen China Star Optoelectronics Technology Co. Ltd.05/24/2012 > 15 patent applications in 10 patent subcategories. archived by USPTO category
20120125879 - Method for fabricating capacitor: A method for fabricating a capacitor includes: forming a first mold layer having a first through hole on a semiconductor substrate; forming a hole blocking layer filling and blocking an entrance of the first through hole; forming a second mold layer on the hole blocking layer and the first mold... Agent: Hynix Semiconductor Inc.
20120125880 - Tools and methods for forming semi-transparent patterning masks: Means, apparatus, systems, and/or methods are described for forming improved rigid or flexible semi-transparent imprinting templates. These templates can be used to produce patterning masks having improved resolution that do not require plasma etching for residue removal. The methods and apparatus are compatible with roll-to-roll manufacturing processes and enable roll-to-roll... Agent: Microcontinuum, Inc.
20120125881 - Method of manufacturing a coordinate detector: A method of manufacturing a coordinate detector having a resistive film and a common electrode for applying a voltage to the resistive film is disclosed that includes the steps of (a) applying a photoresist onto the resistive film formed on a substrate formed of an insulator; (b) forming a resist... Agent: Fujitsu Component Limited
20120125882 - Method of making touch-sensitive device with electrodes having location pattern included therein: A method of patterning a conductor on a substrate, the conductor including a unique location indicia that may be sensed with a sensing device, and the location on the substrate determined therefrom.... Agent: 3m Innovtive Properties Company
20120125883 - Method for manufacturing a magnetic write pole using a multi-layered hard mask structure: A method for manufacturing a magnetic write pole using a mask that includes a multi-layer hard mask. The multi-layer hard mask hard mask includes a first hard mask layer that is constructed of a Si containing material that can be spun on and a second hard mask material that is... Agent: Hitachi Global Storage Technologies Netherlands B.v.
20120125884 - Method for manufacturing a narrow magnetic read width current perpendicular to plane magnetoresistive sensor: A method for manufacturing a magnetic read head having a very narrow track width. The method includes the use of a non-Si containing photoresist to form a mask prior to ion milling to define the track-width of the sensor. Previously only Si-containing resists were used. The Si in the resist... Agent: Hitachi Global Storage Technologies Netherlands B. V.
20120125885 - Perpendicular write head with wrap around shield and conformal side gap: A perpendicular write head having a wrap around shield and a conformal side gap. In fabricating the write head, the leading edge shield may be chemical mechanical polished down to a level that is substantially even with a chemical mechanical polishing stop layer. Because the leading edge shield and the... Agent:
20120125886 - Process to make pmr writer with leading edge shield (les) and leading edge taper (let): Methods for fabrication of leading edge shields and tapered magnetic poles with a tapered leading edge are provided. The leading edge shield may be formed by utilizing a CMP stop layer. The CMP stop layer may aid in preventing over polishing of the magnetic material. For the tapered magnetic poles... Agent:
20120125887 - Method for manufacturing light-absorbing substrate and method for manufacturing mold for making same: A method for manufacturing a light-absorbing substrate having a surface with depressions and projections comprises a first step of irradiating a substrate with a laser light so as to form a plurality of modified regions arranged two-dimensionally along a surface of the substrate within the substrate and cause at least... Agent: Hamamatsu Photonics K.k.
20120125888 - Method for producing a medical functional element comprising a selfsupporting lattice structure: A method for producing a medical functional element having a self-supporting lattice structure which has interconnected webs. The method applies a first layer to the substrate layer, the first layer is structured by an etching process, the structured first layer is under-cut of a wet chemical etching process acting on... Agent: Acandis Gmbh & Co. Kg
20120125889 - Cluster beam generating apparatus, substrate processing apparatus, cluster beam generating method, and substrate processing method: A cluster beam generating apparatus that generates a cluster beam includes a mixer that mixes a gas source material and a liquid source material; a nozzle that supplies a cluster beam including clusters originating from the gas source material and the liquid source material that are mixed in the mixer;... Agent: Hyogo Prefecture
20120125891 - Plasma processing apparatus and plasma processing method: Provided are a plasma processing apparatus and a plasma processing method wherein particles generated due to the inner potential of an inner cylinder disposed inside of a vacuum container are reduced. The plasma processing apparatus has, inside of a metal vacuum chamber (11), the inner cylinder (15) composed of a... Agent: Mitsubishi Heavy Industries, Ltd.
20120125890 - Plasma processing method: In the present invention, provided is a plasma processing method which reduces or eliminates the emission of contaminating matters caused by a quality-altered layer on the surface of yttria of a processing chamber's inner wall and parts inside the processing chamber. It is the plasma processing method including an etching... Agent: Hitachi High-technologies Corporation
20120125892 - Laser processing method: A laser processing method for forming a hole in a sheet-like object to be processed made of silicon comprises a depression forming step of forming a depression in a part corresponding to the hole on a laser light entrance surface side of the object, the depression opening to the laser... Agent: Hamamatsu Photonics K.k.
20120125893 - Laser processing method: In a method comprising a modified region forming step of converging a laser light at a sheet-like object to be processed made of silicon so as to form a plurality of modified spots within the object along a modified region forming line tilted in a first lateral direction with respect... Agent: Hamamatsu Photonics K.k.05/17/2012 > 7 patent applications in 7 patent subcategories. archived by USPTO category
20120118851 - Method for forming a touch sensing pattern and signal wires: A method for forming a touch sensing pattern and signal wires, comprises the steps of: installing a first and a second conductive plating films on a surface of a highly transparency substrate; projecting a high energy light beam to the conductive plating films; and the high energy light beam moving... Agent:
20120118852 - Method for manufacturing quartz crystal unit, quartz crystal oscillator and electronic apparatus: In a method for manufacturing a quartz crystal unit, a metal film is formed on a quartz crystal wafer which is then etched to form a quartz crystal tuning fork resonator having first and second tines vibratable in flexural and fundamental modes. A groove is chemically etched in a first... Agent:
20120118853 - Manufacturing method of master disk for patterned medium and magnetic recording disk manufacturing method: According to one embodiment, a method for manufacturing a master disk for discoid patterned medium having a plurality of sectors arranged in a circumferential direction, the plurality of sectors including a recording data portion and a servo data portion that includes a sector identification region having gaps formed in a... Agent:
20120118854 - Methods for linewidth modification and apparatus implementing the same: A linear-shaped core structure of a first material is formed on an underlying material. A layer of a second material is conformally deposited over the linear-shaped core structure and exposed portions of the underlying material. The layer of the second material is etched so as to leave a filament of... Agent: Tela Innovations, Inc.
20120118855 - Method for edge sealing barrier films: An edge-sealed barrier film composite. The composite includes a substrate and at least one initial barrier stack adjacent to the substrate. The at least one initial barrier stack includes at least one decoupling layer and at least one barrier layer. One of the barrier layers has an area greater than... Agent:
20120118856 - Method and materials for double patterning: A silsesquioxane resin is applied over the patterned photo-resist and cured at the pattern surface to produce a cured silsesquioxane resin on the pattern surface. The uncured silsesquioxane resin layer is then removed leaving the cured silsesquioxane resin on the pattern surface. The cured silsesquioxane resin on horizontal surfaces is... Agent:
20120118857 - Plasma treatment system: A plasma treatment system for treating a workpiece with a downstream-type plasma. The processing chamber of the plasma treatment system includes a chamber lid having a plasma cavity disposed generally between a powered electrode and a grounded plate, a processing space separated from the plasma cavity by the grounded plate,... Agent: Nordson Corporation05/10/2012 > 11 patent applications in 10 patent subcategories. archived by USPTO category
20120111825 - Air gap interconnect structures and methods for forming the same: A metal interconnect structure includes at least a pair of metal lines, a cavity therebetween, and a dielectric metal-diffusion barrier layer located on at least one portion of walls of the cavity. After formation of a cavity between the pair of metal lines, the dielectric metal-diffusion barrier layer is formed... Agent: International Business Machines Corporation
20120111826 - Damascene process using pvd sputter carbon film as cmp stop layer for forming a magnetic recording head: Damascene processes using physical vapor deposition (PVD) sputter carbon film as a chemical mechanical planarization (CMP) stop layer for forming a magnetic recording head are provided. In one embodiment, one such process includes providing an insulator, removing a portion of the insulator to form a trench within the insulator, depositing... Agent: Western Digital (fremont), LLC
20120111827 - Method using block copolymers for making a master mold with high bit-aspect-ratio for nanoimprinting patterned magnetic recording disks: The invention is a method for making a master mold to be used for nanoimprinting patterned-media magnetic recording disks. The method uses conventional optical or e-beam lithography to form a pattern of generally radial stripes on a substrate, with the stripes being grouped into annular zones or bands. A block... Agent:
20120111828 - Method for manufacturing ejection element substrate: Provided is a method for manufacturing an ejection element substrate which is provided with a flow-channel-forming member having an ejection orifice for ejecting a liquid and a liquid flow channel that is communicated with the ejection orifice, and a substrate having a supply port for supplying the liquid to the... Agent: Canon Kabushiki Kaisha
20120111829 - Method for production of a device with a graphical element: A method for producing a device, with a graphical element, including: a) producing a stack including at least one sacrificial layer positioned between a first substrate and a protective layer, and a graphical element produced in a first face of the protective layer opposite a second face of the protective... Agent: Commissariat A I'energie Atomique Et Aux Ene Alt
20120111830 - Double-sided pressure-sensitive adhesive tapes for producing or sticking together lc displays with light-absorbing properties: The invention relates to a pressure-sensitive tape, particularly for producing or sticking together optical liquid crystal data displays (LCDs), comprising a top side and an underside. The pressure-sensitive adhesive tape also comprises a carrier film with a top side and an underside, and the pressure-sensitive adhesive tape is provided with... Agent: Tesa Se
20120111831 - Method of depositing film with tailored comformality: A method of depositing a film with a target conformality on a patterned substrate, includes: depositing a first film on a convex pattern and a bottom surface; and depositing a second film on the first film, thereby forming an integrated film having a target conformality, wherein one of the first... Agent: Asm Japan K.k.
20120111832 - Template pillar formation: Methods for forming an imprint lithography template are provided. Materials for forming the imprint lithography template may be etched at different rates based on physical properties of the layers. Additionally, reflectance of the materials may be monitored to provide substantially uniform erosion of the materials.... Agent: Molecular Imprints, Inc.
20120111833 - Substrate processing method: There is provided a substrate processing method, in which a throughput can be improved even in case the time for recovery processing for restoring the state of a processing chamber is longer than the time for predetermined processing to be performed in the processing chamber. Substrates are alternately transferred to... Agent:
20120111834 - Plasma processing apparatus: A plasma processing apparatus includes a process chamber, a platen for supporting a workpiece, a source configured to generate a plasma in the process chamber, and an insulating modifier. The insulating modifier has a gap, and a gap plane, where the gap plane is defined by portions of the insulating... Agent: Varian Semiconductor Equipment Associates, Inc.
20120111835 - Wet etching apparatus and method: A wet etching apparatus includes: an etching vessel applying etchant to a substrate to etch the substrate; and a water cleaning vessel and a drying vessel connected to the etching vessel, successively processing the substrate, and provided with an air knife removing droplets on the substrate. The wet etching apparatus... Agent: Sharp Kabushiki Kaisha05/03/2012 > 10 patent applications in 7 patent subcategories. archived by USPTO category
20120103931 - Method for manufacturing printed wiring board and printed wiring board: A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching... Agent: Ibiden Co., Ltd.
20120103930 - Method of making fusible links: Methods of fabricating the fusible link are directed to processing a multi-layer clad foil having a first layer suitable for forming a fusible link and a second layer suitable for forming one or more welding pads. In some embodiments, the first layer is an aluminum layer and the second layer... Agent: Sinoelectric Powertrain Corporation
20120103932 - Methods for fabricating current-carrying structures using voltage switchable dielectric materials: A method includes providing a voltage switchable dielectric material having a characteristic voltage, exposing the voltage switchable dielectric material to a source of ions associated with an electrically conductive material, and creating a voltage difference between the source and the voltage switchable dielectric material that is greater than the characteristic... Agent:
20120103934 - Method of manufacturing magnetic recording medium: A method of manufacturing a magnetic recording medium includes: forming a first film on a substrate holder not yet having a substrate mounted thereon; mounting a substrate on the substrate holder having the first film formed thereon, the substrate having a resist layer formed on a multilayer film including a... Agent: Canon Anelva Corporation
20120103933 - Plasma processing method: In a plasma processing method of dry-etching of a magnetic film having a thickness of 200 nm to 500 nm, a plasma processing method of dry-etching of a sample having the magnetic film on which a multilayered film including a resist film, an non-organic film underlying the resist film, a... Agent: Hitachi High-technologies Corporation
20120103935 - Method for improving self-assembled polymer features: A method for processing a structure. The structure is formed and includes a substrate, a substructure having a sidewall and disposed on the substrate, a first polymer structure disposed on the substrate, and a second polymer structure disposed on the substrate such that the first polymer structure is disposed between... Agent: International Business Machines Corporation
20120103936 - Methods for reducing photoresist interference when monitoring a target layer in a plasma process: A method and apparatus for monitoring a target layer in a plasma process having a photoresist layer is provided. The method is useful in removing noise associated with the photoresist layer, and is particularly useful when signals associated with the target layer is weak, such as when detecting an endpoint... Agent: Applied Materials, Inc.
20120103937 - Method of manufacturing glass substrate for magnetic storage medium: A method of manufacturing a glass substrate for a magnetic recording medium, wherein inner and outer circumference end faces of a disk-like glass substrate having a central aperture are at least treated by: a step of grinding, a step of etching, and a step of polishing, wherein the steps are... Agent: Showa Denko K.k.
20120103938 - Method and system for milling and imaging an object: A system and a method for milling and inspecting an object. The method may include performing at least one iteration of a sequence that includes: milling, by a particle beam, a first surface of the object, during a first surface milling period; obtaining, by an electron detector, an image of... Agent: Camtek Ltd.
20120103939 - Methods and apparatus for controlling photoresist line width roughness: The present invention provides methods and an apparatus for controlling and modifying line width roughness (LWR) of a photoresist layer. In one embodiment, an apparatus for controlling a line width roughness of a photoresist layer disposed on a substrate includes a chamber body having a top wall, side wall and... Agent: Applied Materials, Inc.Previous industry: Bottles and jars
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