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Etching a substrate: processes April category listing, related patent applications 04/12Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 04/26/2012 > 6 patent applications in 6 patent subcategories. category listing, related patent applications
20120097636 - Acoustic substrate: A micromachined microphone or speaker embedded within, or positioned on top of, a substrate suitable for carrying microelectronic chips and components. The acoustic element converts sound energy into electrical energy which is then amplified by electronic components positioned on the surface of the substrate. Alternatively, the acoustic element may be... Agent: The Regents Of The University Of California
20120097637 - Method of manufacturing substrate for liquid discharge head: Provided is a method of manufacturing a substrate for a liquid discharge head including a first face, energy generating elements which generate the energy to be used to discharge a liquid to a second face opposite to the first face, and liquid supply ports for supplying the liquid to the... Agent: Canon Kabushiki Kaisha
20120097638 - Method for low temperature bonding and bonded structure: A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. The method may also include removing by-products of interface polymerization to prevent a reverse polymerization reaction to allow room temperature chemical bonding of materials such as silicon, silicon nitride and... Agent: Ziptronix, Inc.
20120097639 - Contact-hole forming method: A contact hole forming method according to the present invention includes a process (a) of forming an insulating film on a substrate and a process (b) of forming a contact hole in the insulating film by etching. Here, the process (a) includes steps of (a1) placing the substrate between a... Agent: Sharp Kabushiki Kaisha
20120097640 - Resin composition for pattern formation, pattern formation method and process for producing light-emitting element: Disclosed are: a resin composition for pattern formation, which enables the stable formation of a pattern at a level of the wavelength of light; a method for forming a pattern having a sea-island structure using the composition; and a process for producing a light-emitting element that can achieve high luminous... Agent: Kabushiki Kaisha Toshiba
20120097641 - Method and device for plasma treatment of a flat substrate: Method and device for the plasma treatment of a substrate in a plasma device, wherein—the substrate (110) is arranged between an electrode (112) and a counter-electrode (108) having a distance d between a surface area of the substrate to be treated and the electrode, —a capacitively coupled plasma discharge is... Agent: Leybold Optics Gmbh04/19/2012 > 7 patent applications in 7 patent subcategories. category listing, related patent applications
20120091094 - Method for forming nanostructure: The present invention provides a method for forming a nanostructure. The method includes the steps of providing a substrate; forming a plurality of nanoparticles on the substrate; forming a film on the substrate and between every two adjacent nanoparticles of the nanoparticles; removing the nanoparticles; forming a resist layer on... Agent: Aurotek Corporation
20120091095 - Method and apparatus for reducing particle defects in plasma etch chambers: In-situ low pressure chamber cleans and gas nozzle apparatus for plasma processing systems employing in-situ deposited chamber coatings. Certain chamber clean embodiments for conductor etch applications include an NF3-based plasma clean performed at pressures below 30 mT to remove in-situ deposited SiOx coatings from interior surfaces of a gas nozzle... Agent: Applied Materials, Inc.
20120091096 - System, method and apparatus for pattern clean-up during fabrication of patterned media using forced assembly of molecules: A pattern clean-up for fabrication of patterned media using a forced assembly of molecules is disclosed. E-beam lithography is initially used to write the initial patterned bit media structures, which have size and positioning errors. Nano-sized protein molecules are then forced to assemble of on top of the bits. The... Agent: Hitachi Global Storage Technologies Netherlands B.v.
20120091097 - Using vacuum ultra-violet (vuv) data in radio frequency (rf) sources: The invention provide apparatus and methods for creating gate structures on a substrate in real-time using Vacuum Ultra-Violet (VUV) data and Electron Energy Distribution Function (EEDƒ) data and associated (VUV/EEDƒ)-related procedures in (VUV/EEDƒ) etch systems. The (VUV/EEDƒ)-related procedures can include multi-layer-multi-step processing sequences and (VUV/EEDƒ)-related models that can include Multi-Input/Multi-Output... Agent: Tokyo Electron Limited
20120091098 - High efficiency gas dissociation in inductively coupled plasma reactor with improved uniformity: Embodiments of the present invention relate to a plasma chamber having a coil assembly which improves plasma uniformity and improves power coupling to the plasma. One embodiment provides a plasma chamber. The plasma chamber includes a chamber body having sidewalls and a lid, wherein the chamber body defines a processing... Agent: Applied Materials, Inc.
20120091099 - Methods and apparatus for recovery and reuse of reagents: Methods and apparatus for recovery and reuse of reagents are provided herein. In some embodiments, a system for processing substrates may include a process chamber for processing a substrate; a reagent source coupled to the process chamber to provide a reagent to the process chamber; and a reagent recovery system... Agent: Applied Materials, Inc.
20120091100 - Etchant for controlled etching of ge and ge-rich silicon germanium alloys: The present disclosure provides a chemical etchant which is capable of removing Ge and Ge-rich SiGe alloys in a controlled manner. The chemical etchant of the present disclosure includes a mixture of a halogen-containing acid, hydrogen peroxide, and water. Water is present in the mixture in an amount of greater... Agent: International Business Machines Corporation04/12/2012 > 7 patent applications in 6 patent subcategories. category listing, related patent applications
20120085728 - Novel process for mems scanning mirror with mass remove from mirror backside: Two methods of fabricating a MEMS scanning mirror having a tunable resonance frequency are described. The resonance frequency of the mirror is set to a particular value by mass removal from the backside of the mirror during fabrication.... Agent: Magic Technologies, Inc.
20120085729 - Method for manufacturing solar cell and solar cell manufactured by the same mehtod: Disclosed are a method for manufacturing a solar cell by processing a surface of a silicon substrate for a solar cell, a solar cell manufactured by the method, and a substrate processing system for performing the method. The method for manufacturing a solar cell comprises protrusion forming step including wet-etching... Agent:
20120085731 - Method of fabricating mems devices (such as imod) comprising using a gas phase etchant to remove a layer: Improvements in an interferometric modulator that cavity defined by two walls.... Agent: Qualcomm Mems Technologies, Inc.
20120085730 - Method of manufacturing wiring board: A method for manufacturing a wiring board, includes: forming an insulating resin layer on a conductive layer; forming a metal chloride or a metal sulfate on the insulating resin layer; forming a protective layer on the metal chloride or the metal sulfate; forming an exposed portion in the insulating resin... Agent: Fujitsu Limited
20120085732 - Layered dimmer system: A dimmer wheel which is formed to absorb large amounts of light and to disperse the light that is absorbed. The dimmer wheel has a bottom surface that is irregular, and a reflective material in that bottom surface to scatter the light. A light absorbing material also receives some of... Agent: Production Resource Group, LLC
20120085733 - Self aligned triple patterning: Embodiments of the present invention pertain to methods of forming features on a substrate using a self-aligned triple patterning (SATP) process. A stack of layers is patterned near the optical resolution of a photolithography system using a high-resolution photomask. The heterogeneous stacks are selectively etched to undercut a hard mask... Agent: Applied Materials, Inc.
20120085734 - Extendible stent apparatus: An expandable stent includes a tubular structure with an outer surface positionable adjacent to a vessel wall and an inner surface facing a lumen of a body passageway. The tubular structure further includes a plurality of expansion struts, connector struts and cells. The tubular structure has a first diameter which... Agent: Boston Scientific Scimed, Inc.04/05/2012 > 9 patent applications in 8 patent subcategories. category listing, related patent applications
20120080400 - Multilayer printed wiring board and method for manufacturing multilayer printed wiring board: A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an... Agent: Ibiden Co., Ltd.
20120080401 - Method of fabricating multilayer printed circuit board: A method of fabricating a multilayer printed circuit board includes preparing a first substrate, and preparing a second substrate, in parallel to the formation of the first substrate, that is, at the same time of the formation of the first substrate, by forming a third inner circuit pattern on one... Agent: Samsung Electro-mechanics Co., Ltd.
20120080402 - Planarization method for media: A planarization process may planarize a media disk that has data trenches between data features and larger servo trenches between servo features. A filler material layer is deposited on the media disk and provides step coverage of the trenches. The filler material has data recesses over the data trenches and... Agent: Seagate Technology LLC
20120080403 - Glass film laminate, method of producing the same, and method of producing glass film: A glass film laminate comprises a glass film (2) and a supporting glass (3) laminated to each other. At least one of the contacting surface of the glass film (2) and the contacting surface of the supporting glass (3) comprises a region with a relatively large surface roughness and a... Agent:
20120080404 - Block copolymer and method of forming patterns by using the same: A method of forming patterns includes forming a layer composed of a ketene based random copolymer on a substrate, forming a block copolymer on the ketene based random copolymer layer and patterning the ketene based random copolymer layer by removing a part of the block copolymer and a portion of... Agent:
20120080405 - Manufacturing method of a nano filter structure for breathing: In a nano filter structure for breathing and a manufacturing method of the nano filter structure, a semiconductor process technology is used for manufacturing a nano filter structure comprising a top gate, a bottom gate, a plurality of sidewall gates and a plurality of supports. The sidewall gates include a... Agent:
20120080406 - Method and system for preparing a lamela: A system and a method for preparing a lamella. The method may include aligning, by the manipulator, a mask and a sample. Positioning the mask and the sample in front of an ion miller while unchanging the spatial relationship between the mask and the sample. Milling a first exposed portion... Agent: Camtek Ltd.
20120080407 - Multi-source plasma focused ion beam system: The present invention provides a plasma ion beam system that includes multiple gas sources and that can be used for performing multiple operations using different ion species to create or alter submicron features of a work piece. The system preferably uses an inductively coupled, magnetically enhanced ion beam source, suitable... Agent: Fei Company
20120080408 - Substrate processing method and substrate processing apparatus: A substrate processing method using a substrate processing apparatus includes a first step and a second step. The first step is to apply a negative voltage pulse from a pulsed power supply to be included in the apparatus. The second step is to apply floating potential for an interval of... Agent:Previous industry: Bottles and jars
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