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Etching a substrate: processes October categorized by USPTO classification 10/09Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 10/30/2009 > patent applications in patent subcategories. categorized by USPTO classification
10/23/2009 > patent applications in patent subcategories. categorized by USPTO classification
10/15/2009 > patent applications in patent subcategories. categorized by USPTO classification
20090255899 - Additive write pole process for wrap around shield: A method for manufacturing a magnetic write head having a wrap around magnetic trailing shield and a very narrow track width. A magnetic write pole is formed by forming a mask over a magnetic write pole material and performing a first ion milling to define the write pole. The mask... Agent: Zilka-kotab, PC- Hit
20090255900 - Oil/gas separation membrane, its use in gas sensor and process for producing the same: An oil gas separation membrane combines a gas permeable yet oil and temperature resistant bulk polymer membrane such as poly(tetrafluoroethylene) and poly(tetrafluoroethylene-co-hexafluoropropylene); a porous metal support such as sintered metal frit disk made with stainless steel, bronze or nickel; and an highly gas permeable adhesive that bonds firmly the bulk... Agent: David And Raymond Patent Firm
20090255902 - Focus ring, plasma etching apparatus and plasma etching method: In a plasma etching apparatus for performing a plasma etching on a surface of a substrate mounted on a susceptor in a processing vessel, a focus ring is installed to surround the substrate and has a first region at an inner side on a surface thereof, in which an average... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.
20090255901 - Plasma processing apparatus, plasma processing method, and tray: A tray 15 for a dry etching apparatus 1 has substrate accommodation holes 19A to 19D penetrating thickness direction and a substrate support portion 21 supporting an outer peripheral edge portion of a lower surface 2a of a substrate 2. A dielectric plate 23 has a tray support surface 28... Agent: Wenderoth, Lind & Ponack L.L.P.
20090255903 - Compositions for chemical-mechanical planarization of noble-metal-featured substrates, associated methods, and substrates produced by such methods: A method for planarizing a substrate surface having a feature thereon comprising at least one noble metal, noble metal alloy, or noble metal oxide, or a combination thereof, comprises providing a composition or slurry comprising periodic acid and an abrasive in a combined amount sufficient to planarize the substrate surface,... Agent: Morgan Lewis & Bockius LLP10/08/2009 > patent applications in patent subcategories. categorized by USPTO classification
20090250428 - Method and apparatus for electrochinetic transport: Controlled electrokinetic transport of constituents of liquid media can be achieved by connecting at least two volumes containing liquid media with at least one dielectric medium with opposing dielectric surfaces in direct contact with said liquid media, and establishing at least one conduit across said dielectric medium, with a conduit... Agent: Intellectual Property Strategists, LLC
20090250429 - Methods of forming dual-damascene metal wiring patterns for integrated circuit devices and wiring patterns formed thereby: Methods of forming dual-damascene metal wiring patterns include forming a first metal wiring pattern (e.g., copper wiring pattern) on an integrated circuit substrate and forming an etch-stop layer on the first metal wiring pattern. These steps are followed by the steps of forming an electrically insulating layer on the etch-stop... Agent: Myers Bigel Sibley & Sajovec
20090250430 - Methods for fabrication of three-dimensional structures: A multi-layer fabrication method for making three-dimensional structures is provided. In one embodiment, the formation of a multi-layer three-dimensional structure comprises: 1) fabricating a plurality of layers with each layer comprising at least two materials; 2) aligning the layers; 3) attaching the layers together to form a multi-layer structure; and... Agent: Gang Zhang
20090250431 - Substrate processing apparatus and substrate processing method: A substrate processing method that processes a substrate on which a plurality of patterns adjacent to each other are formed, has: supplying a first processing liquid to a principal surface of the substrate that is dry and has the patterns formed thereon to make the first processing liquid adhere to... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
20090250432 - Method of controlling plasma distribution uniformity by time-weighted superposition of different solenoid fields: A method of processing a workpiece in a chamber of a plasma reactor having a set of plural electromagnet coils includes selecting plural predetermined plasma density distributions relative to a workpiece surface, the predetermined plasma density distributions corresponding to different sets of D.C. currents in the coils, and flowing a... Agent: Law Office Of Robert M. Wallace
20090250433 - Slurry composition and method for chemical mechanical polishing of copper integrated with tungsten based barrier metals: The present invention is related to a slurry composition for polishing copper integrated with tungsten containing barrier layers and its use in a CMP method. The present invention is also related to a method for polishing copper integrated with tungsten containing barrier layers by means of an aqueous solution containing... Agent: Knobbe Martens Olson & Bear LLP10/01/2009 > patent applications in patent subcategories. categorized by USPTO classification
20090242506 - Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon: A wired circuit board is provided having a high-reliability conductive pattern formed thereon and mounting an electronic component thereon with high accuracy, and a method is provided for manufacturing the wired circuit board and mounting the electronic component thereon. An insulating layer including a mounting portion is formed on a... Agent: Akerman Senterfitt
20090242507 - Manufacturing process of electrode: A resist layer is formed over one surface of a current-collector material, while a resist layer having a predetermined pattern is formed on the other surface of the current-collector material. Through-holes are formed on the current-collector material through an etching process. An electrode slurry is applied onto the current-collector material... Agent: Darby & Darby P.C.
20090242508 - Method for manufacturing magnetic recording medium: A filling material different from a first mask layer (temporary coating material) is deposited over a workpiece to fill concave portions. At least part of excess portions of the filling material is removed by a dry etching method such that at least part of the side surfaces of the first... Agent: Oliff & Berridge, PLC
20090242510 - Photoelectric coupling assembly and manufacturing method thereof: A photoelectric coupling assembly and manufacturing method thereof enabling a three dimensional electrical wiring pattern is provided. The assembly includes a photoelectric conversion unit equipped with a photoelectric conversion element and a molded article. The molded article has a hole configured and arranged to have an optical fiber inserted there-through... Agent: GlobalIPCounselors, LLP
20090242511 - Seasoning method for film-forming apparatus: A seasoning method for a film-forming apparatus configured to form a silicon nitride film on a substrate placed in a process chamber. The method is conducted for reducing particles in the apparatus. The method comprises executing the plasma cleaning of the process chamber to remove a film deposited on the... Agent: Westerman, Hattori, Daniels & Adrian, LLP
20090242512 - Deep reactive ion etching: s
20090242514 - Etch process and etching chamber: The invention relates to a process for etching a substrate (3) in an etching chamber (1) with a plasma ignited outside of the etching chamber (1). The process is characterized in that during the etching process at least temporarily at least one gas jet (10) is directed from the side... Agent: Kriegsman & Kriegsman
20090242513 - Multi-layer/multi-input/multi-output (mlmimo) models and method for using: The invention provides a method of processing a substrate using multilayer processing sequences and Multi-Layer/Multi-Input/Multi-Output (MLMIMO) models and libraries that can include one or more masking layer creation procedures, one or more pre-processing measurement procedures, one or more Partial-Etch (P-E) procedures, one or more Final-Etch (F-E) procedures, and one or... Agent: Tokyo Electron U.s. Holdings, Inc.
20090242515 - Plasma processing apparatus and plasma etching method: A plasma processing apparatus includes an inner upper electrode provided to face a lower electrode mounting thereon a substrate, an outer upper electrode provided in a ring shape at a radially outside of the inner upper electrode and electrically isolated from the inner upper electrode in a vacuum evacuable processing... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.
20090242516 - Plasma etching method and computer readable storage medium: A plasma etching method includes disposing a first electrode and a second electrode to face each other; preparing a part in the processing chamber; supporting a substrate; vacuum-evacuating the processing chamber; supplying an etching gas into a processing space between the first electrode and the second electrode; generating a plasma... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.
20090242517 - Substrate treating apparatus and substrate treating method: A substrate treating apparatus for performing a predetermined treatment of substrates with a treating liquid. The apparatus includes a treating tank for storing the treating liquid; a lifter having holding elements for holding the substrates, and vertically movable between a standby position above the treating tank and a treating position... Agent: Ostrolenk Faber Gerb & SoffenPrevious industry: Bottles and jars
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