Etching a substrate: processes inventions 09/09

20090236307 - Method for manufacturing perpendicular magnetic recording head: Embodiments of the present invention help to provide a method for manufacturing a perpendicular magnetic recording head including a main magnetic pole having a width that does not generally vary. According to one embodiment, a magnetic film, a first inorganic mask film, an organic film, a second inorganic mask film,... Agent: Townsend And Townsend And Crew LLP

20090236308 - Optical recording and reproducing medium substrate, manufacturing method of optical recording and reproducing medium manufacturing stamper and optical recording and reproducing medium manufacturing stamper: In an optical recording and reproducing medium having a groove 2 formed along a recording track and which is recorded and/or reproduced with irradiation of light L having a predetermined wavelength λ, a track pitch p of the groove 2 is selected in a range of from 200 nm to... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090236309 - Thermal anneal of block copolymer films with top interface constrained to wet both blocks with equal preference: Methods for fabricating sublithographic, nanoscale microstructures utilizing self-assembling block copolymers, and films and devices formed from these methods are provided.... Agent: Whyte Hirschboeck Dudek S.c. Intellectual Property Department

20090236310 - Adjustable solubility in sacrificial layers for microfabrication: The present invention provides fabrication methods using sacrificial materials comprising polymers. In some embodiments, the polymer may be treated to alter its solubility with respect to at least one solvent (e.g., aqueous solution) used in the fabrication process. The preparation of the sacrificial materials is rapid and simple, and dissolution... Agent: Harvard University & Medical School C/o Wolf, Greenfield & Sacks, P.C.

20090236311 - Method and apparatus for structuring components made of a material composed of silicon oxide: A method and an apparatus for forming a structure on a component made of a material composed of silicon oxide, especially of silicate glass, glass ceramic or quartz, wherein in accordance with the process at least a first surface of the component a partial removal of the material by plasma... Agent: Crowell & Moring LLP Intellectual Property Group

20090236312 - Method and apparatus for film thickness adjustment: An ion source is used to adjust film thickness uniformity. Voltage is adjusted based on the film thickness to remove material on thicker parts of the substrate while removing almost no material on the thinner part of the substrate. Special procedure is used to obtain virtually uniform film without reducing... Agent: Sergey Mishin

20090236313 - Gas flow distribution receptacles, plasma generator systems, and methods for performing plasma stripping processes: Systems, system components, and methods for plasma stripping are provided. In an embodiment, a gas flow distribution receptacle may have a rounded section that includes an inner surface defining a reception cavity, an outer surface forming an enclosed end, and a centerpoint on the outer surface having a longitudinal axis... Agent: Ingrassia Fisher & Lorenz, P.C. (nvls)

20090236314 - Mono-energetic neutral beam activated chemical processing system and method of using: A chemical processing system and a method of using the chemical processing system to treat a substrate with a mono-energetic space-charge neutralized neutral beam-activated chemical process is described. The chemical processing system comprises a first plasma chamber for forming a first plasma at a first plasma potential, and a second... Agent: Tokyo Electron U.s. Holdings, Inc.

20090236315 - Shielded lid heater assembly: A shielded lid heater lid heater suitable for use with a plasma processing chamber, a plasma processing chamber having a shielded lid heater and a method for plasma processing are provided. The method and apparatus enhances positional control of plasma location within a plasma processing chamber, and may be utilized... Agent: Patterson & Sheridan, LLP - - Appm/tx

20090236316 - Substrate processing method and substrate processing apparatus: A wafer processing apparatus 100 is configured so that the number of repeated cycles of supplying pure water for maintaining the etching rate of phosphoric acid 10 to be high for the complete etching of the target film and halting the supply for each lot of wafers during a predetermined... Agent: Young & Thompson

20090236317 - Anti-reflection etching of silicon surfaces catalyzed with ionic metal solutions: A method (300) for etching a silicon surface (116). The method (300) includes positioning (310) a substrate (112) with a silicon surface (116) into a vessel (122). The vessel (122) is filled (330, 340) with a volume of an etching solution (124) so as to cover the silicon surface (116).... Agent: Paul J White, Patent Counsel National Renewable Energy Laboratory (nrel)

20090230085 - Composition for surface modification of a heat sink and method for surface treatment of the heat sink for printed circuit boards using the same: The present invention provides a composition for surface modification of a heat sink, the composition including: 0.01 to 10 parts by weight of an organic titanium compound; 0.01 to 5 parts by weight of an organic silane compound; 0.1 to 10 parts by weight of an organic acid; 0.01 to... Agent: Mcdermott Will & Emery LLP

20090230086 - Optical waveguide substrate manufacturing method: A voltage is applied on an interdigitated electrode provided on one main face 8a of a single-domain ferroelectric single crystal substrate 8 to form a periodic domain inversion structure 29, the interdigitated electrode is removed and the one main face 8a of the substrate 8 is machined to remove the... Agent: Burr & Brown

20090230087 - Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers: Microelectronic imagers with integrated optical devices and methods for manufacturing imagers. The imagers, for example, typically have an imaging unit including a first substrate and an image sensor on and/or in the first substrate. An embodiment of an optical device includes a stand-off having a compartment configured to contain the... Agent: Dickstein Shapiro LLP

20090230088 - Forming a print head with a thin membrane: A microfabricated device and method for forming a microfabricated device are described. A thin membrane including silicon is formed on a silicon body by bonding a silicon-on-insulator substrate to a silicon substrate. The handle and insulator layers of the silicon-on-insulator substrate are removed, leaving a thin membrane of silicon bonded... Agent: Fish & Richardson P.C.

20090230089 - Electrical control of plasma uniformity using external circuit: A method and apparatus for controlling plasma uniformity is disclosed. When etching a substrate, a non-uniform plasma may lead to uneven etching of the substrate. Impedance circuits may alleviate the uneven plasma to permit more uniform etching. The impedance circuits may be disposed between the chamber wall and ground, the... Agent: Patterson & Sheridan, LLP - - Appm/tx

20090223923 - Method for manufacturing a surface-treated silicon substrate for magnetic recording medium: Provided is a textured silicon substrate for a magnetic disk, comprising a magnetic film in which magnetic anisotropy can be attained and high recording density can be achieved, while ensuring the flying stability of a head by controlling the surface roughness of the substrate through texturing. Especially, provided is a... Agent: Myers Bigel Sibley & Sajovec

20090223924 - Method of fabricating reflective mirror by wet-etch using improved mask pattern and reflective mirror fabricated using the same: A method is provided of fabricating a reflective mirror having a reflective surface on which light is incident. This method includes: coating at least one of opposite faces of a plate-shaped etchable material made of a single crystal material, with a film-like etching mask; forming a mask pattern on at... Agent: Oliff & Berridge, PLC

20090223925 - Chemical microreactor and method thereof: A method for forming a chemical microreactor includes forming at least one capillary microchannel in a substrate having at least one inlet and at least one outlet, integrating at least one heater into the chemical microreactor, interfacing the capillary microchannel with a liquid chemical reservoir at the inlet of the... Agent: Llnl/zilka-kotab John H. Lee, Assistant Laboratory Counsel

20090223926 - Plasma processing apparatus and impedance adjustment method: A plasma processing apparatus, for performing a plasma processing on a substrate to be processed by generating a plasma of the processing gas in an evacuable processing chamber, includes an impedance adjusting mechanism. The impedance adjusting mechanism is provided with a resonance circuit formed to allow a radio frequency current... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090223927 - Method of manufacturing an engraved plate: A method of manufacturing an engraved plate used in intaglio printing, said plate being engraved by a tool, for example a laser beam, characterised in that the engraving tool uses data from a depth-map, based on a three-dimensional raster image of the document to be printed.... Agent: Clifford W. Browning

20090223929 - Apparatus and method of removing coating of line-shaped body using plasma: An apparatus of removing coatings of a line-shaped body of the invention includes a non-equilibrium atmospheric pressure plasma source with radicals controlled, having a plasma generating gas, a microwave, a micro gap; a line-shaped body holding portion for holding the line-shaped body within a range of 2 to 3 mm... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090223930 - Apparatus for etching substrate and method of etching substrate using the same: An apparatus for etching a substrate includes: a chamber; a susceptor in the chamber, the susceptor including at least one loading portion corresponding to at least one substrate; a gas supply over the susceptor, the gas supply including a hollow and at least one through hole corresponding to the at... Agent: Hosoon Lee

20090223931 - Dry etching method and apparatus: The dry etching method of performing etching, includes the steps of: supplying a processing gas which is a gas mixture of a plurality of fluorochemical gases; and generating plasma under a high vacuum while supplying the processing gas and applying a low-frequency bias voltage.... Agent: Birch Stewart Kolasch & Birch

20090223932 - Electrode unit, substrate processing apparatus, and temperature control method for electrode unit: An electrode unit is disposed in a substrate processing apparatus including a processing chamber for processing a substrate by plasma. The electrode unit includes an electrode layer having a surface exposed to inside of the processing chamber and an opposing surface disposed at the opposite side of the exposed surface,... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090223928 - Inductively coupled plasma processing apparatus: An inductively coupled plasma processing apparatus (100) comprises a plasma chamber (12) with a dielectric window (400) forming a self-supporting wall element of the plasma chamber (12). The dielectric window (400) has an external and an internal side with respect to the chamber (12). An electromagnetic field source (140) is... Agent: Cantor Colburn, LLP

20090223933 - Plasma processing apparatus and method: A plasma processing apparatus for processing a substrate by using a plasma includes a processing chamber for accommodating and processing the substrate therein, a lower electrode for mounting the substrate thereon in the processing chamber, an upper electrode disposed to face the lower electrode in the processing chamber, a radio... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090218310 - Methods of patterning a conductor on a substrate: A method of patterning a conductor on a substrate includes providing an inked elastomeric stamp inked with self-assembled monolayer-forming molecules and having a relief pattern with raised features. Then the raised features of the inked stamp contact a metal-coated visible light transparent substrate. Then the metal is etched to form... Agent: 3m Innovative Properties Company

20090218311 - Layer-structured fuel cell catalysts and current collectors: A method of fabricating a layer-structured catalysts at the electrode/electrolyte interface of a fuel cell is provided. The method includes providing a substrate, depositing an electrolyte layer on the substrate, depositing a catalyst bonding layer to the electrolyte layer, depositing a catalyst layer to the catalyst bonding layer, and depositing... Agent: Lumen Patent Firm

20090218312 - Method and system for xenon fluoride etching with enhanced efficiency: Provided herein is an apparatus and a method useful for manufacturing MEMS devices. An aspect of the disclosed apparatus provides a substrate comprising an etchable material exposed to a solid-state etchant, wherein the substrate and the solid-state etchant are disposed in an etching chamber. In some embodiments, the solid state... Agent: Knobbe, Martens, Olson & Bear, LLP

20090218313 - Method for manufacturing patterned magnetic recording medium: There is provided a method for manufacturing a patterned magnetic recording medium including a step of completely removing an etching resist on a magnetic layer 3, which is used for etching the magnetic layer 3, without deteriorating magnetic characteristics of the magnetic layer 3. The step of removing the etching... Agent: Venable LLP

20090218314 - Advanced process sensing and control using near infrared spectral reflectometry: Embodiments described herein provide a method and apparatus for obtaining process information in a substrate manufacturing process using plasma. In one embodiment, a chamber is provided having one or more optical metrology modules that are positioned such that optical energy from the plasma process is detected at substantially orthogonal angles.... Agent: Patterson & Sheridan, LLP - - Appm/tx

20090218315 - Method and system for controlling center-to-edge distribution of species within a plasma: A method and system for controlling the center-to-edge distribution of a species within a plasma is provided. In one embodiment, the invention provides a method for plasma processing, comprising determining plasma processing center-to-edge profile requirements of a substrate, and selecting a ratio of two inert gases to be provided to... Agent: Patterson & Sheridan, LLP - - Appm/tx

20090218316 - Manufacturing method in plasma processing apparatus: A manufacturing method includes steps of: placing a film composed of dielectric, on the top surface of a sample stage, forming a film-like heater on the film made of the dielectric, supplying power to the heater to detect a temperature distribution, adjusting a resistance value of the heater on the... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090218317 - Method to control uniformity using tri-zone showerhead: Embodiments of the present invention provide apparatus and method for processing a substrate with increased uniformity. One embodiment of the present invention provides an apparatus for processing a substrate. The apparatus comprises a chamber body defining a processing volume, a substrate support disposed in the processing volume, a showerhead disposed... Agent: Patterson & Sheridan, LLP - - Appm/tx