Etching a substrate: processes inventions 08/09

20090212005 - Embossing cylinder and method for modifying the embossing pattern of an embossing cylinder: An embossing cylinder (10) comprising a central cylindrical body (11) and supports for bearings (12, 12′) projecting laterally from the circular ends of the central cylindrical body (11), wherein the central cylindrical body (11) comprises an internal cylindrical portion (13) and a coating (14), the coating (14) being provided molten... Agent: Lucas & Mercanti, LLP

20090212006 - Horizontal nanotube/nanofiber growth method: A method for forming a nanotube/nanofiber growth catalyst on the sides of portions of a layer of a first material, comprising the steps of depositing a thin layer of a second material; opening this layer at given locations; depositing a very thin catalyst layer; depositing a layer of the first... Agent: The Noblitt Group, Pllc

20090212007 - Surface treatment method: According to the present invention, a plasma treatment process is performed for a surface of a metal film exposed through a resin layer, including a foreign resin substance attached to the surface, so that the foreign resin substance can be roughened without substantially damaging the resin layer; and the entire... Agent: Rankin, Hill & Clark LLP

20090212008 - Liquid ejection head and manufacturing method thereof: A liquid ejection head includes a substrate, having a front surface and a back surface, provided on the front surface with an energy generating element for generating energy used for ejecting liquid; a supply port, provided so as to penetrate between the front surface and the back surface of the... Agent: Fitzpatrick Cella Harper & Scinto

20090212009 - Methods for electrochemically fabricating structures using adhered masks, incorporating dielectric sheets, and/or seed layers that are partially removed via planarization: Embodiments of the present invention provide mesoscale or microscale three-dimensional structures (e.g. components, device, and the like). Embodiments relate to one or more of (1) the formation of such structures which incorporate sheets of dielectric material and/or wherein seed layer material used to allow electrodeposition over dielectric material is removed... Agent: Microfabrica Inc. Att: Dennis R. Smalley

20090212010 - Plasma etching carbonaceous layers with sulfur-based etchants: Etching of carbonaceous layers with an etchant gas mixture including molecular oxygen (O2) and a gas including a carbon sulfur terminal ligand. A high RF frequency source is employed in certain embodiments to achieve a high etch rate with high selectivity to inorganic dielectric layers. In certain embodiments, the etchant... Agent: Applied Materials/bstz Blakely Sokoloff Taylor & Zafman LLP

20090212011 - Micro-lens array substrate and method for manufacturing thereof: In a method for manufacturing the micro-lens array substrate of the present invention, a resist layer having a plurality of consecutive lens-shaped concave portions is formed in a surface of a quartz or glass substrate, the lens-shaped concave portion of the resist layer is transferred to the substrate by dry-etching,... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.c.

20090212012 - Critical dimension control during template formation: Thickness of a residual layer may be altered to control critical dimension of features in a patterned layer provided by an imprint lithography process. The thickness of the residual layer may be directly proportional or inversely proportional to the critical dimension of features. Dispensing techniques and material selection may also... Agent: Molecular Imprints

20090212013 - Method for manufacturing electrode foil: A method of manufacturing a electrode foil composed of a valve metal layer of a first valve metal and a metal foil of a second valve metal supporting the valve metal layer, the method includes coating fine particles of the first valve metal with a resin to form composite fine... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20090212014 - Method and system for performing multiple treatments in a dual-chamber batch processing system: A processing system for treating a plurality of substrates is described. The processing system comprises a first batch processing system configured to chemically treat the plurality of substrates and a second batch processing system configured to thermally treat the plurality of substrates. A transfer system is coupled to the first... Agent: Tokyo Electron U.s. Holdings, Inc.

20090212016 - Aligning polymer films: A Method. The method includes forming a substructure, on a substrate, including a feature having a sidewall of a first material and a bottom surface of a second material. Applying a solution including two immiscible polymers and third material to the substructure. The immiscible polymers include a first and second... Agent: Schmeiser, Olsen & Watts

20090212017 - Plasma processing method and plasma processing apparatus: A plasma processing method for performing a plasma process on a substrate to be processed by making a plasma act thereon includes the following sequential steps of making a plasma weaker than one used in the plasma process act on the substrate, applying a DC voltage to an electrostatic chuck... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.c.

20090212015 - Plasma-assisted processing in a manufacturing line: Methods and apparatus are provided for plasma-assisted processing multiple work pieces in a manufacturing line. The manufacturing line can include a plurality of microwave cavities, each of the microwave cavities igniting and sustaining a microwave plasma. Work pieces can be shuttled between the plurality of microwave cavities on a conveyance... Agent: Weingarten, Schurgin, Gagnebin & Lebovici LLP

20090212018 - Apparatus and method for producing microcomponents and use of: An apparatus and the use of such an apparatus and method for producing microcomponents with component structures are presented which are generated in a process chamber on a substrate according to the LIGA method for example and are stripped from the enclosing photoresist with the help of a cooled remote... Agent: Baker & Hostetler LLP

20090212019 - Single-sided high throughput wet etching and wet processing apparatus and method: A processing system includes a plurality of chucks, each of the chucks configured to support a substrate such that a bottom surface of the substrate is exposed, a track configured to guide the plurality of chucks along a continuous path, and a processing arrangement configured to process the bottom surface... Agent: Kenyon & Kenyon LLP

20090212020 - Method for microstructuring solid surfaces: The invention relates to a method for microstructuring solid surfaces by chemical or electrochemical etching, in which the solid surface is treated with an etching fluid with formation of intermediate products which are insoluble or low-soluble in the etching fluid. By additional use of a particle stream, these intermediate products... Agent: Gibson & Dernier L.l.p.

20090212021 - Compositions and methods for selective removal of metal or metal alloy after metal silicide formation: An aqueous metal etching composition useful for removal of metals such as nickel, cobalt, titanium, tungsten, and alloys thereof, after formation of metal silicides via rapid thermal annealing during complementary metal-oxide-semiconductor (CMOS) transistor fabrication. The aqueous metal etching composition is also useful for selective removal of metal silicides and/or metal... Agent: Moore & Van Allen Pllc

20090206051 - Capacitive substrate and method of making same: A capacitive substrate and method of making same in which first and second glass layers are used. A first conductor is formed on a first of the glass layers and a capacitive dielectric material is positioned over the conductor. The second conductor is then positioned on the capacitive dielectric and... Agent: Mark Levy Hinman, Howard & Kattell, LLP

20090206052 - Method for manufacturing a mirror device by means of a plurality of sacrificial layers: A method for manufacturing a device comprising an elastic member on a substrate includes steps of: forming a sacrificial layer by forming a plurality of sacrificial sub-layers on the substrate; forming a plate member in or on the sacrificial layers connected to the substrate and substantially parallel to a top... Agent: Bo-in Lin

20090206053 - Plasma etching method, plasma etching apparatus, control program and computer-readable storage medium: A plasma etching method etching an organic underlayer film formed on a target substrate by using a plasma of a processing gas via a pattered mask layer formed on the underlayer film. The processing gas includes a gaseous mixture of an oxygen-containing gas and a sulfur-containing gas not having oxygen.... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090206054 - Materials and methods for creating imaging layers: The present invention provides patterned features of dimensions of less than 50 nm on a substrate. According to various embodiments, the features may be “Manhattan” style structures, have high aspect ratios, and/or have atomically smooth surfaces. The patterned features are made from polymer brushes grafted to a substrate. In some... Agent: Weaver Austin Villeneuve & Sampson LLP

20090206055 - Plasma processing apparatus and method, and baffle plate of the plasma processing apparatus: In a plasma processing apparatus for performing a plasma process on a target substrate, a baffle plate has an opening through which the process passes and partitions the internal space of the processing container into a plasma process space and an exhaust space, the opening being a single continuous slit.... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090206056 - Method and apparatus for plasma process performance matching in multiple wafer chambers: A multi-station workpiece processing system provides a targeted equal share of a regulated input process gas flow to each active processing station of a plurality of active processing stations using a single gas flow regulator for each gas and irrespective of the number of inactive processing stations.... Agent: Pritzkau Patent Group, LLC

20090206057 - Method to improve mask critical dimension uniformity (cdu): A method and system for fabricating a substrate is disclosed. First, a plurality of process chambers are provided, at least one of the plurality of process chambers adapted to receive at least one plasma filtering plate and at least one of the plurality of process chambers containing a plasma filtering... Agent: Haynes And Boone, LLPIPSection

20090206058 - Plasma processing apparatus and method, and storage medium: A plasma processing apparatus includes a vacuum evacuable processing chamber, a first electrode divided into an outer electrode and an inner electrode, a second electrode, a first and a second high frequency power application unit for applying to the second electrode a first and a second high frequency power having... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090200262 - Method for producing porous microneedles and their use: A method for producing porous microneedles (10) situated in an array on a silicon substrate includes: providing a silicon substrate, applying a first etching mask, patterning microneedles using a DRIE process (“deep reactive ion etching”), removing the first etching mask, at least partially porosifying the Si substrate, the porosification beginning... Agent: Kenyon & Kenyon LLP

20090200263 - Method for metallizing insulating substrates wherein the roughening and etching processes are controlled by means of gloss measurement: The invention relates to a control of etching processes of insulating substrates by means of gloss measurement. By this method a surface roughness can be achieved which leads to good adhesion of metals layers deposited in subsequent metallization steps. This method is particularly suited for the production of printed circuit... Agent: Mcdonnell Boehnen Hulbert & Berghoff LLP

20090200264 - Method for making a spin valve nano-contact entering the constituition of a radio-frequency oscillator: This method for making a nano-contact on a spin valve for the purposes of constituting a radio-frequency oscillator, consists, after deposition of the magnetic stack constituting the spin valve on a lower electrode in depositing on said magnetic stack a metal layer known as a “barrier” layer; in depositing on... Agent: Marjama Muldoon Blasiak & Sullivan LLP

20090200265 - Lead frame fabrication method: The present invention discloses a lead frame fabrication method, wherein a metallic plate is locally fabricated in double sides to form accurately aligned and closely spaced circuits; the metallic plate is also locally fabricated in single side to form patterned trenches; a filling material is filled into the trenches to... Agent: Hdls Patent & Trademark Services

20090200266 - Template pillar formation: Materials for forming an imprint lithography template may be etched at different rates based on physical properties of the layers. Additionally, reflectance of the materials may be monitored to provide substantially uniform erosion of the materials.... Agent: Molecular Imprints

20090200268 - Adjustable gap capacitively coupled rf plasma reactor including lateral bellows and non-contact particle seal: A plasma processing chamber includes a cantilever assembly and at least one vacuum isolation member configured to neutralize atmospheric load. The chamber includes a wall surrounding an interior region and having an opening formed therein. A cantilever assembly includes a substrate support for supporting a substrate within the chamber. The... Agent: Buchanan, Ingersoll & Rooney PC

20090200267 - Injection type plasma treatment apparatus and method: To this end, the injection type plasma treatment apparatus of the present invention comprises a power electrode plate which is provided in the reaction chamber in a state where a dielectric is formed on the power electrode plate; a ground electrode plate which is formed with a plurality of holes,... Agent: Clausen Miller, P.c

20090200269 - Protective coating for a plasma processing chamber part and a method of use: A flexible polymer or elastomer coated RF return strap to be used in a plasma chamber to protect the RF strap from plasma generated radicals such as fluorine and oxygen radicals, and a method of processing a semiconductor substrate with reduced particle contamination in a plasma processing apparatus. The coated... Agent: Buchanan, Ingersoll & Rooney PC

20090200262 - Method for producing porous microneedles and their use: A method for producing porous microneedles (10) situated in an array on a silicon substrate includes: providing a silicon substrate, applying a first etching mask, patterning microneedles using a DRIE process (“deep reactive ion etching”), removing the first etching mask, at least partially porosifying the Si substrate, the porosification beginning... Agent: Kenyon & Kenyon LLP

20090200263 - Method for metallizing insulating substrates wherein the roughening and etching processes are controlled by means of gloss measurement: The invention relates to a control of etching processes of insulating substrates by means of gloss measurement. By this method a surface roughness can be achieved which leads to good adhesion of metals layers deposited in subsequent metallization steps. This method is particularly suited for the production of printed circuit... Agent: Mcdonnell Boehnen Hulbert & Berghoff LLP

20090200264 - Method for making a spin valve nano-contact entering the constituition of a radio-frequency oscillator: This method for making a nano-contact on a spin valve for the purposes of constituting a radio-frequency oscillator, consists, after deposition of the magnetic stack constituting the spin valve on a lower electrode in depositing on said magnetic stack a metal layer known as a “barrier” layer; in depositing on... Agent: Marjama Muldoon Blasiak & Sullivan LLP

20090200265 - Lead frame fabrication method: The present invention discloses a lead frame fabrication method, wherein a metallic plate is locally fabricated in double sides to form accurately aligned and closely spaced circuits; the metallic plate is also locally fabricated in single side to form patterned trenches; a filling material is filled into the trenches to... Agent: Hdls Patent & Trademark Services

20090200266 - Template pillar formation: Materials for forming an imprint lithography template may be etched at different rates based on physical properties of the layers. Additionally, reflectance of the materials may be monitored to provide substantially uniform erosion of the materials.... Agent: Molecular Imprints

20090200268 - Adjustable gap capacitively coupled rf plasma reactor including lateral bellows and non-contact particle seal: A plasma processing chamber includes a cantilever assembly and at least one vacuum isolation member configured to neutralize atmospheric load. The chamber includes a wall surrounding an interior region and having an opening formed therein. A cantilever assembly includes a substrate support for supporting a substrate within the chamber. The... Agent: Buchanan, Ingersoll & Rooney PC

20090200267 - Injection type plasma treatment apparatus and method: To this end, the injection type plasma treatment apparatus of the present invention comprises a power electrode plate which is provided in the reaction chamber in a state where a dielectric is formed on the power electrode plate; a ground electrode plate which is formed with a plurality of holes,... Agent: Clausen Miller, P.c

20090200269 - Protective coating for a plasma processing chamber part and a method of use: A flexible polymer or elastomer coated RF return strap to be used in a plasma chamber to protect the RF strap from plasma generated radicals such as fluorine and oxygen radicals, and a method of processing a semiconductor substrate with reduced particle contamination in a plasma processing apparatus. The coated... Agent: Buchanan, Ingersoll & Rooney PC

20090194502 - Amorphous nitride release layers for imprint lithography, and method of use: A morphous inorganic nitrides are used as release layers on templates for nanoimprint lithography. Such a layer facilitates the release of a template from a cured, hardened composition into which the template has transferred a pattern, by reducing the adhesion energy between the release layer and the cured, hardened composition.... Agent: Daniel E. Johnson IBM Corporation, Almaden Research Center

20090194503 - Method for etching silicon-containing arc layer with reduced cd bias: A method of dry developing a multi-layer mask having a silicon-containing anti-reflective coating (ARC) layer on a substrate is described. The method comprises forming the multi-layer mask on the substrate, wherein the multi-layer mask comprises a lithographic layer overlying the silicon-containing ARC layer. A feature pattern is then formed in... Agent: Tokyo Electron U.s. Holdings, Inc.

20090194504 - Method for producing abrasive composition: The present invention provides a method for producing an abrasive composition, which can control dishing, a method for polishing a substrate using the abrasive composition, and a method for producing a substrate. In the method for producing an abrasive composition, two kinds of preliminary compositions (A) and (B) having different... Agent: Sughrue Mion, PLLC

20090194505 - Vacuum coating techniques: Techniques are described for improving the quality and yield of vacuum-processed substrates. A system can include a tape-like substrate that is supplied by unwind spool to a web guide, tension control roller, and additional idler rolls. The substrate can then enter a coating zone, following an essentially spiral pathway and... Agent: Mcdermott Will & Emery LLP

20090194506 - Plasma processing apparatus and plasma processing method: The invention provides a plasma processing apparatus and a plasma processing method capable of controlling the voltage of the processing substrate with high accuracy, thereby enabling a highly accurate plasma processing. According to the invention, a voltage of the processing substrate is measured using a processing substrate with a voltage... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090194507 - Apparatus and method for cleaning, etching, activation and subsequent treatment of glass surfaces, glass surfaces coated by metal oxides, and surfaces of other si02-coated materials: The present invention relates to a device for cleaning, etching, activation and subsequent treatments of glass surfaces, glass surfaces coated with metal oxides or with organic material layers, SiO2-layer coated materials, and SiO2-layer coated materials with an organic material surface coating by effects of an electrical plasma layer. The invention... Agent: Woodcock Washburn LLP

20090194508 - Substrate plasma processing apparatus and plasma processing method: A substrate plasma processing apparatus includes a substrate holding electrode and a counter electrode which are arranged in a chamber, a high frequency generating device which applies a high frequency of 50 MHZ or higher to the substrate holding electrode, a DC negative pulse generating device which applies a DC... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20090194509 - Substrate treatment apparatus, and substrate treatment method: The substrate treatment apparatus according to the present invention includes a substrate holding mechanism which holds a substrate, a nozzle body having a spout which spouts an etching liquid toward a major surface of the substrate held by the substrate holding mechanism, a nozzle body movement mechanism which moves the... Agent: Ostrolenk Faber Gerb & Soffen