Etching a substrate: processes inventions 07/09

20090188889 - Expandable stents and method for making same: The invention is directed to an expandable stent for implantation in a body lumen, such as an artery, and a method for making it from a single length of tubing. The stent consists of a plurality of radially expandable cylindrical elements generally aligned on a common axis and interconnected by... Agent: Fulwider Patton LLP

20090188890 - Solder void reduction on circuit boards: There is disclosed a method, system, and screen for reducing solder voids on circuit boards. In an embodiment, there is provided a method of reducing solder voids on a circuit board, comprising: locating via holes provided at a conductive landing pad; and covering at least some of the via holes... Agent: Fasken Martineau Dumoulin LLP

20090188891 - Method of manufacturing thermally assisted magnetic head: A method comprises a first multilayer body forming step of forming a first multilayer body on a first cladding layer, the first multilayer body including a core layer and a first polishing stop layer in order from the first cladding layer side; a first multilayer body patterning step of pattering... Agent: Oliff & Berridge, PLC

20090188892 - Method of checking substrate edge processing apparatus: A method of checking a substrate edge processing apparatus, which can accurately check the state of the substrate edge processing apparatus. The thickness of an organic film formed on a surface of a substrate is measured, and a predetermined process in which undesired substance attached to an edge of the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090184088 - Aerogel-bases mold for mems fabrication and formation thereof: The invention is directed to a patterned aerogel-based layer that serves as a mold for at least part of a microelectromechanical feature. The density of an aerogel is less than that of typical materials used in MEMS fabrication, such as poly-silicon, silicon oxide, single-crystal silicon, metals, metal alloys, and the... Agent: Honeywell International Inc. Patent Services

20090184089 - Fabrication of a silicon structure and deep silicon etch with profile control: A method of etching features into a silicon layer with a steady-state gas flow is provided. An etch gas comprising an oxygen containing gas and a fluorine containing gas is provided. A plasma is provided from the etch gas. Then, the flow of the etch gas is stopped.... Agent: Beyer Law Group LLP

20090184090 - Thin-film assembly and method for producing said assembly: A thin-film assembly (1) including a substrate (2) and at least one electronic thin-film component (8) applied on the substrate by thin-film technology, wherein a base electrode (4) is provided on the substrate, on which base electrode thin-film layers (21) forming part of the thin-film component are arranged together with... Agent: Ladas & Parry LLP

20090184091 - Diamond-like carbon (dlc) hardmask and methods of fabrication using same: A method according to one embodiment comprises forming a thin film layer; forming a hardmask layer above the thin film layer, the hardmask layer comprising laminated layers of diamond-like carbon; removing a portion of the hardmask layer; and removing a portion of the thin film layer that is unprotected by... Agent: Zilka-kotab, PC- Hit

20090184092 - Palladium-selective etching solution and method for controlling etching selectivity: Disclosed is an iodine-based etching solution for etching a material wherein palladium and gold coexist. This etching solution contains at least one additive selected from the group consisting of nitrogen-containing five-membered ring compounds, alcohol compounds, amide compounds, ketone compounds, thiocyanic acid compounds, amine compounds and imide compounds. The etching rate... Agent: Wolf Greenfield & Sacks, P.C.

20090178999 - Process for producing air gaps in microstructures: P

20090179000 - Method of manufacturing inkjet printhead and inkjet printhead manufactured using the same: A method of manufacturing an inkjet printhead, in which a solvent included in a positive photoresist composition or in a non-photosensitive soluble polymer composition which is used to form a sacrificial layer has a different polarity from that of a solvent included in a negative photoresist composition that is used... Agent: Stanzione & Kim, LLP

20090179002 - Method of forming polymer features by directed self-assembly of block copolymers: Disclosed are methods of forming polymer structures comprising: applying a solution of a block copolymer assembly comprising at least one block copolymer to a neutral substrate having a chemical pattern thereon, the chemical pattern comprising alternating pinning and neutral regions that are chemically distinct and have a first spatial frequency... Agent: Cantor Colburn, LLP - IBM Arc Division

20090179001 - Method of use of epoxy-containing cycloaliphatic acrylic polymers as orientation control layers for block copolymer thin films: Disclosed herein is a method of controlling the orientation of microphase-separated domains in a block copolymer film, comprising forming an orientation control layer comprising an epoxy-containing cycloaliphatic acrylic polymer on a surface of a substrate, irradiating and/or heating the substrate to crosslink the orientation control layer, and forming a block... Agent: Cantor Colburn, LLP - IBM Arc Division

20090179003 - Substrate processing method, substrate processing apparatus and recording medium: An ashing process in which an etching mask is removed through ashing by supplying hydrogen radicals toward a wafer W being heated to a predetermined temperature and a restoration process in which the film quality of a low dielectric constant insulating film having been damaged during an etching process is... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090179004 - Pattern formation method: A pattern formation method according to one embodiment includes: depositing a first C-containing film and a first inorganic layer pattern above a workpiece, the first inorganic layer pattern being comprised of linear patterns arranged in parallel and having a longitudinal direction in a predetermined direction; depositing a second C-containing film... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.

20090179005 - Nanotube processing employing solid-condensed-gas-layers: In a method for processing a nanotube, a vapor is condensed to a solid condensate layer on a surface of the nanotube and then at least one selected region of the condensate layer is locally removed by directing a beam of energy at the selected region. The nanotube can be... Agent: Theresa A Lober T.a. Lober Patent Services

20090179007 - Liquid treatment method and storage system: A plurality of process liquid supply nozzles 10 are arranged at different levels on right and left sides of a semiconductor wafer W in a process bath 1. A discharge port of each of the nozzles 10 is directed toward the semiconductor wafer W. In accordance with a predetermined procedure,... Agent: Morrison & Foerster, LLP

20090179006 - Method and device for a forced wet-chemical treatment of surfaces: In a method for wet-chemical treatment of surfaces of a material. a pulse-like spray jet of treatment fluid is directed against the surface of the material. This causes a pronounced impact action against the base of a structure to be processed so that the amount of treatment time which is... Agent: Henry M Feiereisen, LLC Henry M Feiereisen

20090179008 - Substrate treating apparatus and method: A substrate treating apparatus for treating substrates with a treating solution having a mixture of a chemical and a diluent. The apparatus includes a treating tank for storing the treating solution, a heating device for heating the treating solution, a supply pipe for supplying a gas at a fixed flow... Agent: Ostrolenk Faber Gerb & Soffen

20090173712 - Method of fabricating cantilever type probe and method of fabricating probe card using the same: Disclosed is a method of fabricating a cantilever type probes. According to this method, after forming grooves each in tip portion and dummy tip portion regions of a substrate, the tip portion and dummy tip portion are formed with filling the grooves of the tip portion and dummy tip portion... Agent: Jenkins, Wilson, Taylor & Hunt, P. A.

20090173713 - Method for manufacturing metallic panel having multilayer arrays of micropores: A method for manufacturing a metallic panel having multilayer arrays of micropores includes the steps of: preparing a metallic thin plate first; forming a plurality of micropores and hollowed portions on the metallic thin plate with the hollowed portion forming a key body; arranging the plurality of micropores to form... Agent: Hdls Patent & Trademark Services

20090173714 - Method of manufacturing magnetic head for perpendicular magnetic recording: A magnetic head comprises: an encasing layer made of a nonmagnetic material and having a groove that opens in the top surface; a nonmagnetic metal layer made of a nonmagnetic metal material, disposed on the top surface of the encasing layer, and having a penetrating opening that is contiguous to... Agent: Oliff & Berridge, PLC

20090173715 - Light source device, substrate treating device, and substrate treating method: A light source device is formed by a plasma formation chamber including a plasma formation region where plasma is formed by electrodeless discharge to generate light and an optical window defining the lower end of the plasma region in the plasma formation chamber and transmitting the light. A microwave transmitting... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090173716 - Lift-off patterning processes employing energetically-stimulated local removal of solid-condensed-gas layers: The invention provides a method for forming a patterned material layer on a structure, by condensing a vapor to a solid condensate layer on a surface of the structure and then localized removal of selected regions of the condensate layer by directing an ion beam at the selected regions, exposing... Agent: Theresa A Lober T.a. Lober Patent Services

20090173717 - Composition and method for polishing nickel-phosphorous-coated aluminum hard disks: The invention provides a chemical-mechanical polishing composition consisting essentially of flumed alumina, alpha alumina, silica, a nonionic surfactant, an additive compound selected from the group consisting of glycine, alanine, iminodiacetic acid, and maleic acid, hydrogen peroxide, and water. The invention further provides a method of chemically-mechanically polishing a substrate comprising... Agent: Steven Weseman Associate General Counsel, I.p.

20090173718 - Method of damaged low-k dielectric film layer removal: An apparatus, system and method for removing a damaged material from a low-k dielectric film layer include identifying a control chemistry, the control chemistry configured to selectively remove the damaged material from the low-k dielectric film layer, the damaged material being in a region where a feature was formed through... Agent: Martine Penilla & Gencarella, LLP

20090166317 - Method of processing substrate by imprinting: A method of processing a substrate includes applying a resin on the substrate, imprinting a pattern of a mold onto the resin, the pattern including protrusions and recesses, forming a protective layer over the resin, etching the protective layer so that the protrusions of the pattern imprinted in the resin... Agent: Fitzpatrick Cella Harper & Scinto

20090166318 - Method of fabricating an integrated circuit: A method of fabricating an integrated circuit includes providing a hard mask that includes at least one first layer and one second layer. An etching step is patterned using the hard mask, and a removal step is performed using an etchant in order to at least partially remove the first... Agent: Slater & Matsil, L.L.P.

20090166319 - System and method for performing high flow rate dispensation of a chemical onto a photolithographic component: A system and method for performing high flow rate dispensation of a chemical onto a photolithographic component are disclosed. The system and method includes providing a photolithographic component in a manufacturing tool. The photolithographic is positioned at a predetermined distance from a nozzle dispensing a chemical. Dispensation of a chemical... Agent: Baker Botts L.L.P. Patent Department

20090166320 - Selective electroless plating for electronic substrates: In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including forming a film on a surface of a substrate, the film designed to prevent the seeding of an electroless plating catalyst, laser ablating the surface of the substrate through the film... Agent: Intel Corporation C/o Cpa Global

20090166322 - Magneto-resistive element: A magneto-resistive element according to an aspect of the present invention includes a free layer whose magnetized state changes and a pinned layer whose magnetized state is fixed. The free layer comprises first and second ferromagnetic layers and a non-magnetic layer which is arranged between the first and second ferromagnetic... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090166323 - Method of manufacturing magnetic recording medium: According to one embodiment, a method of manufacturing a magnetic recording medium includes depositing a magnetic recording layer and a sacrifice layer on a substrate, patterning the sacrifice layer and magnetic recording layer to form protruded magnetic patterns and sacrifice patterns, depositing a nonmagnetic material in recesses between the magnetic... Agent: Pillsbury Winthrop Shaw Pittman, LLP

20090166321 - Self-assembly structures used for fabricating patterned magnetic media: Methods of defining servo patterns and data patterns for forming patterned magnetic media are described. For one method, a lithographic process is performed to define a servo pattern in servo regions on a substrate. The lithographic process also defines a first data pattern in data regions of the substrate. The... Agent: Duft Bornsen & Fishman, LLP

20090166324 - Full-wafer backside marking process: Embodiments of silicon semiconductor wafers and die having surface marks are described herein. A laser, or other marking tool, may be used to mark, substantially all of a surface of an IC wafer with surface marks, such as microdimples, that camouflage or reduce or eliminate the visibility of any surface... Agent: Intel/bstz Blakely Sokoloff Taylor & Zafman LLP

20090166325 - Method for producing a photonic crystal: b

20090166326 - Edge electrodes with dielectric covers: The embodiments provide apparatus and methods for removal of etch byproducts, dielectric films and metal films near the substrate bevel edge, and chamber interior to avoid the accumulation of polymer byproduct and deposited films and to improve process yield. In an exemplary embodiment, a plasma processing chamber configured to clean... Agent: Martine Penilla & Gencarella, LLP

20090166327 - Method for in-situ refurbishing a ceramic substrate holder: Method for operating a processing system and refurbishing a ceramic substrate holder within a process chamber of the processing system are described. The method includes plasma processing one or more substrates on the ceramic substrate holder, where the processing causes erosion of a nitride material of the ceramic substrate holder.... Agent: Tokyo Electron U.s. Holdings, Inc.

20090166328 - Plasma etching method: A diluent gas that is more likely to be decomposed than an etching gas is used to generate a plasma. The etching gas is thereafter introduced into a plasma processing reaction chamber and the flow rate is adjusted so that the flow rate of the etching gas is increased while... Agent: Nixon & Vanderhye, PC

20090166329 - Process and marker installation for an object: The invention relates to a method and an installation for identifying an object. An identification mark (12) is made on the actual object using electrical discharges (28) between a metal tip (21), such as that of a local-probe microscope, and the substrate (22) formed by the object. The discharges (28)... Agent: Young & Thompson

20090166330 - Method of etching a device using a hard mask and etch stop layer: A method of etching a device in one embodiment includes providing a silicon carbide substrate, forming a silicon nitride layer on a surface of the silicon carbide substrate, forming a silicon carbide layer on a surface of the silicon nitride layer, forming a silicon dioxide layer on a surface of... Agent: Maginot, Moore & Beck, LLP Chase Tower

20090166331 - Dynamic hard magnet thickness adjustment for reduced variation in free layer stabilization field in a magnetoresistive sensor: A method for manufacturing a current perpendicular to plane magnetoresistive sensor that allows for dynamic adjustment of free layer biasing to compensate for variations in thickness of an electrically insulating layer that separates the hard bias layers from the free layer. During fabrication of the sensor, the actual thickness of... Agent: Zilka-kotab, PC- Hit