Etching a substrate: processes inventions 06/09

20090159558 - Method of manufacturing an integrated circuit: A method of manufacturing an integrated circuit including a memory device that includes the following processes: forming a mask layer structure above a composite structure including a resistivity changing layer and an electrode layer disposed above the resistivity changing layer; partially patterning the mask layer structure using a first substance;... Agent: Slater & Matsil, L.L.P.

20090159559 - Method of manufacturing multilayer printed circuit board having buried holes: A method for manufacturing a multilayer printed circuit board includes the following steps. A number of laminate units are provided. Each of the laminate units includes an electrically conductive layer with a circuit pattern defined therein, and a release layer releasably attached to the electrically conductive layer. A number of... Agent: PCe Industry, Inc. Att. Steven Reiss

20090159560 - Selective etch chemistries for forming high aspect ratio features and associated structures: An interlevel dielectric layer, such as a silicon oxide layer, is selectively etched using a plasma etch chemistry including a silicon species and a halide species and also preferably a carbon species and an oxygen species. The silicon species can be generated from a silicon compound, such as SixMyHz, where... Agent: Knobbe Martens Olson & Bear LLP

20090159561 - Integrated device technology using a buried power buss for major device and circuit advantages: A method for providing an improved integrated circuit device is disclosed. The method comprises the steps of providing active and passive areas in the substrate, providing a plurality of slots in the substrate after providing the active and passive areas, and oxidizing the plurality of slots. The method further comprises... Agent: Sawyer Law Group LLP

20090159562 - Method for fabricating magnetic tunnel junction device: A method for fabricating a magnetic tunnel junction device includes forming a first magnetic layer, a dielectric layer, a second magnetic layer and a capping layer, selectively etching the capping layer and the second magnetic layer to form a first pattern, forming a short prevention layer on a sidewall of... Agent: Townsend And Townsend And Crew, LLP

20090159563 - Method for forming magnetic tunnel junction cell: A method for forming a magnetic tunnel junction cell includes forming a pinning layer, a pinned layer, a dielectric layer and a free layer over a first electrode, forming a second electrode on the free layer, etching the free layer and the dielectric layer using the second electrode as an... Agent: Townsend And Townsend And Crew, LLP

20090159564 - Ink jet head having an electrostatic actuator and manufacturing method of the same: An inkjet head having an electrostatic actuator and a manufacturing method of the same are disclosed. The inkjet head having an electrostatic actuator, comprising a stator, on which is formed a plurality of comb pattern shaped first protrusion parts and second protrusion parts in both directions, and a rotor consisting... Agent: Stanzione & Kim, LLP

20090159565 - Method to pattern metallized substrates using a high intensity light source: A method for delineating a metallization pattern in a layer of sputtered aluminum or sputtered copper using a broad spectrum high intensity light source. The metal is deposited on a polymeric substrate by sputtering, so that it has a porous nanostructure. An opaque mask that is a positive representation of... Agent: Leveque Intellectual Property Law, P.C.

20090159566 - Method and apparatus for controlling temperature of a substrate: A pedestal assembly and method for controlling temperature of a substrate during processing is provided. In one embodiment, method for controlling a substrate temperature during processing includes placing a substrate on a substrate pedestal assembly in a vacuum processing chamber, controlling a temperature of the substrate pedestal assembly by flowing... Agent: Patterson & Sheridan, LLP - - Appm/tx

20090159567 - Polymer solution for nanoimprint lithography to reduce imprint temperature and pressure: An improved method of forming features on substrates by imprinting is provided. In the method, a polymer solution that contains at least one polymer dissolved in at least one polymerizable monomer and the polymer solution is deposited on the substrate to form a liquid film thereon. Further, the liquid film... Agent: Hewlett Packard Company

20090152233 - Printed circuit board having chip package mounted thereon and method of fabricating same: Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the contact portion of the internal layer. A chip package is mounted on the PCB... Agent: Darby & Darby P.C.

20090152235 - Method of manufacturing a perpendicular magnetic write head with stepped trailing magnetic shield with electrical lapping guide control: A method for manufacturing a magnetic write head having a stepped trailing shield. The stepped trailing shield is formed by forming a non-magnetic bump over a write pole prior to electroplating a wrap-around magnetic shield. The method allows the location of the front edge of the bump relative to the... Agent: Zilka-kotab, PC- Hit

20090152234 - Process for self-aligned flare point and shield throat definition prior to main pole patterning: A method for manufacturing a magnetic write head having a write pole with a flared step feature that defines a secondary flare point. The method involves depositing a magnetic write pole material on a substrate and then depositing a magnetic material over the write pole material followed by a non-magnetic... Agent: Zilka-kotab, PC- Hit

20090152236 - Method for manufacturing liquid ejecting head and liquid ejecting apparatus: A method for manufacturing a liquid ejecting head includes performing a dry cleaning process of cleaning the surface of a wire side of a second substrate by dry etching of a plasma etching mode, and performing a liquid cleaning process of cleaning the surface of a pressure generation chamber side... Agent: Townsend And Townsend And Crew, LLP

20090152237 - Ceramic-copper foil bonding method: A ceramic-copper foil bonding method includes wet-oxidizing a copper foil such that a surface of the copper foil is oxidized to a copper oxide layer, contacting the copper oxide layer with a surface of a ceramic substrate, and bonding the copper oxide layer of the copper foil to the surface... Agent: Townsend And Townsend And Crew, LLP

20090152239 - Process for producing a chip using a mold: A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate 2010 formed of a first material and an alignment mark... Agent: Fitzpatrick Cella Harper & Scinto

20090152238 - Substrate processing method and substrate processing system: The surface of a resist pattern R formed on a semiconductor wafer W by an exposure process and a developing process is coated with water molecules m. A solvent vapor of a water-soluble solvent, such as NMP, is spouted on the surface of the resist pattern R coated with the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090152240 - Chemical-mechanical polishing composition and method for using the same: The invention provides methods of polishing a noble metal-containing substrate with one of two chemical-mechanical polishing compositions. The first chemical-mechanical polishing composition comprises (a) an abrasive comprising α-alumina, (b) about 0.05 to about 50 mmol/kg of ions of calcium, strontium, barium, or mixtures thereof, and (c) a liquid carrier comprising... Agent: Steven Weseman Associate General Counsel, I.p.

20090152241 - Plasma etching apparatus and plasma etching method: The invention provides a method and apparatus for performing plasma etching to form a gate electrode on a large-scale substrate while ensuring the in-plane uniformity of the CD shift of the gate electrode. The present invention measures a radical density distribution of plasma in the processing chamber, feeds processing gases... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090152242 - Plasma treatment apparatus and plasma treatment method: The invention provides a plasma treatment apparatus or a plasma treatment method having a high productivity while maintaining a stable treatment performance. In a plasma treatment apparatus feeding a plurality of gases fed into the treatment chamber and treating a sample arranged within the treatment chamber by a plasma formed... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090152243 - Plasma processing apparatus and method thereof: [Means for Solving] A plasma processing apparatus 1, in which microwave is propagated into a dielectric 32 provided on an upper surface of a processing chamber 4 via plural slots 70 formed on a lower surface of a waveguide 35 and a processing gas supplied in the processing chamber 4... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090145877 - Method for controlling adi-aei cd difference ratio of openings having different sizes: A method for controlling an ADI-AEI CD difference ratio of openings having different sizes is described. The openings are formed through a silicon-containing material layer, an etching resistive layer and a target material layer in turn. Before the opening etching steps, at least one of the opening patterns in the... Agent: J C Patents, Inc.

20090145879 - System and method for commercial fabrication of patterned media: A system is provided for etching patterned media disks for hard drive. The modular system may be tailored to perform specific processes sequences so that a patterned media disk is fabricated without removing the disk from vacuum environment. In some sequence the magnetic stack is etched while in other the... Agent: Nixon Peabody, LLP

20090145878 - Thin-film patterning method for magnetoresistive device: The thin-film patterning method for a magnetoresistive device comprises forming a functional layer on a substrate; forming a first mask layer above the functional layer; forming a patterned resist on the first mask layer; etching the first mask layer by using the resist; removing the resist; forming a second mask... Agent: Oliff & Berridge, PLC

20090145880 - Liquid jet-guided etching method for removing material from solids and also use thereof: The present invention relates to a method for removing material from solids by liquid jet-guided etching. The method according to the invention is used in particular for cutting, microstructuring, doping of wafers or also the metallisation thereof.... Agent: Gauthier & Connors, LLP

20090145881 - System and method for dual-sided sputter etch of substrates: A system is provided for etching patterned media disks. A movable non-contact electrode is utilized to perform sputter etch. The electrode moves to near contact distance to, but not contacting, the substrate so as to couple RF energy to the disk. The material to be etched may be metal, e.g.,... Agent: Nixon Peabody, LLP

20090139957 - Group iii-nitride layers with patterned surfaces: A fabrication method produces a mechanically patterned layer of group III-nitride. The method includes providing a crystalline substrate and forming a first layer of a first group III-nitride on a planar surface of the substrate. The first layer has a single polarity and also has a pattern of holes or... Agent: Alcatel-lucent Usa Inc. Docket Adminstrator - Room 2f -192

20090139958 - Fenceless main pole definition for advanced perpendicular magnetic write head: A method for manufacturing a magnetic write head for perpendicular magnetic recording. The method includes forming a write pole using a mask that includes a hard mask layer deposited over the write pole laminate material, and a thick, physically robust image transfer layer. The image transfer layer can be a... Agent: Zilka-kotab, PC- Hit

20090139959 - Substrate for magnetic recording medium and method for manufacturing same: Provided is a surface-treated substrate in which the roughness of the surface of the substrate is controlled. The surface-treated substrate can form a magnetic recording medium in which head flying stability is maintained and which has a magnetic film that can achieve high recording densities. Also provided is a method... Agent: Myers Bigel Sibley & Sajovec

20090139960 - Method of fabricating an apparatus of fabricating an flat panel display device and method for fabricating flat panel display device: A method of fabricating an apparatus of fabricating a flat panel display device and method of fabricating flat panel display device is disclosed, which enables simplification of process by performing a patterning process without a photo process, the method for fabricating an apparatus of fabricating flat panel display device comprising,... Agent: Brinks Hofer Gilson & Lione

20090139961 - Metal film protection during printhead fabrication with minimum number of mems processing steps: A method of fabricating a printhead having a hydrophobic ink ejection face, the method comprising the steps of: (a) providing a partially-fabricated printhead comprising a plurality of nozzle chambers and a nozzle plate having relatively hydrophilic nozzle surface, the nozzle surface at least partially defining the ink ejection face of... Agent: Silverbrook Research Pty Ltd

20090139962 - Methods and systems for controlling accumulation of electrical charge during semiconductor etching processes: A method and system are provided for controlling the accumulation of electrical charge during a semiconductor plasma etching process performed in a plasma etching chamber. The bias voltage supplied to the plasma etching chamber is modulated by a bias power modulation circuit to control the accumulation of electrical charge and... Agent: Smith Frohwein Tempel Greenlee Blaha, LLC

20090139963 - Multiple frequency pulsing of multiple coil source to control plasma ion density radial distribution: A method is provided for processing a workpiece supported on a support surface in a chamber of a plasma reactor. A process gas is introduced into the chamber and a plasma is generated with pulse-modulated RF power. The method comprises successively repeating the following cycle: (a) concentrating the plasma in... Agent: Law Office Of Robert M. Wallace