Etching a substrate: processes inventions 05/09

20090134118 - Method of manufacturing printed circuit board: A method of manufacturing a printed circuit board is disclosed. The method may include: stacking a cover layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove by removing portions of the cover... Agent: Staas & Halsey LLP

20090134119 - Film-forming material and method of forming pattern: A film-forming material that is capable of forming, at a low temperature, a film having a high degree of etching resistance and a high etching selectivity ratio relative to an organic film, as well as a method of forming a pattern that uses the film-forming material. The film-forming material includes... Agent: Knobbe Martens Olson & Bear LLP

20090134120 - Plasma processing method and plasma processing apparatus: A plasma processing apparatus in which consumption of expensive krypton and xenon gases is suppressed as much as possible while reducing damage on a workpiece during plasma processing. In plasma processing of a substrate using a rare gas, two or more kinds of different rare gases are employed, and an... Agent: Foley And Lardner LLP Suite 500

20090134121 - Plasma processing apparatus and method: There is provided a plasma processing apparatus including a plasma generating unit for generating a plasma in a processing chamber in which a set processing is performed on a substrate serving as an object to be processed. The plasma processing apparatus further includes a particle moving unit for electrostatically driving... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090134122 - Copper-passivating cmp compositions and methods: The present invention provides chemical-mechanical polishing (CMP) methods and compositions for polishing copper-containing substrates. The methods of the present invention entail abrading a surface of a copper-containing substrate with a CMP composition of the invention, preferably in the presence of an oxidizing agent (e.g., hydrogen peroxide). The CMP compositions of... Agent: Steven Weseman Associate General Counsel, I.p.

20090127224 - Method of producing a nano-structure and method of producing a magnetic recording medium: According to an aspect of an embodiment, a manufacturing method for a nano-structure comprises the steps of: arranging nano-particles on a substrate having a surface provided with a projecting pattern and a recessing pattern; forming cavities under the nano-particles; and polishing the surfaces in which the cavities are formed.... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20090127225 - Measurement of etching: Methods and apparatus for determining the extent of etching in material by locating a detector element adjacent to a portion of the material that is to be etched. The width of the element varies. The resistance of the element is measured upon etching the portion.... Agent: Hewlett Packard Company

20090127226 - Process for producing self-supporting titanium and nickel layers: A process for producing a self-supporting layer made of a titanium and nickel alloy with superelastic and/or shape memory properties has the following steps: a substrate entirely or at least mainly made of silicon is provided, a layer of said alloy is applied to a surface of the substrate, the... Agent: Marshall, Gerstein & Borun LLP (fisher)

20090127227 - Plasma processing apparatus and plasma processing method: Provided are a plasma processing apparatus and a plasma processing method, by which plasma damage is reduced during processing. At the time of performing desired plasma processing to a substrate (5), a process chamber (2) is supplied with an inert gas for carrying in and out the substrate (5), pressure... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20090127228 - Structured method: A method of structuring multicrystalline silicon surfaces comprises the provision of a texturing solution, the application of the texturing solution to a surface of a semiconductor substrate to be structured and the heating of the texturing solution to a texturing temperature, wherein the texturing solution comprises at least a portion... Agent: Browdy And Neimark, P.l.l.c. 624 Ninth Street, Nw

20090120901 - Patterned electrodes with reduced residue: Aspects of the present invention provide patterned electrodes with substantially reduced or removed residue. Aspects of the present invention for removing residue are applicable to any fabricated structure including transparent electrodes. By substantially reducing or removing residue typically associated with methods used to form patterned electrodes, an improvement in performance... Agent: Pearl, Cohen, Zedek & Latzer, LLP

20090120902 - Method of fabricating filtered printhead ejection nozzle: A method of fabricating a printhead ejection nozzle is provided which includes depositing sacrificial material on a planar substrate form a scaffold of the sacrificial material on the substrate, defining openings in the sacrificial material to the plane of the substrate at positions for sidewalls of a nozzle chamber and... Agent: Silverbrook Research Pty Ltd

20090120903 - Method of multi-stage substrate etching and terahertz oscillator manufactured using the same method: A method of multi-stage substrate etching is provided. The method comprises the steps of: forming a first mask pattern on one surface of a first substrate; forming a hole by etching the first substrate using the first mask pattern as an etching mask; forming a second mask pattern on one... Agent: Harness, Dickey & Pierce, P.L.C

20090120904 - Method and device for manufacturing structure having pattern, and method for manufacturing mold: A structure having a pattern is manufactured. An elastically deformable process target is elastically deformed in an inplane direction from a first state. A first pattern is formed on the process target deformed. The elastically deformed process target is made close to or returned to the first state, thereby to... Agent: Fitzpatrick Cella Harper & Scinto

20090120905 - Sacrificial compositions and methods of fabricating a structure using sacrificial compositions: Compositions, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary composition, among others, includes a polymer and a catalytic amount of a negative tone photoinitiator.... Agent: The Webb Law Firm, P.C.

20090114618 - Method of making hierarchical articles: Provided is a method of making hierarchical structures that contain nanofeatures and microstructures. The method includes adding the nanofeatures to existing microstructures using nanoparticles as an etch mask.... Agent: 3m Innovative Properties Company

20090114619 - Wet etching method and wet etching apparatus: A fine pattern is formed on a surface of a processing object without using photoresist. A wet etching for the processing object in an area to which ultraviolet light is applied is performed by bringing a solution in which nitrous oxide (N2O) is dissolved into contact with the processing object... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090114620 - Atom probe electrode treatments: A method for treating an atom probe electrode (120), which comprises the steps of providing an atom electrode (120) having a surface (123) and an aperture (122); and removing material (604) from the surface (123) to reduce a potential of the atom probe electrode creating a non-uniformity in an electric... Agent: Perkins Coie LLP Patent-sea

20090114621 - Method and device for the plasma treatment of materials: The invention relates to a method and a device (1) for the treatment of materials, in particular continuous materials such as wires, rods, tubes, etc. The device comprises a heating chamber (3) for heating a supplied material (8) during its movement through the heating chamber (3) and a plasma reactor... Agent: Workman Nydegger 1000 Eagle Gate Tower