Etching a substrate: processes inventions 04/09

20090107949 - Micro-oscillating element and method of making the same: A micro-oscillating element includes a frame, a movable functional portion, and a torsional joint for joining the frame and the functional portion. The micro-oscillating element also includes first and second comb-tooth electrodes for generation of the driving force for the oscillating motion of the movable functional portion about the torsional... Agent: Kratz, Quintos & Hanson, LLP

20090107950 - forming surface features using self-assembling masks: A method for producing surface features and an etch masking method. A combination is provided of a block copolymer and additional material. The block copolymer includes a first block of a first polymer covalently bonded to a second block of a second polymer. The additional material is miscible with the... Agent: Schmeiser, Olsen & Watts

20090107951 - Method of packaging an led array module: A method for packaging an LED array module includes: forming at least one concave groove on a drive IC structure; arranging at least one LED array in the at least one concave groove; solidifying a plurality of liquid conductive materials to form a plurality of conductive elements that is electrically... Agent: Rosenberg, Klein & Lee

20090107952 - Sacrificial compositions and methods of fabricating a structure using sacrificial compositions: Compositions, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary composition, among others, includes a polymer and a catalytic amount of a negative tone photoinitiator.... Agent: The Webb Law Firm, P.C.

20090107953 - Methods for forming surface features using self-assembling masks: A method for producing surface features and an etch masking method. A combination is provided of a block copolymer and additional material. The block copolymer includes a first block of a first polymer covalently bonded to a second block of a second polymer. The additional material is miscible with the... Agent: Schmeiser, Olsen & Watts

20090107954 - Method for controlling adi-aei cd difference ratio of openings having different sizes: A method for controlling ADI-AEI CD difference ratios of openings having different sizes is provided. First, a first etching step using a patterned photoresist layer as a mask is performed to form a patterned Si-containing material layer and a polymer layer on sidewalls thereof. Next, a second etching step is... Agent: J C Patents, Inc.

20090107955 - Offset liner for chamber evacuation: The present invention generally includes a chamber liner spaced from a chamber wall to permit processing gases to be pulled between the chamber liner and the chamber wall when withdrawing gases from the processing chamber. When the vacuum pump is below the susceptor, processing gases will be drawn below the... Agent: Patterson & Sheridan, LLP - - Appm/tx

20090107956 - Thermal gradient control of high aspect ratio etching and deposition processes: A technique is described whereby temperature gradients are created within a semiconductor wafer. Temperature sensitive etching and/or deposition processes are then employed. These temperature sensitive processes proceed at different rates in regions with different temperatures. To reduce pinch off in etching processes, a temperature sensitive etch process is selected and... Agent: International Business Machines Corporation Dept. 18g

20090101623 - Etching processes used in mems production: The efficiency of an etching process may be increased in various ways, and the cost of an etching process may be decreased. Unused etchant may be isolated and recirculated during the etching process. Etching byproducts may be collected and removed from the etching system during the etching process. Components of... Agent: Knobbe, Martens, Olson & Bear, LLP

20090101622 - Method for fabricating variable parallel plate capacitors: A method for fabricating micromachined structures is provided. A structure including a dielectric layer, a metal layer and a passivation layer is formed, wherein the dielectric layer has a via thereon. An etching window is formed on the passivation layer. An etching solution is poured into the via through the... Agent: Lowe Hauptman Ham & Berner, LLP

20090101624 - Method for manufacturing magnetic recording medium: A method for efficiently manufacturing a magnetic recording medium by filling concave portions of a concavo-convex patterned recording layer with a filler to provide sufficient surface flatness is provided. A cladding is etched by a dry etching method in which an etch rate of the cladding is equal to or... Agent: Oliff & Berridge, PLC

20090101625 - Silicon carbide particles, methods of fabrication, and methods using same: Improved silicon carbide particles, improved silicon carbide abrasive particles, and abrasive slurry compositions for use chemical mechanical planarization (CMP) processes. The particles can comprise nano-sized silicon carbide particles, particularly silicon carbide particles having a surface chemistry similar to silica.... Agent: Edwards Angell Palmer & Dodge LLP

20090101626 - Selective etching bath methods: An etching method. The method includes etching a first plurality of silicon wafers in a first enchant, each silicon wafer having SiO2 and Si3N4 deposited thereon, where the etching includes dissolving a quantity of the SiO2 and a quantity of the Si3N4 in the first echant. A quantity of insoluble... Agent: Schmeiser, Olsen & Watts

20090095704 - Patterning cnt emitters: An industrial scale method for patterning nanoparticle emitters for use as cathodes in a display device is disclosed. The low temperature method can be practiced in high volume applications, with good uniformity of the resulting display device. The method steps involve deposition of CNT emitter material over an entire surface... Agent: Fish & Richardson P.C.

20090095705 - Process for manufacturing an interaction structure for a storage medium: A process manufactures an interaction structure for a storage medium. The process includes forming a first interaction head provided with a first conductive region having a sub-lithographic dimension. The step of forming a first interaction head includes: forming on a surface a first delimitation region having a side wall; depositing... Agent: Seed Intellectual Property Law Group PLLC

20090095706 - Selective patterning of multilayer systems for opv in a roll to roll process: Methods of using etching pastes to form a pattern on an electrode of a solar cell, as well as related articles, systems, and components, are disclosed.... Agent: Fish & Richardson PC

20090095707 - Method and apparatus for processing sub-micron write head flare definition: A method and apparatus for processing sub-micron write head flare definition is provided. The method for processing a perpendicular magnetic head forms a portion of a perpendicular write head, where the portion of the write head includes a first pole layer, a coil layer, a second pole layer and a... Agent: Merchant & Gould PC

20090095708 - Method for manufacturing liquid discharge head: A method for manufacturing a liquid discharge head including a substrate on which supply ports for supplying a liquid are provided, includes forming a first supply port among the supply ports by performing crystal anisotropic etching on the substrate from one surface of the substrate, and forming a plurality of... Agent: Canon U.s.a. Inc. Intellectual Property Division

20090095709 - Method of etching ink supply channel with hydrophilic sidewalls: A method of etching an ink supply channel for an inkjet printhead. The method comprises simultaneous etching and passivation processes. A single etching and passivating gas plasma comprises: (a) a passivating gas comprising oxygen; (b) an inert sputtering gas; (c) a fluorinated etching gas; and (d) a hydrophilizing dopant. The... Agent: Silverbrook Research Pty Ltd

20090095710 - Method for continual preparation of polycrystalline silicon using a fluidized bed reactor: There is provided a method for continual preparation of granular polycrystalline silicon using a fluidized bed reactor, enabling a stable, long-term operation of the reactor by effective removal of silicon deposit accumulated on the inner wall of the reactor tube. The method comprises (i) a silicon particle preparation step, wherein... Agent: Frommer Lawrence & Haug

20090095711 - Microfabrication apparatus and device manufacturing method: A microfabrication apparatus for pressing an original plate including a pattern down on a substrate to transfer the pattern on the substrate includes a first measurement unit for measuring relative positional displacement between the substrate and the plate above the substrate, a position correction unit for correcting relative position between... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20090095712 - Flattening method and flattening apparatus: A flattening method, by utilizing the advantages of the CARE method and making up for the disadvantages, can perform removal processing of a surface of a workpiece at a sufficient processing rate and can provide a processed surface having enhanced flatness without leaving damage in the processed surface. A flattening... Agent: Wenderoth, Lind & Ponack, L.L.P.

20090095713 - Novel methods for cleaning ion implanter components: A method and apparatus for cleaning residue from components of an ion source region of an ion implanter used in the fabrication of microelectronic devices. To effectively remove residue, the components are contacted with a gas-phase reactive halide composition for sufficient time and under sufficient conditions to at least partially... Agent: Intellectual Property / Technology Law

20090095714 - Method and system for low pressure plasma processing: Method and system for treating a substrate with plasma under low pressure conditions is described. A plasma processing system comprises a plasma generation chamber having a first plasma region and a process chamber having a second plasma region disposed downstream of the first plasma region. A plasma generation system is... Agent: Tokyo Electron U.s. Holdings, Inc.

20090095715 - Methods of polymeric stent surface smoothing and resurfacing to reduce biologically active sites: The present invention provides methods for fabricating a stent using a chemical treatment to smooth, polish or strengthen the stent. One such treatment involves exposing the stent to acetone or a similar solvent. In certain embodiments, the additional step comprises placing the stent in a bath containing acetone, or a... Agent: Tarolli, Sundheim, Covell & Tummino L.L.P.

20090090692 - Methods of processing substrates and methods of forming conductive connections to substrates: Embodiments disclosed include methods of processing substrates, including methods of forming conductive connections to substrates. In one embodiment, a method of processing a substrate includes forming a material to be etched over a first material of a substrate. The material to be etched and the first material are of different... Agent: Wells St. John P.s.

20090090693 - Method for fabricating micromachined structures: A method for fabricating micromachined structures is provided. At least one cavity is formed on a substrate and then a dielectric material different from the material of the substrate is filled in the at least one cavity. Next, a circuitry layer including a first etch-resistant layer and a dielectric layer... Agent: Lowe Hauptman Ham & Berner, LLP

20090090694 - Shaping a cover glass: The fabrication of a touch sensor panel having co-planar single-layer touch sensors fabricated on the back side of a cover glass is disclosed. It can be desirable from a manufacturing perspective to perform all thin-film processing steps on a motherglass before separating it into separate parts. To perform thin-film processing... Agent: Apple C/o Morrison And Foerster ,llp Los Angeles

20090090695 - Yttria insulator ring for use inside a plasma chamber: A yttria insulator ring for use in a plasma processing apparatus is provided to minimize arcing between the apparatus and a ground extension, while also increasing a mean time between cleanings (MTBC). The yttria insulator ring may be located between a ground extension and a plasma generation zone, or gap,... Agent: Buchanan, Ingersoll & Rooney PC

20090090696 - Slurries for polishing oxide and nitride with high removal rates: The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive selected from the group consisting of alumina, ceria, titania, and zirconia, (b) a cationic copolymer comprising (A) a cationic monomer comprising a quaternary amino group and (B) a nonionic monomer, and (c) water. The invention also provides a method... Agent: Steven Weseman Associate General Counsel, I.p.

20090084754 - Method and system for manufacturing microstructure: A method for manufacturing a microstructure includes treating a surface of the microstructure having a wall body with a liquid, supplying a material activating the surface of the liquid to the surface of the microstructure, and drying the surface of the microstructure.... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090084755 - Method for forming micro-vias on a substrate: A method for forming at least one micro-via on a substrate is disclosed. The method comprises drilling at least one hole in a substrate by using a first laser beam. The first laser beam has an energy distribution, which is more at edges of the first laser beam than at... Agent: Grossman, Tucker, Perreault & Pfleger, PLLC C/o Intellevate, LLC

20090084756 - Electrochemical fabrication method and application for producing three-dimensional structures having improved surface finish: An electrochemical fabrication process produces three-dimensional structures (e.g. components or devices) from a plurality of layers of deposited materials wherein the formation of at least some portions of some layers are produced by operations that remove material or condition selected surfaces of a deposited material. In some embodiments, removal or... Agent: Microfabrica Inc. Att: Dennis R. Smalley

20090084757 - Uniformity control for ion beam assisted etching: An approach for providing uniformity control in an ion beam etch is described. In one embodiment, there is a method for providing uniform etching in an ion beam based etch process. In this embodiment, an ion beam is directed at a surface of a substrate. The surface of the substrate... Agent: Scott Faber, Esq. Varian Semiconductor Equipment Associates, Inc

20090084758 - Method and apparatus for shaping gas profile near bevel edge: A method for etching a bevel edge of a substrate in a processing chamber is provided. The method includes flowing an inert gas into a center region of the processing chamber defined above a center region of the substrate and flowing a mixture of an inert gas and a processing... Agent: Martine Penilla & Gencarella, LLP

20090084759 - Method and system for multi-pass correction of substrate defects: A method and system of location specific processing on a substrate is described. The method comprises acquiring metrology data for a substrate, and computing correction data for adjusting a first region of the metrology data on the substrate. Thereafter, a first gas cluster ion beam (GCIB) for treating the high... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090084760 - Method for removing material from solids and use thereof: The invention relates to a method for material removal on solid bodies, in particular for microstructuring and cutting, by means of liquid jet-guided laser etching, the removed material just as the non-reacted etching components being recycled to a high degree. In this way, silicon with high purity can be recovered... Agent: Leydig Voit & Mayer, Ltd