Etching a substrate: processes inventions 03/09

20090078673 - Method of forming a pattern: A pattern forming method is provided, which includes forming, above a substrate, a layer of a diblock copolymer composition containing at least PS and PEO, subjecting the layer to phase separation to obtain a phase-separated layer, thereby forming an easy-to-etch region constituted by PS and having a cylindrical or lamellar... Agent: Nixon & Vanderhye, PC

20090078675 - Method of removing photoresist: A method of photoresist removal is provided. The method employs a plasma formed from a gas chemistry comprising NH3. The method is particularly suitable for use in MEMS fabrication processes, such as inkjet printhead fabrication.... Agent: Silverbrook Research Pty Ltd

20090078674 - Reactive ion etching process for etching metals: A method of etching a metal by a reactive ion etching process is provided. The etchant gas chemistry for the reactive ion etching process consists essentially of NH3. The process is particularly suitable for etching superalloys, which etch only slowly using conventional metal etching techniques.... Agent: Silverbrook Research Pty Ltd

20090078676 - Method for dry etching al2o3 film: The invention provides a dry etching method for processing a wafer having an Ru film formed on a thick Al2O3 film to be used for a magnetic head, capable of realizing high selectivity. In the etching of a wafer having disposed on an NiCr film 15 an Al2O3 film 14,... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090078677 - Integrated steerability array arrangement for minimizing non-uniformity: An integrated steerability array arrangement for managing plasma uniformity within a plasma processing environment to facilitate processing of a substrate is provided. The arrangement includes an array of electrical elements. The arrangement also includes an array of gas injectors, wherein the array of electrical elements and the array of gas... Agent: Ipsg, P.C.

20090078678 - Plasma processing apparatus and plasma processing method: A plasma processing apparatus for processing a substrate using plasma includes a first electrode configured to mount the substrate, a second electrode disposed to face the first electrode with a predetermined space, a chamber containing the first electrode and the second electrode, the chamber being capable of adjusting an inside... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20090078679 - Etching solution and method for regenerating waste liquid thereof, and method for recovering valuable metals from waste liquid: The etching solution is etching solution comprising ferric chloride and chromium ions or nickel ions, or etching solution comprising ferric chloride, chromium ions and nickel ions and comprising each type of metal ions in a metal composition ratio approximately equal to a metal composition ratio in alloy steel to be... Agent: Lucas & Mercanti, LLP

20090071932 - Etching processes used in mems production: The efficiency of an etching process may be increased in various ways, and the cost of an etching process may be decreased. Unused etchant may be isolated and recirculated during the etching process. Etching byproducts may be collected and removed from the etching system during the etching process. Components of... Agent: Knobbe, Martens, Olson & Bear, LLP

20090071933 - Etching processes used in mems production: The efficiency of an etching process may be increased in various ways, and the cost of an etching process may be decreased. Unused etchant may be isolated and recirculated during the etching process. Etching byproducts may be collected and removed from the etching system during the etching process. Components of... Agent: Knobbe, Martens, Olson & Bear, LLP

20090071931 - Interconnect supported fuel cell assembly, preform and method of fabrication: A fuel cell assembly includes at least one fuel cell including at least two electrodes and an electrolyte. An interconnect structure includes at least one flow channel initially defined by a removable sacrificial material. A method of forming the fuel cell assembly includes the steps of providing the interconnect structure... Agent: General Electric Company Global Research

20090071934 - Crystalline aluminum oxide layers having increased energy band gap, charge trap layer devices including crystalline aluminum oxide layers, and methods of manufacturing the same: Crystalline aluminum oxide layers having increased energy band gap, charge trap memory devices including crystalline aluminum oxide layers and methods of manufacturing the same are provided. A method of forming an aluminum oxide layer having an increased energy band gap includes forming an amorphous aluminum oxide layer on a lower... Agent: Harness, Dickey & Pierce, P.L.C

20090071935 - Patterned magnetic recording medium and method of manufacturing the same: Provided are a patterned magnetic recording medium which has an extremely planarized surface and a method of manufacturing the same. The medium includes a patterned magnetic layer including a plurality of magnetic columns that are arranged with a predetermined pitch therebetween; a substrate that supports the patterned magnetic layer; and... Agent: Buchanan, Ingersoll & Rooney PC

20090071937 - Method for manufacturing fluid ejecting head and method for manufacturing fluid ejecting apparatus: A method for manufacturing a fluid ejecting head that includes a nozzle formation process in which a nozzle is formed in a nozzle substrate. The nozzle has a first concave portion and a smaller, corresponding second concave portion. The fluid ejecting head is assembled by combining the nozzle substrate, a... Agent: Workman Nydegger 1000 Eagle Gate Tower

20090071936 - Method of manufacturing inkjet printhead and inkjet printhead manufactured using the same: A method of manufacturing an inkjet printhead using a channel forming material, in which a glue layer to enhance an adhesive force between a substrate and a channel forming layer is not required.... Agent: Stanzione & Kim, LLP

20090071938 - Methods and apparatus for substrate processing: A method for processing a substrate in a plasma processing chamber is provided. The substrate is disposed above a chuck and surrounded by an edge ring. The edge ring is electrically isolated from the chuck. The method includes providing first RF power to the chuck. The method also includes providing... Agent: Ipsg, P.C.

20090071939 - Modification of polymer surface with shielded plasma: Methods and systems for modifying a surface of a polymer with a shielded plasma are provided. The surface may be modified to create a surface with increased crosslinking and/or a particular mechanical property, such as a coefficient of friction. A shielding arrangement is used to modify the plasma to which... Agent: Townsend And Townsend And Crew, LLP

20090071940 - Multi-speed substrate processing apparatus and substrate processing method: After a development liquid on a substrate is washed away with a rinse liquid, the rotational speed of the substrate is reduced, so that a liquid layer of the rinse liquid is formed over a top surface of the substrate. Thereafter, the rotational speed of the substrate is increased. The... Agent: Townsend And Townsend And Crew, LLP

20090071941 - Method for laser etching and/or laser embossing and powder coating a substrate: A method for finishing a substrate including transferring an image onto the substrate and powder coating the substrate. Embodiments provide methods for producing simulated wood grain finishes on engineered wood products such as medium density fiberboard. Logos, graphics, text, and the like may be embossed and/or etched onto the substrate... Agent: Taft, Stettinius & Hollister LLP

20090065471 - Micro-nozzle, nano-nozzle, manufacturing methods therefor, applications therefor: A nozzle structure is provided comprising a monolithic body having an array of nozzles. The nozzles having openings with sectional openings having heights of about 100 nm or less. The nozzles are generally associated with one or more well structures.... Agent: Reveo, Inc.

20090065474 - Liquid-ejection head and method for manufacturing liquid-ejection head substrate: A method for manufacturing a liquid-ejection head substrate including a silicon substrate having a supply port for supplying liquid is provided. The method includes: forming an etching mask layer on a surface of the silicon substrate, the etching mask layer having an opening in a portion corresponding to the supply... Agent: Canon U.s.a. Inc. Intellectual Property Division

20090065473 - Manufacturing method for liquid discharge head substrate: To provide a manufacturing method, for a liquid discharge head that includes a silicon substrate in which a supply port is formed for supplying a liquid, includes the steps of: providing the silicon substrate, a mask layer provided with an opening that corresponds to the supply port being provided on... Agent: Fitzpatrick Cella Harper & Scinto

20090065472 - Method for manufacturing liquid discharge head substrate: To provide a manufacturing method, for a liquid discharge head substrate that includes a silicon substrate in which a liquid supply port is formed, includes the steps of: preparing the silicon substrate, on one face of which a mask layer, in which an opening has been formed, is deposited; forming... Agent: Fitzpatrick Cella Harper & Scinto

20090065475 - Method of fabricating inkjet printhead with projections patterned across nozzle plate: A method of fabricating an inkjet printhead. The method includes the steps of: (a) forming a plurality of MEMS ink ejection assemblies on an ink-ejection surface of a silicon substrate, each ink ejection assembly being sealed with roof material spanning across the ink ejection assemblies to define a nozzle plate;... Agent: Silverbrook Research Pty Ltd

20090065476 - Method for manufacturing liquid discharge head: A method for manufacturing a substrate for a liquid discharge head having a silicon substrate provided with a supply port of a liquid comprises steps of preparing a substrate which is provided with a passive film on one side face thereof, has a first recess and a second recess provided... Agent: Fitzpatrick Cella Harper & Scinto

20090065477 - Pulsed-continuous etching: In a system and method of etching a sample disposed in an etching chamber, a plurality of separately stored charges of an etching gas is discharged, one at a time, into a sample etching chamber. The discharge of each charge of etching gas occurs such that a momentary overlap exists... Agent: The Webb Law Firm, P.C.

20090065478 - Measuring etching rates using low coherence interferometry: Measuring thickness and the rate of change of thickness of a material having a surface while the material is being etched, comprising: illuminating the material with low coherence light, a portion of the which transmits through the material and a portion of which is reflected; etching the material surface and... Agent: Frank Pincelli Patent Legal Staff

20090065479 - Dry etching method of high-k film: An object of the invention is to provide a dry etching method of a metal oxide High-k film having etching characteristics which achieve a small etching rate difference and a small profile difference between open area and dense area while keeping a high selectivity to a polysilicon underlying film. In... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090065480 - Plasma processing apparatus: Provided is a plasma processing apparatus which can perform uniform processing even when a substrate to be processed has a large area. The plasma processing apparatus propagates microwaves introduced into wave guide tubes to dielectric plates through slots, and performs plasma processing to the surface of the substrate by converting... Agent: Foley And Lardner LLP Suite 500

20090065481 - Method of processing silicon substrate and method of manufacturing liquid discharge head: A method of manufacturing a substrate for a liquid discharge head having a silicon substrate in which a liquid supply port is provided includes providing the silicon substrate, an etching mask layer having an opening being formed on a one surface of the silicon substrate, forming a region comprising an... Agent: Fitzpatrick Cella Harper & Scinto

20090065482 - Method of manufacturing substrate for liquid discharge head: Provided is a method of manufacturing a substrate for a liquid discharge head, the substrate including a silicon substrate with a liquid supply opening formed therein, the method including: forming one processed portion by laser processing on the substrate from one surface of the substrate; expanding the one processed portion... Agent: Fitzpatrick Cella Harper & Scinto

20090057264 - High throughput low topography copper cmp process: Embodiments described herein generally provide a method for processing metals disposed on a substrate in a chemical mechanical polishing system. The apparatus advantageously facilitates efficient bulk and residual conductive material removal from a substrate. In one embodiment a method for chemical mechanical polishing (CMP) of a conductive material disposed on... Agent: Patterson & Sheridan, LLP - - Appm/tx

20090057265 - Method of manufacturing multilayer printed circuit board: In a method of manufacturing a multilayer printed circuit board, a plurality of insulating substrates each having a first surface and a second surface is prepared. A circuit pattern is formed on each of the first surfaces of the insulating substrates. A plurality of via holes is provided so as... Agent: Posz Law Group, PLC

20090057266 - Line edge roughness control: In one embodiment, a method includes providing a plasma etch reactor including a vacuum chamber and an electrode disposed inside of the chamber, and providing a stack to be etched over the electrode, the stack including a patterned photoresist over a dielectric layer. The method further includes providing a chamber... Agent: Macpherson Kwok Chen & Heid LLP

20090057267 - Imprint lithography: A chuck apparatus for holding a substrate is the disclosed. The chuck apparatus includes a first surface portion on which the substrate is to be held and a second surface portion adjacent to the first surface portion and extending at least partially around an edge of the first surface portion... Agent: Pillsbury Winthrop Shaw Pittman, LLP

20090057268 - Engraving of printing plates: An optical imaging apparatus (80) for direct engraving of flexographic plates (52) includes at least two laser sources (43), each emitting laser beams (44). A mirror or prism (45) is placed in front of each of the laser sources to alter an optical path of each of the laser beams.... Agent: David A. Novais Patent Legal Staff

20090057269 - Method of processing a workpiece in a plasma reactor with independent wafer edge process gas injection: The disclosure concerns a method of processing a workpiece or in a plasma reactor chamber, using independent gas injection at the wafer edge.... Agent: Law Office Of Robert M. Wallace

20090057270 - Etching processing method: The etching processing method is characterized in that, when performing an etching processing on a resin member by using a desmear liquid containing an alkaline permanganate etching liquid, the etching processing is performed by dipping the resin member into the desmear liquid of which an etching rate for a resin... Agent: Rankin, Hill & Clark LLP

20090057271 - Manufacturing method of metal interconnection: A manufacturing method of a metal interconnection is provided. A dielectric layer having an opening therein is formed on a substrate and a barrier layer is then formed on the dielectric layer by performing an ALD process. An Al layer and an Al/Cu layer are formed on the substrate by... Agent: Jianq Chyun Intellectual Property Office