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USPTO Class 216 | Browse by Industry: Previous - Next | All 02/2009 | Recent | 09: Oct | Sept | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | | 08: Dec | Nov | Oct | Sp | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | | 07: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | | 06: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Etching a substrate: processes inventions 02/09Recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.Listing format for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 02/26/2009 > patent applications in patent subcategories. 20090050601 - Inert gas etching: A method of patterning a nanostructure film using a plasma is described. The nanostructure film may substantially comprise carbon and/or carbon nanotubes. The plasma may comprise an inert gas. The plasma may be applied to the nanostructure film at close to atmospheric pressure and room temperature.... Agent: Unidym 20090050600 - Method for manufacturing printed circuit boards: An exemplary method for manufacturing printed circuit boards is provided. In the method, a copper clad substrate having a copper layer thereon is provided. A surface of the copper layer is roughened by applying an atmospheric pressure plasma thereto. A photoresist layer is formed on the roughened surface of the... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang 20090050602 - Method for forming holes in making printed circuit board: A method for forming holes in making a printed circuit board includes the step of: providing a copper clad laminate including an insulation layer and a copper layer laminated on the insulation layer; forming a carbon nano-material on the copper layer of the copper clad laminate; and applying a laser... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang 20090050603 - Mask trimming with arl etch: A method for etching a dielectric layer disposed below an antireflection layer (ARL) is provided. The method comprises (a) forming a patterned mask with mask features over the ARL, the mask having isolated areas and dense areas of the mask features, (b) trimming and opening, and (c) etching the dielectric... Agent: Beyer Law Group LLP 20090050604 - Tri-layer plasma etch resist rework: Exemplary embodiments provide a tri-layer resist (TLR) stack used in a photolithographic process, and methods for resist reworking by a single plasma etch process. The single plasma etch process can be used to remove one or more portions/layers of the TLR stack that needs to be reworked in a single... Agent: Texas Instruments Incorporated 02/19/2009 > patent applications in patent subcategories.20090045161 - Integrated circuits, micromechanical devices, and method of making same: A method of making an integrated circuit comprises providing a substrate and forming a structure on the substrate comprising a first enclosed portion of a carbon material and a second portion of the carbon material, wherein an intersection of the first and second portion of the carbon material has a... Agent: Patterson & Sheridan, LLP Gero Mcclellan / Qimonda 20090045162 - Thin film magnetic head and manufacturing method thereof: A thin film magnetic head has a configuration in which a main magnetic pole film having a magnetic pole end portion on a medium opposing surface (ABS) side facing a magnetic disk, a write shield film facing the magnetic pole end portion so as to form a recording gap film... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C. 20090045163 - Method for obtaining a transparent conductive film: A method for obtaining a transparent conductive film comprises the steps of providing a transparent substrate, depositing a conductive film, of a thickness not greater than 5 μm, on the transparent substrate, and removing the entire thickness of conductive film from portions of the surface of the substrate in such... Agent: Nixon & Vanderhye, PC 20090045164 - \"universal\" barrier cmp slurry for use with low dielectric constant interlayer dielectrics: During processing of a semiconductor wafer bearing a structure including a low-k dielectric layer, a cap layer and the metal-diffusion barrier layer, a chemical mechanical polishing method applied to remove the metal-diffusion barrier material involves two phases. In the second phase of the barrier-CMP method, when the polishing interface is... Agent: Freescale Semiconductor, Inc. Law Department 20090045165 - Semiconductor device manufacturing method and storage medium: A semiconductor device manufacturing method according to the present invention comprises the steps of: etching with plasma a silicon-containing film and transferring a pattern of a pattern mask stacked on the silicon-containing film onto the silicon-containing film to form a patterned silicon-containing film; removing the pattern mask using plasma to... Agent: Smith, Gambrell & Russell 20090045166 - Method of enhancing biocompatibility of elastomeric materials by microtexturing using microdroplet patterning: A simple method to introduce microstructures to the surface of elastomeric materials such as silicone elastomers is described. The patterns are generated by forming microdroplets of a protective polymer onto a silicone elastomer film, hardening the polymer, and then removing the uncoated material by chemical etching. Cell attachment study results... Agent: Knobbe Martens Olson & Bear LLP 20090045167 - Plasma etching method and apparatus therefor: A fluorine-containing compound gas, e.g., SF6 gas, is converted into a plasma and a silicon portion of an object to be processed is etched by the plasma. At the same time, using a light source having a peak intensity of light in a wavelength range of light absorption of a... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C. 20090045168 - Surface treater for elongated articles: A surface treater system for three dimensional articles, especially elongated articles such as wires, cables and the like, increases the surface tension of the articles and thereby can be used to clean, etch and improve the wettabliity of the surface for inks, dyes, adhesives and the like. The treated article... Agent: Quarles & Brady LLP 20090045169 - Mirror etching composition: A mirror etching composition comprising a solution of water, sulfated potash and vegetable glycerin and, when applied to the electroplated non-reflective surface of a mirror, effectively simulates the appearance of a tarnished or deteriorated “antique” mirror. The electroplated surface applied to the back of new mirrors is normally sealed with... Agent: Baker, Donelson, Bearman, Caldwell & Berkowitz Intellectual Property Department 02/12/2009 > patent applications in patent subcategories.20090039053 - Method for manufacturing electrical traces of printed circuit boards: An exemplary method for manufacturing a printed circuit board is provided. Firstly, a copper clad substrate comprising a base film, a copper layer and intermediate layer interposed between the base film and the copper layer is provided. The intermediate layer is comprised of nickel, chromium, or alloy of nickel and... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang 20090039054 - Etching apparatus of glass substrate for flat panel display and method of ectching glass substrate for flat panel display using the same: An etching apparatus of a glass substrate for a flat panel display includes an etching chamber configured to receive a jig, glass substrates disposed on the jig, a holding member connected to the jig to hold the glass substrates, a transferring line connected to the jig to transfer the jig... Agent: Cantor Colburn, LLP 20090039055 - Method for making an aligned carbon nanotube: A method for making an aligned carbon nanotube includes the steps of a) applying a layer of a ferrosilicon alloy film onto a substrate, b) etching the layer of the ferrosilicon film to form a plurality of fine ferrosilicon alloy particles that are distributed properly on the substrate, and c)... Agent: Townsend And Townsend And Crew, LLP 20090039056 - Planarizing method: Provided is a planarizing method in which a planarization with high flatness can be performed, without being restricted by the distribution of film thickness in the applied resist film. The planarizing method comprises the steps of: forming a resist film on a film to be planarized formed on a substrate;... Agent: Oliff & Berridge, PLC 20090039057 - Method of increasing etchability of metals having chemical etching resistant microstructure: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention also includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is... Agent: Shirley L. Church, Esq. 02/05/2009 > patent applications in patent subcategories.20090032490 - Method of fabricating color filter: Methods for fabricating color filters are provided. Firstly, a substrate having a first region and a second region is provided. Then, a first dichroic layer and a first mask layer are formed on the first region sequentially. Next, a second dichroic layer is formed on the substrate to cover the... Agent: J C Patents, Inc. 20090032492 - Apparatus and method for wet-chemical processing of flat, thin substrates in a continuous method: The invention relates to a method and apparatus for wet-chemical processes (cleaning, etching, stripping, coating, dehydration) in a continuous method for flat, thin and fracture-sensitive substrates, the substrate transport and the wet process being effected by media-absorbing rollers.... Agent: Brinks Hofer Gilson & Lione/ann Arbor 20090032491 - Conductive element forming using sacrificial layer patterned to form dielectric layer: Methods of forming a conductive element for an integrated circuit (IC) chip and a related structure are disclosed. One embodiment of the method may include forming a first sacrificial layer having a pattern therein for a first dielectric layer to surround the conductive element; forming the first dielectric layer within... Agent: Hoffman Warnick LLC 20090032493 - Method for manufacturing predetermined pattern: A method for manufacturing a predetermined pattern is generally used to manufacture a predetermined pattern on PCBs. The method comprises a step of etching an insulating substrate of the PCB with a laser beam instead of chemical solutions to produce the predetermined pattern according to the layout of the predetermined... Agent: Lin & Associates Intellectual Property, Inc. 20090032494 - Thin film magnetic head structure, method of making same and thin film magnetic head: A thin-film magnetic head structure has a configuration adapted to manufacture a thin-film magnetic head configured such that a main magnetic pole layer including a magnetic pole tip on a side of a medium-opposing surface opposing a recording medium, a write shield layer opposing the magnetic pole tip so as... Agent: Oliff & Berridge, PLC 20090032495 - Method for etching metal nitride with high selectivity to other materials: A method and system of etching a metal nitride, such as titanium nitride, is described. The etching process comprises introducing a process composition having a halogen containing gas, such as Cl2, HBr, or BCl3, and a hydrocarbon gas having the chemical formula CxHy, where x and y are equal to... Agent: Tokyo Electron U.s. Holdings, Inc. 20090032496 - Method for manufacturing thermal interface material having carbon nanotubes: A method for manufacturing a thermal interface material includes the following steps: providing a carbon nanotube array formed on a substrate, the carbon nanotube array having a number of carbon nanotubes and a number of interstices between the adjacent carbon nanotubes; filling a liquid state first base material into the... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang 20090032497 - System and method for controlling the application of acid etchers or cleaners by means of color-changing dye: An acidic etcher solution for etching a substrate's surface. The acidic etcher solution includes an acid and a pH indicator, the pH indicator having at least one color transition at a pH below 7. The acidic etcher solution having an initial color at an initial pH when applied to the... Agent: Foley & Lardner LLP 20090032498 - Spin processing method and apparatus: There are provided a spin processing method and a spin processing apparatus with which the improvement of a processing speed in spin processing can be compatible with the saving of a processing solution. The spin processing method comprises holding and fixing the wafer on the upper surface of the spin... Agent: Marger Johnson & Mccollom, P.C. 20090032499 - Low friction coatings for use in dental and medical devices: The present invention provides an article, at least part of it being coated by inorganic fullerene-like (IF) nanoparticles or composite containing such nanoparticles. Preferably, the invention provides an article made of metal, for use in dentistry or medicine e.g. archwire, needle or catheter, having a friction-reducing film, and methods for... Agent: The Nath Law Group Previous industry: Bottles and jarsNext industry: Wooden receptacles ###### RSS FEED for 20091112: Integrate FreshPatents.com into your RSS reader/aggregator or website to track weekly updates. For more info, read this article. ###### Thank you for viewing Etching a substrate: processes patents on the FreshPatents.com website. These are patent applications which have been filed in the United States. There are a variety ways to browse Etching a substrate: processes patent applications on our website including browsing by date, agent, inventor, and industry. If you are interested in receiving occasional emails regarding Etching a substrate: processes patents we recommend signing up for free keyword monitoring by email. ### FreshPatents.com Support Results in 0.40299 seconds |
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