Etching a substrate: processes inventions 01/09

20090026168 - Method for manufacturing a rigid-flex circuit board: A method for manufacturing a rigid-flex board is disclosed. After the formation of each layer of the rigid-flex board, a laser-etched groove is formed at the interface between a rigid part and a bending area of the rigid-flex board. After the laser etching process, a circuit-board routing process is performed... Agent: North America Intellectual Property Corporation

20090026169 - Printed circuit board manufacturing system and manufacturing method thereof: A printed circuit board manufacturing system and a manufacturing method thereof are disclosed. A method of manufacturing printed circuit board, comprising: providing a substrate that comprises a pad and an insulation layer covering the pad; acquiring an image of the substrate; acquiring location information of the pad by analyzing the... Agent: Staas & Halsey LLP

20090026170 - Plasma processing apparatus and method of plasma distribution correction: A plasma processing apparatus can prevent a sheath from becoming distorted, simplify a configuration of the apparatus, and prevent particles from attaching to a substrate. The plasma processing apparatus performs plasma processing on the substrate. A housing chamber houses the substrate. A mounting stage is disposed within the housing chamber... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090026171 - Processing method: A multichamber-type processing apparatus and processing method using same, in which a substrate is reliably neutralized without being damaged, thereby ensuring excellent accuracy and throughput. The processing apparatus includes a transfer chamber, etching chambers selectively communicating with the transfer chamber and providing a space to etch a first substrate therein,... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090026172 - Dry etching method and dry etching apparatus: In the dry etching method and dry etching apparatus relating to the present invention, high frequency electric power is applied to upper and lower electrodes from high frequency power sources to generate plasma and etch an object on the electrode in a vacuum chamber into which a process gas is... Agent: Mcdermott Will & Emery LLP

20090020499 - Method to fabricate a redirecting mirror in optical waveguide devices: A method of fabricating a turning mirror for an optical device includes the steps of depositing on a substrate, which defines a plane in which an optical signal propagates in a propagating direction, a photoresist layer sensitive to electrons and to UV radiation. The material in which the photoresist layer... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20090020500 - Method of forming passage through substrate for mems module: A method of forming a passage through a substrate for a MEMS module is disclosed to include the steps of: a) etching a substrate having a thickness smaller than 0.30 mm to form a bottom recess; b) etching a top side of the substrate to form a top recess to... Agent: Browdy And Neimark, P.l.l.c. 624 Ninth Street, Nw

20090020501 - Method of forming passage in substrate for mems module: A method of forming a passage in a substrate for a MEMS module is disclosed to include the steps of respectively forming a first support layer and a second support layer in a first space and a second space, which are respectively formed in a bottom side and a top... Agent: Browdy And Neimark, P.l.l.c. 624 Ninth Street, Nw

20090020502 - Biosensor and method of making: An electrochemical biosensor with electrode elements that possess smooth, high-quality edges. These smooth edges define gaps between electrodes, electrode traces and contact pads. Due to the remarkable edge smoothness achieved with the present invention, the gaps can be quite small, which provides marked advantages in terms of test accuracy, speed... Agent: Woodard, Emhardt, Moriarty, Mcnett & Henry LLP

20090020503 - Substrate etching apparatus and substrate etching method: A substrate etching apparatus includes a chamber in which first and second insulating substrates are received, a blocking shutter, and a first spray head. The first spray head is arranged in the chamber and sprays an etchant toward the first insulating substrate. The blocking shutter surrounds end portions of the... Agent: Macpherson Kwok Chen & Heid LLP

20090020504 - Method for manufacturing ink-jet head: A method for manufacturing an ink-jet head is disclosed. The method for manufacturing an ink-jet head including a chamber containing an ink, a reservoir connected with the chamber and supplying the ink to the chamber, a restrictor connected with the chamber and the reservoir and controlling a flow of the... Agent: Staas & Halsey LLP

20090014409 - Endpoint detection for photomask etching: Apparatus and method for endpoint detection are provided for photomask etching. The apparatus provides a plasma etch chamber with a substrate support member. The substrate support member has at least two optical components disposed therein for use in endpoint detection. Enhanced process monitoring for photomask etching are achieved by the... Agent: Patterson & Sheridan, LLP - - Appm/tx

20090014410 - Producing method of suspension board with circuit: A producing method of a suspension board with circuit includes simultaneously forming a conductive pattern formed on an insulating layer formed on a metal supporting board and having a terminal portion for connecting to an electronic component, and a mark formed on the metal supporting board, or on the insulating... Agent: Akerman Senterfitt

20090014411 - Fabricating method for multilayer printed circuit board: A fabrication method for a multilayer printed circuit board includes: forming a first circuit-forming pattern and a first insulation layer, into which the first circuit-forming pattern is inserted, on a first carrier; forming inner circuit patterns and inner insulation layers over the first insulation layer, and forming inner vias connecting... Agent: Staas & Halsey LLP

20090014412 - Film forming apparatus and method for manufacturing light emitting element: A film forming apparatus is provided with a processing chamber having a substrate holding table for holding a substrate to be processed inside the container; a gas material generation unit arranged outside the processing chamber, for generating a gas material by evaporating or sublimating a film forming source material including... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090014413 - Self-aligned precision datums for array die placement: A method and resulting device for accurately positioning an array of die modules in an imaging array, including larger partial width arrays and full page width arrays, is described herein. The method includes forming physical reference datum directly on an individual silicon die module, and positioning the individual die modules... Agent: Mh2 Technology Law Group, LLP (cust. No. W/xerox)

20090014414 - Substrate processing method, substrate processing system, and computer-readable storage medium: A substrate processing method includes preparing a substrate having a low-k interlayer dielectric film as a to-be-etched film and a photoresist film, formed on the low-k interlayer insulating film, serving as an etching mask with a predetermined circuit pattern; etching the low-k interlayer insulating film through the photoresist film to... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090014415 - Compositions and methods for rapidly removing overfilled substrates: This invention relates to compositions and methods for removing overfilled substrates, preferably at a relatively high removal rates Advantageously, a composition according to the invention can contain an oxidizer, preferably a per-type oxidizer such as a peroxide, periodic acid, and peracetic acid, and may also optionally contain an abrasive.... Agent: Morgan Lewis & Bockius LLP

20090014416 - Transparent textured substrate and methods for obtaining same: The invention concerns a transparent substrate whereof part at least of the outer surface has the form of a web comprising protuberances, 80% of them at least, having heights ranging between 40 and 250 nm, mean diameters between 1 and 500 nm, 80% at least of the distances between two... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090008361 - Oxidant and passivant composition and method for use in treating a microelectronic structure: A composition that may be used for cleaning a metal containing conductor layer, such as a copper containing conductor layer, within a microelectronic structure includes an aqueous acid, along with an oxidant material and a passivant material contained within the aqueous acid. The composition does not include an abrasive material.... Agent: Scully, Scott, Murphy & Presser, P.C.

20090008362 - Plasma processing apparatus and plasma processing method: A plasma processing apparatus includes a microwave-absorbing heat-generating member disposed along an inside surface of a plasma processing chamber to absorb microwaves and generate heat, wherein the microwave-absorbing heat-generating member is heated by microwaves without exciting plasma, and wherein, after that, a substrate to be processed is loaded into the... Agent: Morgan & Finnegan, L.L.P.

20090008363 - Plasma processing apparatus and a plasma processing method: In an oxide film etching process, a plasma having a suitable ratio of CF3, CF2, CF, and F is necessary, and there is a problem in that the etching characteristic fluctuates in accordance with a temperature fluctuation of the etching chamber. Using a UHF type ECR plasma etching apparatus having... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090008364 - Method and device for etching substrates contained in an etching solution: The invention relates to a method for etching substrates (4) received in an etching solution (2). Said method comprises the following steps: A basin (1) which can receive the etching solution (2) is prepared, the substrate (4) is completely immersed in the etching solution (2), a flow which surrounds the... Agent: Kanesaka Berner And Partners LLP

20090008365 - Microtextured implants and methods of making same: The present invention concerns a process for etching metal by contacting the metal with a solution comprising hydrogen chloride and a persulfate salt; wherein the solution has a hydrogen chloride concentration of about 3 to about 11.7 moles/liter and a molar ratio of hydrogen chloride to persulfate salt of about... Agent: Woodcock Washburn LLP

20090008366 - Etching composition and method for etching a substrate: This etching composition for etching hafnium compound, includes a fluoride compound and a chloride compound. This method for etching a substrate, includes etching a film which contains hafnium compound and is formed on a substrate by using an etching composition, wherein the etching composition contains a fluoride compound and a... Agent: Sughrue Mion, PLLC

20090001044 - Method for manufacturing a semiconductor device using a spacer as an etch mask for forming a fine pattern: A process for manufacturing a semiconductor device using a spacer as an etch mask for forming a fine pattern is described. The process includes forming a hard mask layer over a target layer that is desired to be etched. A sacrificial layer pattern is subsequently formed over the hard mask... Agent: Ladas & Parry LLP

20090001045 - Methods of patterning self-assembly nano-structure and forming porous dielectric: Methods of patterning a self-assembly nano-structure and forming a porous dielectric are disclosed. In one aspect, the method includes providing a hardmask over an underlying layer; predefining an area with a photoresist on the hardmask that is to be protected during the patterning; forming a layer of the copolymer over... Agent: Hoffman Warnick LLC

20090001046 - Substrate processing method, substrate processing apparatus and recording medium: The present invention provides a method, an apparatus and the like that may be adopted when executing a specific type of processing on a substrate that includes a recessed portion formed by etching a low dielectric constant insulating film with a low dielectric constant having been formed upon a metal... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090001047 - Method for fabricating patterned magnetic recording media: A method of fabricating a bit patterned storage medium includes obtaining a substrate having a magnetic layer and forming a mask over the magnetic layer. The magnetic layer is etched through the mask using a reactive ion etch. The etch rate of the mask is reduced by introducing a gas... Agent: Seagate Technology LLC C/o Westman Champlin & Kelly, P.A.

20090001048 - Method of manufacturing inkjet printhead: A method of manufacturing an inkjet printhead includes forming a chamber layer, in which a plurality of ink chambers is formed, on a substrate, forming trench to define an island surrounded by the trench on an upper part of the substrate by etching an upper surface of the substrate to... Agent: Stanzione & Kim, LLP

20090001049 - Methods of etching articles via microcontact printing: Improved methods of forming a patterned self-assembled monolayer on a surface and derivative articles are provided. According to one method, an elastomeric stamp is deformed during and/or prior to using the stamp to print a self-assembled molecular monolayer on a surface. According to another method, during monolayer printing the surface... Agent: Wolf Greenfield & Sacks, P.C.

20090001050 - Method for forming a deep trench: A method for forming a deep trench includes providing a substrate with a bottom layer and a top layer; performing a first etching process to etch the top layer, the bottom layer and the substrate so as to form a recess; selectively depositing a liner covering the top layer, the... Agent: North America Intellectual Property Corporation

20090001051 - Slurry compositions for polishing metal, methods of polishing a metal object and methods of forming a metal wiring using the same: A slurry composition for polishing metal includes a polymeric polishing accelerating agent, the polymeric polishing accelerating agent including a backbone of hydrocarbon and a side substituent having at least one of a sulfonate ion (SO3−) and a sulfate ion (OSO3−), and an acidic aqueous solution.... Agent: Lee & Morse, P.C.

20090001052 - Plasma processing apparatus and plasma processing method: A plasma processing method for processing a sample mounted on a sample stage in a decompressable processing chamber in which plasma is produced. The method includes detecting a distribution of a concentration of a substance over a surface of a sample in the processing chamber using both of (1) a... Agent: Antonelli, Terry, Stout & Kraus, LLP