Etching a substrate: processes inventions 12/08

20080314863 - Printed circuit board including embedded capacitor and method of fabricating same: Disclosed is a PCB including an embedded capacitor and a method of fabricating the same. The long embedded capacitor is formed through an insulating layer, making a high capacitance and various capacitance designs possible.... Agent: Darby & Darby P.C.

20080314864 - Method for manufacturing image sensor: Methods of forming a microlens for an image sensor are provided. In one embodiment, the microlens can be oxide film microlens fabricated by forming an oxide film on a substrate; forming a first photoresist pattern on the oxide film; performing a plasma processing with respect to the oxide film using... Agent: Saliwanchik Lloyd & Saliwanchik A Professional Association

20080314865 - Method for providing hermetic electrical feedthrough: A method for fabricating the hermetic electrical feedthrough. The method comprises providing a ceramic sheet having an upper surface and a lower surface, forming at least one via hole in said ceramic sheet extending from said upper surface to said lower surface, inserting a conductive thickfilm paste into said via... Agent: Second Sight Medical Products, Inc.

20080314866 - Mirror and mirror layer for optical modulator and method: Described herein are systems, devices, and methods relating to packaging electronic devices, for example, microelectromechanical systems (MEMS) devices, including optical modulators such as interferometric optical modulators. The interferometric modulator disclosed herein comprises a movable mirror. Some embodiments of the disclosed movable mirror exhibit a combination of improved properties compared to... Agent: Knobbe, Martens, Olson & Bear, LLP

20080314867 - Method of making demountable interconnect structure: A method for making an interconnect structure includes applying a first metal layer to an electronic device, wherein the electronic device comprises at least one I/O contact and the first metal layer is located on a surface of the I/O contact; applying a removable layer to the electronic device. The... Agent: General Electric Company Global Research

20080314868 - Methods of forming semiconductor devices formed by processes including the use of specific etchant solutions: The present invention provides etchant solutions including deionized water and an organic acid having a carboxyl radical and a hydroxyl radical. Methods of forming magnetic memory devices are also disclosed.... Agent: Myers Bigel Sibley & Sajovec

20080314869 - Methods for fabricating spatial light modulators with hidden comb actuators: Described are methods for fabricating Micro-Electro-Mechanical Systems (MEMS) actuators with hidden combs and hinges. The ability to hide the combs renders the actuators useful in digital micro-mirror devices. Comb actuators provide increased torque, which facilitates the use of stiffer, less fragile hinge structures. Also important, comb actuators do not require... Agent: Arthur J. Behiel Silicon Edge Law Group LLP

20080314870 - Substrate processing method, substrate processing apparatus, and control program: This invention provides a substrate processing method including a step of covering in advance the surface of a substrate W with water (28), a step of holding the substrate W generally horizontally with the surface facing upward and rotating it in a horizontal plane (10), and a step of blowing... Agent: Wenderoth, Lind & Ponack, L.L.P.

20080314871 - High resolution plasma etch: A method for fabrication of microscopic structures that uses a beam process, such as beam-induced decomposition of a precursor, to deposit a mask in a precise pattern and then a selective, plasma beam is applied, comprising the steps of first creating a protective mask upon surface portions of a substrate... Agent: Michael O. Scheinberg

20080314872 - Chemical-mechanical polishing compositions containing aspartame and methods of making and using the same: The present invention provides an aqueous CMP slurry composition that comprises abrasive particles and Aspartame. The CMP slurry composition according to the invention is selective for polishing silicon dioxide in preference to silicon nitride from a surface of an article by chemical mechanical planarization. Furthermore, as more Aspartame is added... Agent: Rankin, Hill & Clark LLP

20080308523 - Method for manufacturing flexible medical device conduit: A method for manufacturing a flexible medical device conduit includes forming an elongated framework of flexible material (e.g., Nitinol), and creating a sharp head on a distal end of the elongated strip using, for example, an isotropic etching technique, a stamping technique and/or a coining technique. The method also includes... Agent: Philip S. Johnson Johnson & Johnson

20080308524 - Electrochemical fabrication methods with enhanced post deposition processing: An electrochemical fabrication process for producing three-dimensional structures from a plurality of adhered layers is provided where each layer comprises at least one structural material (e.g. nickel) and at least one sacrificial material (e.g. copper) that will be etched away from the structural material after the formation of all layers... Agent: Microfabrica Inc. Att: Dennis R. Smalley

20080308525 - Potassium niobate deposited body and method for manufacturing the same, piezoelectric thin film resonator, frequency filter, oscillator, electronic circuit, and electronic apparatus: A method for manufacturing a potassium niobate deposited body includes: forming a buffer layer above a substrate composed of an R-plane sapphire substrate; forming above the buffer layer a potassium niobate layer or a potassium niobate solid solution layer that epitaxially grows in a (100) orientation in a pseudo cubic... Agent: Harness, Dickey & Pierce, P.L.C

20080308526 - Minimization of mask undercut on deep silicon etch: A method for forming features in a silicon layer is provided. A mask is formed with a plurality of mask openings over the silicon layer. A polymer layer is deposited over the mask by flowing a hydrogen free deposition gas comprising C4F8, forming a plasma from the deposition gas, depositing... Agent: Beyer Law Group LLP

20080308527 - Advanced mask patterning with patterning layer: An imaging structure such as a mask or reticle may be fabricated using a patterning layer on an imaging layer. The patterning layer may have substantially different etch properties than the imaging layer. A first etch process may be selective of the patterning layer with respect to a resist layer.... Agent: Fish & Richardson, PC

20080308528 - Nanoporous ultrafine alpha-alumina powders and sol-gel process of preparing same: The present invention provides α-alumina powders comprising α-alumina particles of which at least 80% of the α-alumina particles have a particle size of less than 100 nm. The invention also provides slurries, particularly aqueous slurries, which comprise α-alumina powders of the invention. The invention further provides methods of manufacturing α-alumina... Agent: Edwards Angell Palmer & Dodge LLP

20080308529 - Polymerase chain reaction kit and method of manufacturing the same: The present invention provides a kit employed for polymerase chain reaction. The kit has a cavity and a flow channel on a substrate. The flow channel is separated from the cavity by at least a barrier formed along the cavity. Such a structure allows the cavity to be filled with... Agent: Steptoe & Johnson LLP

20080308530 - Substrate treating apparatus: A substrate treating apparatus for heating a treating solution formed of a chemical and a diluent, and immersing substrates in the treating solution for treatment. The apparatus includes a treating tank for storing the treating solution, a heater for heating the treating solution, a temperature detector for detecting temperature of... Agent: Ostrolenk Faber Gerb & Soffen

20080302759 - End functionalization of carbon nanotubes: Carbon nanotubes may be selectively opened and their exposed ends functionalized. Opposite ends of carbon nanotubes may be functionalized in different fashions to facilitate self-assembly and other applications.... Agent: Trop Pruner & Hu, PC

20080302760 - Method of forming a metal layer pattern having a nanogap and method of manufacturing a molecule-sized device using the same: A method of patterning a metal layer includes forming a first mask on a surface of the metal layer, the first mask having an opening through the first mask that exposes the metal layer, and forming a nanogap in the exposed metal layer using an ion beam directed through the... Agent: Lee & Morse, P.C.

20080302761 - Plasma processing system and use thereof: A plasma processing system 10 includes a processing chamber 100, a microwave source 700 that outputs a microwave, a coaxial waveguide 315 that transfers the microwave from the microwave source, a plurality of dielectric plates 305 that transmit the microwave transferred through the coaxial waveguide 315 and discharge the microwave... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080302762 - Method for analyzing quartz member: A disclosed method of analyzing a quartz member includes steps of supplying an etchant to an etchant receiving portion formed concavely in the quartz member so as to etch the quartz member; and analyzing the etchant used in the supplying step.... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080296252 - Composite, nanostructured, super-hydrophobic material: A method of making a hydrophobic, disordered composite material having protrusive surface features includes the following steps: making a disordered composite body comprised of a recessive phase and a protrusive phase, the recessive phase having a higher susceptibility to a preselected etchant than the protrusive phase; treating a surface of... Agent: Ut-battelle, LLC Office Of Intellectual Property

20080296253 - Method and apparatus to change solder pad size using a differential pad plating: A method of manufacturing an interposer is provided, including the steps of providing a sheet with a copper layer and polyimide layer, laser drilling holes in the polyimide layer down to the copper layer, filling the holes with copper and extending the copper above the polyimide layer to define caps,... Agent: Steptoe & Johnson LLP

20080296254 - Multilayer wiring board for an electronic device: To provide a multilayer wiring board mainly used for an electronic device, in which a bump passing through an inter layer insulating film allows for inter layer connection between plural wiring films insulated from one another with plural inter layer insulating layers. In the multilayer wiring board, a circuit element... Agent: Tessera Lerner David Et Al.

20080296255 - Magnetic porous particles and method of making: The invention provides porous particles that produce a predetermined optical response and that may be manipulated magnetically. A preferred particle of the invention has a porous structure that produces a predetermined optical response and magnetic material adhered to the particle. Another preferred particle is amphiphilic. The optical response provided by... Agent: Greer, Burns & Crain

20080296256 - Three-dimensional cold plate and method of manufacturing same: A three-dimensional cold plate assembly and method of manufacturing the same is disclosed. The cold plate assembly includes a metallic substrate having a top side and a bottom side and a three-dimensional molded contoured plastic body having a top side and a bottom side. The bottom side of the metallic... Agent: Barlow, Josephs & Holmes, Ltd.

20080296257 - Miniature optically transparent window: Miniature optically transparent windows are disclosed that extend vertically from a plane, which may be used to transmit light traveling in a direction substantially parallel with the plane. In one illustrative embodiment, a method for forming such miniature optically transparent windows includes: providing a substrate having a first surface and... Agent: Honeywell International Inc.

20080296258 - Plenum reactor system: Techniques for generating reactions on surfaces that can operate at room temperature and pressure with visible laser light as a radiation source and environmentally sound gases for processing. The apparatus is highly compact, simple, reliable and low cost to operate and maintain, and can dry clean and condition surfaces without... Agent: Hamilton, Brook, Smith & Reynolds, P.C.

20080296259 - Apparatus and method for treating substrate using plasma: A method of treating plasma using plasma is provided. During a plasma treating process, a power for generating plasma is supplied as a pulse to prevent charge density of a wafer surface from increasing with rise of electron energy. A magnetic field is provided at a region, where a plasma... Agent: Harness, Dickey & Pierce, P.L.C

20080296261 - Apparatus and methods for improving treatment uniformity in a plasma process: Apparatus and methods for improving treatment uniformity in a plasma process. The sacrificial body, which is extends about an outer peripheral edge of the workpiece during plasma processing, is composed of a plasma-removable material. The sacrificial body may include multiple sections that are arranged to define a circular geometrical shape.... Agent: Wood, Herron & Evans, LLP (nordson)

20080296260 - Method for the fabrication of high surface area ratio and high aspect ratio surfaces on substrates: This invention provides a method for the fabrication of surfaces of high surface area ratio on polymeric/plastic materials, and their application in the control of the wetting properties of surfaces, of the transport of liquids on such fabricated surfaces, or of the separation of liquids in microchannels of said surfaces.... Agent: Mathews, Shepherd, Mckay, & Bruneau, P.A.

20080296262 - Process and device for cleaning and etching a substrate wi: A simple process is disclosed for treating substrates having pre-structured zinc oxide layers on rigid or flexible supports. The ZnO is treated with an etching medium then with a cleaning liquid. The treatment with the etching and cleaning liquids is carried out while the substrate is conveyed through a device.... Agent: K.f. Ross P.C.

20080296263 - Laser scribing and machining of materials: Disclosed are systems and methods for directing laser energy to surfaces of materials via elements which have sharp points, and for reducing the adverse effects of particles which become dislodged by scribing and laser machining of materials.... Agent: Shook, Hardy & Bacon LLP Intellectual Property Department