Etching a substrate: processes inventions 11/08

20080290064 - Method for forming sapphire micro-lens in led process: A method for forming a micro-lens on a sapphire substrate in an LED process. In the method for forming the micro-lens on the sapphire substrate in the LED process, the ratio of source power and bias power used to generate plasma into a chamber is set to the optimum ratio... Agent: Sherr & Vaughn, PLLC

20080290065 - Laser ice etching system and method: A laser ice etching system (7) includes a laser (11) for producing a laser beam, a laser aiming system (13) adapted to aim and direct a laser beam produced by the laser (11) onto forming ice cubes and a controller (9) operatively coupled to the laser (11) and the laser... Agent: The Webb Law Firm, P.C.

20080290066 - Method of fabricating polymer modulators with etch stop clads: A process that comprises dry etching a trench into a side clad polymer layer using an underlying passive polymer layer as an etch stop, and then back filling the trench with an electro-optic polymer.... Agent: Fish & Richardson P.C.

20080290067 - Microstructure, pattern medium and process for producing same: It is an object to provide a microstructure having cylindrical microdomains oriented in the film thickness direction and arranged in a regular pattern, for which a microphase separation phenomenon of a block copolymer is utilized. The process for producing the microstructure includes 2 steps; the first step for arranging, on... Agent: Antonelli, Terry, Stout & Kraus, LLP

20080283487 - Process for producing three-dimensional photonic crystal and the three-dimensional photonic crystal: A process for producing a three-dimensional photonic crystal comprises the steps of providing a base material having first and second faces adjoining together at a first angle; forming a first mask on the first face; forming fine holes in the base material by dry-etching on the first face in a... Agent: Fitzpatrick Cella Harper & Scinto

20080283488 - Method for producing a ceramic printed-circuit board: A ceramic substrate (S) has on its top side weldable connection surfaces (LA) and on its underside weldable contacts (LK). In the disclosed substrate (S), the weldable connection surfaces, which were until now produced using printing pastes, is replaced by weld surface contacts precipitated from a solution and directly applied... Agent: Fish & Richardson PC

20080283489 - Method of manufacturing a structure: A gold layer (20) is patterned with a gold oxide mask (30), which mask is patterned with an acid, preferably with microcontactprinting. The gold oxide mask (30) is stable in alkalic etch solutions for the gold layer (20). The gold oxide mask (30) may be maintained to create a reexposable... Agent: Philips Intellectual Property & Standards

20080283490 - Protection layer for fabricating a solar cell: A method for fabricating a solar cell is described. The method includes first providing, in a process chamber, a substrate having a light-receiving surface. An anti-reflective coating (ARC) layer is then formed, in the process chamber, above the light-receiving surface of the substrate. Finally, without removing the substrate from the... Agent: Blakely Sokoloff Taylor & Zafman LLP

20080283491 - Fabrication method of printed circuit board and printed circuit board machining apparatus: There is provided a printed circuit board whose peel strength is large and a printed circuit board fabrication method and a printed circuit board machining apparatus that allow a fabrication time and a fabrication cost to be reduced. The fabrication method of the printed circuit board comprises steps of forming... Agent: Wenderoth, Lind & Ponack, L.L.P.

20080283492 - Method for manufacturing light reflecting metal wall: A method for manufacturing a light reflecting metal wall including a step (a) forming a cavity structure on a metal plate on which back surface a substrate is laminated, the cavity structure including on its side wall a light reflecting wall, the step (a) including the steps of (b) forming... Agent: Morrison & Foerster LLP

20080283493 - Method for forming etching mask, method for fabricating three-dimensional structure and method for fabricating three-dimensional photonic crystalline laser device: A method for forming an etching mask comprises the steps of: irradiating focus ion beam to a surface of a substrate and forming an etching mask used for oblique etching including an ion containing portion in the irradiated region. A method for fabricating a three-dimensional structure comprises the steps of:... Agent: Fitzpatrick Cella Harper & Scinto

20080283494 - Method of manufacturing thermal inkjet printhead: A method of manufacturing a thermal inkjet printhead. The method includes forming on a substrate a chamber layer having an ink chamber, forming a sacrificial layer on the chamber layer wherein the sacrificial layer fills the ink chamber, and planarizing a top surface of the sacrificial layer and of the... Agent: Stanzione & Kim, LLP

20080283495 - Micro electro mechanical system device and method of manufacturing the same: A MEMS (Micro Electro Mechanical System) device and a method of manufacturing the same, in which an detection indicator is formed on a chamber layer stacked on a substrate such that a user easily inspects whether the chamber layer has a required thickness. The MEMS device can include two detection... Agent: Stanzione & Kim, LLP

20080283496 - Method for etching and for forming a contact hole using thereof: M

20080283497 - Method for producing air gaps using nanotubes: A target layer comprising at least one degradable material is deposited on a support. Nanotubes are then formed on the degradable material of the target layer before deposition of an insulating layer is performed. Degradation of the degradable material and elimination of degradation sub-products are then performed by means of... Agent: Oliff & Berridge, PLC

20080283499 - Corrosion-resistant member, treatment apparatus and sample treatment method using the member, and method for manufacture of corrosion-resistant member: Disclosed is a corrosion resistant member comprising a sintered material having an α-Al2O3 crystal and an YAG (yttrium-aluminum-garnet) crystal. The corrosion resistant member contains metal elements, 70 to 98% by mass (inclusive) of Al in terms of Al2O3 and 2 to 30% by mass of Y in terms of Y2O3.... Agent: Birch Stewart Kolasch & Birch

20080283498 - Plasma processing device and plasma processing method: The present invention prevents drop in the function of a plasma processing device caused by reduction of a plasma generating chamber by reductive plasma that is generated from the introduced process gas, and extends the life of members which are in contact with reductive plasma, especially the plasma generating chamber... Agent: Snell & Wilmer LLP (oc)

20080283500 - Plasma processing apparatus and plasma processing method: A plasma processing apparatus includes a processing chamber which has a dielectric wall partly formed of a dielectric substance and in which a to-be-processed substrate is subjected to a plasma process, an induction coil which is arranged to face the dielectric wall and generates an induction electric field to generate... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080283501 - Process for manufacturing micro-and nano-devices: A method of depositing or etching a micro- or nano-scale pattern on a work piece is disclosed, including the steps of: (a) placing the work piece in an electrochemical reactor in close proximity to a patterned tool; (b) connecting the work piece such that it is the anode if is... Agent: Buchanan, Ingersoll & Rooney PC

20080283502 - Compositions, methods and systems for polishing aluminum oxide and aluminum oxynitride substrates: A method and system is provided for improved polishing or planarizing of aluminum oxide and/or aluminum oxynitride substrates. Specifically, the composition comprises an abrasive, a liquid carrier, and a phosphorus-type mono-acid. Preferably, the phosphorus-type mono-acid is phosphoric acid, phosphonoacetic acid, phosphorous acid, methyl phosphonic acid, or mixtures thereof. The control... Agent: Steven Weseman Associate General Counsel, I.p.

20080283503 - Method of processing nature pattern on expitaxial substrate: A method of processing nature pattern on expitaxial substrate, unlike the conventional method of processing regular pattern on expitaxial substrate (such as sapphire substrate) by lithography, wet etches a sapphire substrate directly to obtain a nature pattern, so as to simplify the fabrication process. Compared with the conventional way of... Agent: Hdsl

20080277375 - Method for manufacturing flexible display substrate and flexible display device: A method for manufacturing a flexible electrophoretic display device, including: providing a metal mother substrate having a first thickness, including a unit display panel region and a non-display region adjacent the unit display panel region; forming a display element in the unit display panel region; forming a groove in the... Agent: Mckenna Long & Aldridge LLP

20080277377 - Masking material for dry etching: The object of the present invention is to provide a masking material for dry etching, which is suitable for fine processing of a magnetic film as thin as a few nm such as NiFe or CoFe constituting a TMR film and capable of simplifying the process for producing a TMR... Agent: Wenderoth, Lind & Ponack, L.L.P.

20080277376 - Method of manufacturing magnetic head, and magnetic head sub-structure: A method of manufacturing magnetic heads comprises the step of: fabricating a magnetic head substructure by forming a plurality of components of the magnetic heads on a single substrate, wherein a plurality of rows of pre-head portions that will be the respective magnetic heads later are aligned in the substructure;... Agent: Oliff & Berridge, PLC

20080277378 - Method for chemical-mechanical planarization of copper: Method for polishing copper by chemical-mechanical planarization. The method of the present invention includes dissolving MoO3 in an oxidizing agent and deionized water to form a first slurry; filtering the first slurry; adding supplemental ceramic/metal oxide nano-particles to the first slurry after filtering, forming an aqueous slurry; introducing the aqueous... Agent: Fennemore Craig, P.C.

20080277379 - Method for manufacturing a filter substrate, inkjet recording head, and method for manufacturing the inkjet recording head: A filter capable of separating or filtering micro foreign particles in a flow passage is provided. A first mask and a second mask are formed on a silicon substrate by dry etching. Before performing the dry etching, a resist of the first mask is subjected to a heat treatment performed... Agent: Canon U.s.a. Inc. Intellectual Property Division

20080277380 - Processes and apparatuses for producing porous materials: Processes and apparatuses for producing a porous material, such as nano-porous silicon (npSi) media suitable for storage and retrieval of elemental hydrogen. Processes of this invention generally entail applying a magnetic field to a substrate that contains charge carriers and is in contact with an etchant, and then etching the... Agent: Hartman & Hartman, P.C.

20080277381 - Etching solutions: The present invention provides an etching solution for silver or silver alloy comprising one at least ammonium compound represented by the formula (1), (2) or (3) below and an oxidant.... Agent: The Webb Law Firm, P.C.

20080272087 - Method for fabricating probe for use in scanning probe microscope: A method of fabricating a probe tip for use in a scanning probe microscope, includes the steps of: forming a triangular prism provided with a passivation film by patterning a {111} general silicon wafer, the passivation film being deposited on two sidewalls of the triangular prism; etching the silicon wafer... Agent: Pearne & Gordon LLP

20080272088 - Polishing compound and polishing method: A wiring trench 2 is formed in a resin substrate 1, then a wiring metal 3 is embedded in the wiring trench 2, and the wiring metal 3 is polished by using the above-mentioned polishing compound, whereby it is possible to minimize formation of scratches on the metal wiring 3... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080272089 - Monitoring etching of a substrate in an etch chamber: A substrate etching apparatus comprises a chamber having a wall with a window, substrate support pedestal, energy source, and monitoring assembly with signal sensor capable of detecting reflected radiation from the substrate from directly above the substrate after the radiation propagates through the window in the wall. An etching method... Agent: Janah & Associates, P.C.