Etching a substrate: processes October patent listing 10/08

20080257859 - Molecular characterization with carbon nanotube control: In a method for fabricating a molecule characterization device, there is formed an aperture in a support structure, and electrical contact pads are formed on a selected surface of the support structure for connection to molecular analysis circuitry. Then at the aperture is provided at least one carbon nanotube. An... Agent: Theresa A Lober T.a. Lober Patent Services

20080257860 - Method for microstructuring flat glass substrates: In the method for microstructuring flat glass substrates a substrate surface of a glass substrate is coated with at least one structured mask layer and subsequently exposed to a chemically reactive ion etching process (RIE) with at least one chemical etching gas. In order to provide the same or a... Agent: Striker, Striker & Stenby

20080257862 - Method of chemical mechanical polishing of a copper structure using a slurry having a multifunctional activator: The present invention relates to aqueous slurry/solution compositions for the Chemical Mechanical Polishing/Planarization (“CMP”) of substrates. In particular, the novel slurries/solutions of the present invention contain a multifunctional activator which provides increased copper removal rate to the aqueous polishing slurry/solution while suppressing isotropic chemical etch and dishing of copper lines.... Agent: Praxair, Inc. Law Department - M1 557

20080257861 - Method of manufacturing self-ordered nanochannel-array and method of manufacturing nanodot using the nanochannel-array: A method of manufacturing a nanochannel-array and a method of fabricating a nanodot using the nanochannel-array are provided. The nanochannel-array manufacturing method includes: performing first anodizing to form a first alumina layer having a channel array formed by a plurality of cavities on an aluminum substrate; etching the first alumina... Agent: Buchanan, Ingersoll & Rooney PC

20080257864 - Methods and devices to reduce defects in dielectric stack structures: A variety of techniques may be employed alone or in combination to reduce the incidence of defects arising in dielectric stack structures formed by chemical vapor deposition (CVD). Incidence of a first defect type attributable to reaction between an unreacted species of a prior CVD step and reactants of a... Agent: Townsend And Townsend And Crew LLP / Amat

20080257863 - Plasma processing apparatus and method for stabilizing inner wall of processing chamber: A plasma processing apparatus is disclosed for removing the deposition film in the processing chamber and suppressing the corrosion of wall surface material. The plasma processing apparatus includes a plasma generating means, a monitor means for detecting the existence of a reaction product containing a material constituting an inner wall... Agent: Antonelli, Terry, Stout & Kraus, LLP

20080257859 - Molecular characterization with carbon nanotube control: In a method for fabricating a molecule characterization device, there is formed an aperture in a support structure, and electrical contact pads are formed on a selected surface of the support structure for connection to molecular analysis circuitry. Then at the aperture is provided at least one carbon nanotube. An... Agent: Theresa A Lober T.a. Lober Patent Services

20080257860 - Method for microstructuring flat glass substrates: In the method for microstructuring flat glass substrates a substrate surface of a glass substrate is coated with at least one structured mask layer and subsequently exposed to a chemically reactive ion etching process (RIE) with at least one chemical etching gas. In order to provide the same or a... Agent: Striker, Striker & Stenby

20080257862 - Method of chemical mechanical polishing of a copper structure using a slurry having a multifunctional activator: The present invention relates to aqueous slurry/solution compositions for the Chemical Mechanical Polishing/Planarization (“CMP”) of substrates. In particular, the novel slurries/solutions of the present invention contain a multifunctional activator which provides increased copper removal rate to the aqueous polishing slurry/solution while suppressing isotropic chemical etch and dishing of copper lines.... Agent: Praxair, Inc. Law Department - M1 557

20080257861 - Method of manufacturing self-ordered nanochannel-array and method of manufacturing nanodot using the nanochannel-array: A method of manufacturing a nanochannel-array and a method of fabricating a nanodot using the nanochannel-array are provided. The nanochannel-array manufacturing method includes: performing first anodizing to form a first alumina layer having a channel array formed by a plurality of cavities on an aluminum substrate; etching the first alumina... Agent: Buchanan, Ingersoll & Rooney PC

20080257864 - Methods and devices to reduce defects in dielectric stack structures: A variety of techniques may be employed alone or in combination to reduce the incidence of defects arising in dielectric stack structures formed by chemical vapor deposition (CVD). Incidence of a first defect type attributable to reaction between an unreacted species of a prior CVD step and reactants of a... Agent: Townsend And Townsend And Crew LLP / Amat

20080257863 - Plasma processing apparatus and method for stabilizing inner wall of processing chamber: A plasma processing apparatus is disclosed for removing the deposition film in the processing chamber and suppressing the corrosion of wall surface material. The plasma processing apparatus includes a plasma generating means, a monitor means for detecting the existence of a reaction product containing a material constituting an inner wall... Agent: Antonelli, Terry, Stout & Kraus, LLP

20080251493 - Method for manufacturing printed wiring board with built-in capacitor: There is provided a method for manufacturing a wiring board with built-in capacitors in which small high-frequency capacitors, decoupling capacitors, and EMI filter capacitors can be built with precision by using the same method. The method includes preparing an insulating base material 1 having a first metal foil 2 on... Agent: Jacobson Holman PLLC

20080251494 - Method for manufacturing circuit board: A method of manufacturing a circuit board is disclosed. The method may include: forming a relievo pattern, which is in a corresponding relationship with a circuit pattern, on a metal layer that is stacked on a carrier; stacking and pressing the carrier onto an insulation layer with the relievo pattern... Agent: Staas & Halsey LLP

20080251495 - Methods of preparing printed circuit boards and packaging substrates of integrated circuit: A method of forming printed circuit boards and packaging substrates for integrated circuits based on filling-vias plating and a semi-additive process, comprising the following steps: (1) providing a dielectric layer on a substrate; (2) providing blind vias on said dielectric layer; (3) providing a first seed layer after providing blind... Agent: Lerner, David, Littenberg, Krumholz & Mentlik

20080251496 - Optoelectric composite substrate and method of manufacturing the same: An optoelectric composite substrate of the present invention includes an insulating film, an optical waveguide embedded in the insulating film in a state that an upper surface is exposed from the insulating film, a via hole formed to pass through the insulating film, a conductor formed in the via hole,... Agent: Kratz, Quintos & Hanson, LLP

20080251497 - Method of fabricating hollow waveguide having cyclic geometric structure: A waveguide has a hollow center. The waveguide has dielectric tubes which have a geometric arrangement, like a triangle-lattice arrangement. A laser transmitted in the waveguide is confined and is emitted out with a narrow expending angle. Hence, the laser is emitted straightly forwarded and has a low power loss.... Agent: Troxell Law Office PLLC

20080251498 - Phase change memory device and fabrications thereof: A method for forming a memory device is disclosed. A dielectric layer is formed on a substrate. A Sn doped phase change layer is formed on the dielectric layer. A patterned mask layer is formed on the Sn doped phase change layer. The Sn doped phase change layer is etched... Agent: Quintero Law Office, PC

20080245764 - Method for producing a device including an array of microneedles on a support, and device producible according to this method: A method for producing a device which is suitable for delivering a substance into or through the skin and includes an array of microneedles developed out of an Si semiconductor substrate, the microneedles being affixed on and/or inside a flexible support made from a polymer material. A device producible by... Agent: Kenyon & Kenyon LLP

20080245765 - Electrical contacts: Certain embodiments are directed to methods, devices and systems designed to remove selected portions of a material to expose an underlying material or substrate. One or more electrical components may be coupled to the underlying substrate through an electrical contact. Kits and systems for producing electrical contacts are also provided.... Agent: Lowrie, Lando & Anastasi, LLP

20080245766 - Method for manufacturing liqid discharge head: A method for manufacturing liquid discharge heads having a substrate where energy generation elements that generate energy used for discharging liquid are formed, a wiring electrically connected to the energy generation elements, and a flow path communicating with discharge ports for discharging liquid and corresponding to the energy generation elements.... Agent: Canon U.s.a. Inc. Intellectual Property Division

20080245767 - Pre-cleaning of substrates in epitaxy chambers: A method for processing a substrate including a pre-cleaning etch and reduced pressure process is disclosed. The pre-cleaning process involves introducing a substrate into a processing chamber; flowing an etching gas into the processing chamber; processing at least a portion of the substrate with the etching gas to remove a... Agent: Diehl Servilla LLC

20080245768 - Process: m

20080245769 - Nanoparticles and method of making thereof: A method of making nanoparticles includes reacting a first material powder with a second material vapor to form a surface coating on particles of the first material powder, and selectively removing the first material powder to convert the surface coating to third material nanoparticles.... Agent: Foley And Lardner LLP Suite 500

20080245770 - Positive displacement pumping chamber: A substrate processing system as illustrated at (1). A substrate (2) lies upon a piston (3) shown in both the loading position (3a) and in a processing position (3b). The substrate is loaded via a port (4) through a door (5). The loading area (7a), and/or the hole chamber (7)... Agent: Morgan, Lewis & Bockius, LLP.

20080245771 - Method for processing a surface: A method for processing a surface involves depositing at least one class of enzymes (2) onto the surface (1); introducing at least a reactant (3) into an environment of the surface (1), and causing interaction between the enzymes (2) and the reactant (3), thereby to cause processing of a region... Agent: Anne Vachon Dougherty

20080237181 - Hybrid layers for use in coatings on electronic devices or other articles: A method for forming a coating over a surface is disclosed. The method comprises depositing over a surface, a hybrid layer comprising a mixture of a polymeric material and a non-polymeric material. The hybrid layer may have a single phase or comprise multiple phases. The hybrid layer is formed by... Agent: Kenyon & Kenyon LLP

20080237182 - Substrate processing apparatus and substrate processing method: A substrate processing apparatus that can improve the uniformity of plasma processing carried out on a wafer. The wafer is housed in a chamber of the substrate processing apparatus and subjected to plasma processing using plasma produced in the processing chamber. A temperature control mechanism jets a high-temperature gas toward... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080237184 - Method and apparatus for plasma processing: A plasma processing apparatus comprising a vacuum vessel; a process chamber housed in the vacuum vessel; and a sample stage located in the process chamber, for supporting on its upper surface a disk-like sample to be processed; wherein plural disk-like samples are continuously processed with plasma generated in the process... Agent: Antonelli, Terry, Stout & Kraus, LLP

20080237183 - Method of etching an organic low-k dielectric material: A method of etching organic low-k dielectric materials is provided herein. In one embodiment, a method of etching organic low-k dielectric materials includes placing a substrate comprising an exposed organic low-k dielectric material in an etch reactor; supplying a process gas comprising an oxygen-containing gas, a nitrogen-containing gas, and methane... Agent: MoserIPLaw Group / Applied Materials, Inc.

20080237185 - Plasma processing apparatus of substrate and plasma processing method thereof: A substrate plasma processing apparatus includes a chamber of which an interior is evacuated under a predetermined vacuum condition; an RF electrode which is disposed in the chamber and configured so as to hold a substrate to be processed on a main surface thereof; an opposing electrode which is disposed... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080237187 - Method and apparatus for inducing dc voltage on wafer-facing electrode: A method for processing a substrate is disclosed. The method includes supporting the substrate in the plasma-processing chamber configured with a first electrode and a second electrode. The method also includes coupling a passive radio frequency (RF) circuit to the second electrode, the passive RF circuit being configured to adjust... Agent: Ipsg, P.C.

20080237186 - Plasma processing apparatus and method thereof: A blow-off part 152 is provided with a blow-off port 1a′ which is dimensioned small enough so as not to allow a blow-off stream to be blown off directly to a part of a wafer W which part is located at the more internal side of the wafer than the... Agent: Sughrue Mion, PLLC

20080237188 - Substrate processing apparatus and substrate processing method: Mutually different plural kinds of processing liquid are sequentially supplied to a gap space in which a substrate is arranged to perform a wet processing to the substrate with respect to each processing liquid. Further, the processing liquid used in the wet processing is sequentially released from the communicating portion... Agent: Ostrolenk Faber Gerb & Soffen

20080237189 - Method for laser scribing of solar panels: A method and device for ablation of thin layers on the rim region of the surface of a plane substrate coated with a thin film. The rim region runs along the edge or edges of the substrate, and the thin layers should be ablated in at least two, not necessarily... Agent: Pearne & Gordon LLP

20080237190 - Surface cleaning method of semiconductor wafer heat treatment boat: A surface cleaning method of a semiconductor wafer heat treatment boat that can prevent metallic contamination to semiconductor wafers and keep down a production time and manufacturing costs of semiconductor wafers by efficiently and easily removing metallic impurities in an oxide film on an SiC boat surface is provided. A... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.