Etching a substrate: processes inventions 09/08

20080230510 - Method of processing substrates: This invention relates to a method of processing substrates including: (a) etching, in a chamber, a generally vertical structure in a substrate using a cyclic process including an etch step using a reactive etch gas and a deposition step for depositing a protective polymer on to the side walls of... Agent: Morgan, Lewis & Bockius, LLP.

20080230511 - Halogen-free amorphous carbon mask etch having high selectivity to photoresist: In one embodiment of the present invention, a halogen-free plasma etch processes is used to define a feature in a multi-layered masking stack including an amorphous carbon layer. In a particular embodiment, oxygen (O2), nitrogen (N2), and carbon monoxide (CO) are utilized to etch the amorphous carbon layer to form... Agent: Applied Materials/bstz Blakely Sokoloff Taylor & Zafman LLP

20080230512 - Printed circuit board and method for processing printed circuit board: There is provided a printed circuit board including an alternate laminate of electric conductor layers and electrically insulating layers, wherein a coating layer capable of absorbing laser light but insoluble in an etching solution dissolving the electric conductor layers is provided on a front surface of a first one of... Agent: Crowell & Moring LLP Intellectual Property Group

20080230513 - Method of manufacturing ink-jet print head: A method for manufacturing an ink-jet print head including: preparing a single crystal silicon wafer having a (110) crystal plane orientation, as a substrate; forming a heater to heat an ink, on a front surface of a silicon substrate; forming a trench inward of the heater; forming a flow channel... Agent: Stein, Mcewen & Bui, LLP

20080230514 - Method of producing nanopatterned templates: Nanopatterned substrates can be prepared by a method that includes forming a block copolymer film on a substrate, annealing the block copolymer film, surface reconstructing the annealed block copolymer film, coating an etch-resistant layer on the surface reconstructed block copolymer film, etching the resist-coated block copolymer film to create an... Agent: Cantor Colburn, LLP

20080230515 - Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof: The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern... Agent: Oliff & Berridge, PLC

20080230516 - Method for forming fine patterns using etching slope of hard mask layer in semiconductor device: A method for forming fine patterns in a semiconductor device includes forming a first hard mask layer and a second hard mask layer over an etch target layer, forming second hard mask patterns by etching the second hard mask layer, wherein an etching profile of the second hard mask layer... Agent: Blakely Sokoloff Taylor & Zafman LLP

20080230517 - Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter: In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080230518 - Gas flow diffuser: A method and apparatus for providing flow into a processing chamber are provided. In one embodiment, a vacuum processing chamber is provided that includes a chamber body having an interior volume, a substrate support disposed in the interior volume and a gas distribution assembly having an asymmetrical distribution of gas... Agent: Patterson & Sheridan, LLP - - Appm/tx

20080230519 - Method and system for dry etching a metal nitride: A method and system of etching a metal nitride, such as titanium nitride, is described. The etching process comprises introducing a process composition having a halogen containing gas, such as Cl2, HBr, or BCl3, and a fluorocarbon gas having the chemical formula CxHyFz, where x and z are equal to... Agent: Dla Piper US LLP

20080223819 - Method and etchant for removing glass-coating from metal wires: An etchant for and method of removing a glass coating on a metallic wire is provided. The etchant comprises an acid solution having metal ions contained therein. The metal ions prevent the acid solution from pitting or damaging the metallic wire, while allowing the acid solution to effectively etch and... Agent: Ge Energy General Electric C/o Ernest G. Cusick

20080223820 - Method for forming miniature wires: A method for forming miniature wires by printing or dispensing a solution on a substrate, the solution comprising a solute being capable of being etched and forming an inner and outer region on the substrate, each region having a thickness. After an etching process is applied on the substrate, the... Agent: Muncy, Geissler, Olds & Lowe, PLLC

20080223822 - Fiber coating processing and slitting for non-confined light leakage: An optical fiber and methods of processing and manufacturing an optical fiber comprising a core, a cladding and a coating covering a segment of the cladding proximate to an end of the optical fiber are presented where patterned apertures are provided in the coating such that a portion of light... Agent: Ratnerprestia

20080223821 - Slotted guide structure:

20080223824 - Columnar structured material and method of manufacturing the same: A method of manufacturing a dot pattern includes the steps of preparing a structured material composed of a plurality of columnar members containing a first component and a region containing a second component different from the first component surrounding the columnar members, with the structured material being formed by depositing... Agent: Fitzpatrick Cella Harper & Scinto

20080223823 - Video rate-enabling probes for atomic force microscopy: Method for producing a probe for atomic force microscopy with a silicon nitride cantilever and an integrated single crystal silicon tetrahedral tip with high resonant frequencies and low spring constants intended for high speed AFM imaging.... Agent: Foley And Lardner LLP Suite 500

20080223825 - Substrate processing apparatus, substrate processing method and storage medium: A substrate processing apparatus includes: a gas supply mechanism supplying gas containing a halogen element and basic gas into a process chamber; and a first temperature adjusting member and a second temperature adjusting member adjusting a temperature of the substrate in the process chamber, wherein the second temperature adjusting member... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080223826 - Reagent delivery using a membrane-mediated process: Methods and apparatuses for using a semi-permeable membrane to deliver a reagent to a surface in a topographically selective manner are provided. The methods and apparatuses are particularly useful for removing sulfur-containing electrocatalysts from copper surfaces using a semi-permeable membrane to deliver an oxidizing agent to a catalyst-coated surface.... Agent: E I Du Pont De Nemours And Company Legal Patent Records Center

20080217289 - Magnetoresistance effect device and method of production thereof: A method of production of a magnetoresistance effect device is able to prevent or minimize a drop in the MR ratio and maintain the high performance of the magnetoresistance effect device even if forming an oxide layer as a surface-most layer constituting a protective layer by the oxidation process inevitably... Agent: Buchanan, Ingersoll & Rooney Pc

20080217288 - Method of manufacturing a magnetic sensor with tilted magnetoresistive structures: A method of manufacturing a magnetic field sensor device in one embodiment includes applying a mask on a substrate, performing a wet etching procedure on the substrate for generating at least a first groove having tilted side walls, and depositing at least one layer of magnetoresistive material onto a section... Agent: Zilka-kotab, Pc- Ibm

20080217287 - Method of manufacturing a thin-film magnetic head, thin-film magnetic head manufacturing apparatus, and thin-film magnetic head manufacturing system: A method of manufacturing a thin-film magnetic head works a part to be worked to a target length by carrying out an etching process on an object to be worked using an etching apparatus. The method carries out a measuring process that measures a length before working of a part... Agent: Greenblum & Bernstein, P.L.C

20080217290 - Method of manufacturing nozzle plate and method of manufacturing liquid ejection head: The method of manufacturing a nozzle plate includes: a lyophobic film forming step of preparing a nozzle plate having a recess-shaped counterbore section and a nozzle opened in a bottom surface of the counterbore section, and forming a lyophobic film on a surface of the nozzle plate including the bottom... Agent: Birch Stewart Kolasch & Birch

20080217291 - Substrate mounting stage and surface treatment method therefor: A substrate mounting stage that prevents poor attraction of substrates so as to improve the operating rate of a substrate processing apparatus. The substrate mounting stage is disposed in the substrate processing apparatus and has a substrate mounting surface on which a substrate is mounted. The arithmetic average roughness (Ra)... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.c.

20080217292 - Registered structure formation via the application of directed thermal energy to diblock copolymer films: Methods for fabricating sublithographic, nanoscale linear microchannel arrays over surfaces without defined features utilizing self-assembling block copolymers, and films and devices formed from these methods are provided. Embodiments of the methods use a multilayer induced ordering approach to align lamellar films to an underlying base film within trenches, and localized... Agent: Whyte Hirschboeck Dudek S.c.

20080217294 - Method and system for etching a hafnium containing material: A method of etching a hafnium containing layer includes disposing a substrate having the hafnium containing layer in a plasma processing system, wherein a mask layer defining a pattern therein overlies the hafnium containing layer. A process gas including a HBr gas is introduced to the plasma processing system, and... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.c.

20080217293 - Processing system and method for performing high throughput non-plasma processing: Embodiments of apparatus and methods for performing high throughput non-plasma processing are generally described herein. Other embodiments may be described and claimed.... Agent: Wood, Herron & Evans, LLP (tokyo Electron)

20080217295 - Plasma processing apparatus and plasma processing method: The present invention provides a plasma processing apparatus or a plasma processing method that can etch a multilayer film structure for constituting a gate structure with high accuracy and high efficiency. A plasma processing method of, on processing a sample on a sample stage 112 in a depressurized discharge room... Agent: Antonelli, Terry, Stout & Kraus, LLP

20080217296 - Etching apparatus for semiconductor processing apparatus and method thereof for recycling etchant solutions: An etching apparatus of a semiconductor processing apparatus and the method thereof for recycling etchant solutions are provided. The method is suitable for a processing apparatus which provides an etchant solution on a wafer so as to perform an etching process. After the etching process is completed, a water solution... Agent: J C Patents, Inc.

20080210660 - Medium for etching oxidic, transparent, conductive layers: The present invention relates to a novel dispensable medium for etching doped tin oxide layers having non-Newtonian flow behaviour for etching surfaces in the production of displays and/or solar cells and to the use thereof. In particular, it relates to corresponding particle-free compositions by means of which fine structures can... Agent: Millen, White, Zelano & Branigan, P.C.

20080210661 - Method for forming via hole in substrate for flexible printed circuit board: There is provided a method for forming a via hole (2) in a substrate (10) for a flexible printed circuit board, the method being capable of simply forming a via hole having an excellent circularness of an opening portion and high reliability. In a method for forming a via hole... Agent: 3m Innovative Properties Company

20080210662 - Thick porous anodic alumina films and nanowire arrays grown on a solid substrate: The presently disclosed invention provides for the fabrication of porous anodic alumina (PAA) films on a wide variety of substrates. The substrate comprises a wafer layer and may further include an adhesion layer deposited on the wafer layer. An anodic alumina template is formed on the substrate. When a rigid... Agent: Daly, Crowley, Mofford & Durkee, LLP

20080210663 - Method for manufacturing a probe: The present invention provides a probe manufacturing method in which, after a metal material for a probe is deposited on a base table, the probe can be detached from the base table relatively easily. A sacrificial layer is formed on a base table. The sacrificial layer is partially removed so... Agent: Ingrassia Fisher & Lorenz, P.C.

20080210664 - Method of surface treatment and surface-treated article: Plasma generated in water vapor bubbles present in a water-containing liquid is brought into contact, in the liquid, with an article having a contact angle with water of 90° or less. The plasma is contacted with an organic substance adhering to the article to thereby remove the organic substance from... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080210665 - Polishing composition and polishing method: A polishing composition includes an abrasive, phosphoric acid, and an oxidizing agent and has a pH of 6 or less. The polishing composition has the capability for polishing an alloy containing nickel and iron with a high stock removal rate. Accordingly, the polishing composition is preferably used in an application... Agent: Kirton & Mcconkie