Etching a substrate: processes inventions 05/08

20080121609 - Method of forming a pattern and method of manufacturing a capacitor: In a method of forming a pattern, a mold layer having an opening is formed on a substrate. A conductive layer is formed on the mold layer having the opening, the conductive layer having a substantially uniform thickness. A buffer layer pattern is formed in the opening having the conductive... Agent: Marger Johnson & Mccollom, P.C.

20080121610 - Method of manufacturing fine patterns: A method of manufacturing fine patterns includes providing a base portion having a plurality of protruding portions with recess portions therebetween, depositing a material layer on the protruding portions, the material layer including grooves in an upper surface thereof and a plurality of material portions on respective protruding portions, the... Agent: Lee & Morse, P.C.

20080121611 - Micro-fabricated devices having a suspended membrane or plate structure: The invention relates to micro-fabricated devices having a suspended membrane or plate structure and micro-fabrication techniques for making such devices. A substrate defines a cavity passing through the substrate, and the cavity defines a first opening. An intermediate portion is disposed over the substrate and defines a second opening. The... Agent: Proskauer Rose LLP

20080121612 - Method for fabricating an lcd device: A method for fabricating an LCD device is disclosed, in which a reliable thin film pattern is formed as process deviation is minimized. The method includes forming a thin film on a substrate; forming an etch resist solution on the thin film; applying a soft mold having a concave portion... Agent: Mckenna Long & Aldridge LLP

20080121613 - Method of manufacturing solar panel: A method of manufacturing a solar cell panel, includes steps (a) to (e). The step (a) is a step of forming a solar cell module by laminating solar cell films on a transparency substrate. The step (b) is a step of performing an inspection of electric power generation on the... Agent: Kanesaka Berner And Partners LLP

20080121614 - Methods for manufacturing optical fiber probe and for processing micromaterial: In a method for manufacturing an optical fiber probe in which an optical fiber is formed as an optical fiber probe by etching a tip section and sharpening a core region of the optical fiber, the optical fiber is a polarization maintaining optical fiber including the core region, a stress-applying... Agent: Wenderoth, Lind & Ponack, L.L.P.

20080121615 - Method of fabricating an ink jet nozzle with a heater element: The invention relates to a method of fabricating an ink jet nozzle. The method includes the steps of depositing and etching a passivation layer on a silicon substrate having drive circuitry and an interlayer dielectric interconnect to form a first sacrificial scaffold. Also included are the steps of depositing heater... Agent: Silverbrook Research Pty Ltd

20080121617 - Etching method for metal layer of display panel: An etching process of a metal layer of a display panel is provided. First, a substrate with at least one display panel region, a testing device region, and a non-device region is provided. Then, a metal layer is formed over the substrate to cover the display panel region, the testing... Agent: Jianq Chyun Intellectual Property Office

20080121618 - Method of electrochemical fabrication: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first... Agent: Microfabrica Inc. Att: Dennis R. Smalley

20080121616 - Spatial-frequency tripling and quadrupling processes for lithographic application: A number of spatial-frequency tripling and quadrupling technologies are invented to pattern features with their pitch size reduced to ⅓ and ¼ of the minimum pitch size resolvable with a conventional lithographic technology. Both spatial-frequency tripling and quadrupling can be achieved with two processes. Each process comprises a series of... Agent: Yijian Chen

20080121619 - Method of cleaning wafer after etching process: A method of cleaning a wafer after an etching process is provided. A substrate having an etching stop layer, a dielectric layer, a patterned metal hard mask sequentially formed thereon is provided. Using the patterned metal hard mask, an opening is defined in the dielectric layer. The opening exposes a... Agent: Jianq Chyun Intellectual Property Office

20080121620 - Processing chamber: A processing system includes a chamber. A plurality of processing stations in a center region in the chamber can be sequentially positioned when viewed in a first direction. The plurality of processing stations is configured to provide at least one processing step selected from the group consisting of thermal evaporation,... Agent: Xin Wen

20080121621 - Printable medium for the etching of silicon dioxide and silicon nitride layers: The present invention relates to a novel printable etching medium having non-Newtonian flow behaviour for the etching of surfaces in the production of solar cells and to the use thereof. In particular, the invention relates to corresponding particle-containing compositions by means of which extremely fine structures can be etched very... Agent: Millen, White, Zelano & Branigan, P.C.

20080121622 - Composition for etching silicon oxide and method of forming a contact hole using the same: In a composition for etching silicon oxide, and a method of forming a contact hole using the composition, the composition which includes from about 0.01 to about 2 percent by weight of ammonium bifluoride, from about 2 to about 35 percent by weight of an organic acid, from about 0.05... Agent: Marger Johnson & Mccollom, P.C.

20080121623 - Method of selectively stripping an engine-run ceramic coating: A process for selectively stripping a coating from a component of a turbomachine, and particularly a coating having a ceramic matrix that contains metallic particles dispersed therein that render the coating more difficult to remove from the component after the component has been subjected to elevated temperatures during operation of... Agent: Hartman And Hartman, P.C.

20080116166 - Method for manufacturing multilayer flexible printed circuit board: The present inventions relates to a method for manufacturing a multilayer FPCB having different number of layers in different areas. The method includes the steps of: providing a binder layer; removing a portion of the binder layer thereby defining an opening in the binder layer; forming a multilayer FPCB which... Agent: Pce Industry, Inc. Att. Cheng-ju Chiang

20080116167 - Ink jet print head manufacturing method and ink jet print head: An object of this invention is to provide a manufacturing method that, by using a general-purpose semiconductor fabrication process, can easily manufacture an ink jet print head in which energy generating elements are complicatedly installed in the ink path. To this end, the present invention comprising steps of providing a... Agent: Fitzpatrick Cella Harper & Scinto

20080116168 - Method of forming branched structures: The present invention provides a method of forming a branched structure which comprises applying colloidal-sized particles over structures. The coated structures are then etched such that the structures are etched through the colloidal particles to form branched structures. The etch may be a reactive ion etch. The structures may be... Agent: Barnes & Thornburg LLP

20080116169 - Method and structure of pattern mask for dry etching: The present invention provides a structure for etching process. The structure has a mask for protecting an area of a wafer from being etched and a seal ring attached under a lower surface of the mask. The mask has at least one air opening to expose an area to be... Agent: Kusner & Jaffe Highland Place Suite 310

20080116170 - Selective metal wet etch composition and process: Composition and a process using the composition for selectively wet etching metal including depositing metal on a silicon surface; applying energy to cause respective portions of the metal and silicon to form silicide, leaving a quantity of unreacted metal; selectively wet etching the unreacted metal by applying to the unreacted... Agent: Renner Otto Boisselle & Sklar, LLP

20080116172 - Method for one-to-one polishing of silicon nitride and silicon oxide: The present invention provides a method of removing silicon nitride at about the same removal rate as silicon dioxide by CMP. The method utilizes a polishing slurry that includes colloidal silica abrasive particles dispersed in water and additives that modulate the silicon dioxide and silicon nitride removal rates such that... Agent: Rankin, Hill & Clark LLP

20080116171 - Method for the preferential polishing of silicon nitride versus silicon oxide: The present invention provides a method of removing silicon nitride in preference to silicon dioxide by CMP. The method utilizes a polishing slurry that includes colloidal silica abrasive particles dispersed in water and an additive that suppresses the silicon dioxide removal rate but enhances the silicon nitride removal rate. In... Agent: Rankin, Hill & Clark LLP

20080110856 - Method for electrochemical fabrication: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first... Agent: Microfabrica Inc. Att: Dennis R. Smalley

20080110857 - Method of electrochemical fabrication: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first... Agent: Microfabrica Inc. Att: Dennis R. Smalley

20080110858 - Method of manufacturing multilayer thin film pattern and display device: A method of manufacturing a multilayer thin film pattern includes forming a metal film over a substrate, forming a second thin film over the metal film, forming a resist pattern over the second thin film, etching the second thin film using the resist pattern as a mask, transforming the resist... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.c.

20080110859 - Plasma etching apparatus and method: An upper electrode and a lower electrode are disposed opposite to each other in a process container configured to be vacuum-exhausted. The upper electrode is connected to a first RF power supply configured to apply a first RF power for plasma generation. The lower electrode is connected to a second... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.c.

20080110860 - Method of plasma confinement for enhancing magnetic control of plasma radial distribution: A method for processing a workpiece in a plasma reactor. The method comprises constraining plasma in the chamber away from the floor of the pumping annulus, providing an annular baffle while compensating for asymmetry of gas flow attributable to the pumping port, and providing a gas flow equalizer below the... Agent: Robert M. Wallace Law Office Of Robert M. Wallace

20080110862 - Manufacturing method of the flexible display device: A method for manufacturing a flexible display device in which a flexible substrate is acquired by forming display devices on one side of the substrate and thinning the substrate by removing surface portions on an opposite side of the substrate. The thickness of the substrate is changed from a first... Agent: Brinks Hofer Gilson & Lione

20080110861 - Substrate processing apparatus and method: The substrate processing apparatus has substrate holding mechanisms (14) for holding the substrate (W) under a holding force which is changed according to a rotational speed of the substrate holding mechanisms (14), a substrate rotation mechanism (22) for rotating the substrate holding mechanisms (14) to rotate the substrate (W) held... Agent: Wenderoth, Lind & Ponack, L.l.p.

20080110863 - Nano fabrication method for glass: An exemplary embodiment of the present invention provides a nano fabrication method for a glass, the method including forming a molecule substituting layer on a glass substrate, patterning the molecule substituting layer correspondent to shapes to be patterned on the glass substrate, substituting crystal atoms of the glass substrate with... Agent: Marshall, Gerstein & Borun LLP

20080110855 - Methods and devices for inhibiting tilting of a mirror in an interferometric modulator: Interferometric modulators having a separable modulator architecture are disclosed having a reflective layer suspended from a flexible layer over a cavity. The interferometric modulators have one or more anti-tilt members that inhibit undesirable movement of the reflective layer, such as curling and/or tilting. The stabilization of the reflective layer by... Agent: Knobbe, Martens, Olson & Bear, LLP

20080105648 - Carbon nanotube substrates and catalyzed hot stamp for polishing and patterning the substrates: The present invention is generally directed to catalyzed hot stamp methods for polishing and/or patterning carbon nanotube-containing substrates. In some embodiments, the substrate, as a carbon nanotube fiber end, is brought into contact with a hot stamp (typically at 200-800° C.), and is kept in contact with the hot stamp... Agent: Winstead PC Winstead PC

20080105649 - Etching of nano-imprint templates using an etch reactor: Methods for etching a metal layer using an imprinted resist material are provided. In one embodiment, a method for processing a photolithographic reticle includes providing a reticle having a metal photomask layer formed on an optically transparent substrate and an imprinted resist material deposited on the metal photomask layer, etching... Agent: Patterson & Sheridan, LLP - - Appm/tx

20080105652 - Cmp of copper/ruthenium/tantalum substrates: The invention provides a chemical-mechanical polishing composition for polishing a substrate. The polishing composition comprises an abrasive, an oxidizing agent, an amphiphilic nonionic surfactant, calcium ion or magnesium ion, a corrosion inhibitor for copper, and water, wherein the pH of the polishing composition is about 6 to about 12. The... Agent: Steven Weseman Associate General Counsel, I.p.

20080105651 - Polishing slurry for cmp: A polishing liquid for CMP has a composition loaded with, for example, an inorganic salt, a protective film forming agent and a surfactant capable of imparting a dissolution accelerating activity to enlarge a difference between polishing speed under non-load and polishing speed under load. By virtue of this polishing liquid... Agent: Antonelli, Terry, Stout & Kraus, LLP

20080105653 - Apparatus and methods for cleaning and drying of wafers: An first example method and apparatus for etching and cleaning a substrate comprises device with a first manifold and a second manifold. The first manifold has a plurality of nozzles for dispensing chemicals onto the substrate. The second manifold is attached to a vacuum source and/or a dry air/gas source.... Agent: HorizonIPPte Ltd

20080105647 - Methods for electrochemically fabricating structures using adhered masks, incorporating dielectric sheets, and/or seed layers that are partially removed via planarization: Embodiments of the present invention provide mesoscale or microscale three-dimensional structures (e.g. components, device, and the like). Embodiments relate to one or more of (1) the formation of such structures which incorporate sheets of dielectric material and/or wherein seed layer material used to allow electrodeposition over dielectric material is removed... Agent: Microfabrica Inc.

20080105646 - Multi-step release method for electrochemically fabricated structures: Multi-layer structures are electrochemically fabricated from at least one structural material (e.g. nickel), that is configured to define a desired structure and which may be attached to a substrate, and from at least one sacrificial material (e.g. copper) that surrounds the desired structure. After structure formation, the sacrificial material is... Agent: Microfabrica Inc. Att: Dennis R. Smalley

20080105650 - Plasma processing device and plasma processing method: A plasma processing device reduces the pressure inside a vacuum waveguide which propagates microwave to a vacuum of a high degree, thereby preventing abnormal discharge in the vacuum waveguide and around a slot plate, and reduces the difference in pressure between the processing chamber and the vacuum waveguide, thereby lowering... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080099425 - New slotted guide structure: P

20080099426 - Method and apparatus for photomask plasma etching: A method and apparatus for etching photomasks are provided herein. The apparatus includes a process chamber with a shield above a substrate support. The shield comprises a plate with apertures, and the plate has two zones with at least one characteristic, such as material or potential bias, that is different... Agent: Patterson & Sheridan, LLP

20080099427 - Fabrication method of electronic device: A fabrication method of an electronic device is provided. First, a substrate is provided. Then, a patterned amorphous carbon (α-C) layer is formed on the substrate and exposes part of the substrate. Next, a first α-C layer covering the patterned α-C layer and part of the substrate is formed. Then,... Agent: Bacon & Thomas, PLLC

20080099429 - Methods for repairing patterned structures of electronic devices: Methods for repairing patterned structure of electronic devices. A first substrate with a patterned structure thereon is provided, wherein the patterned structure includes at least one defect. The defect corresponds to a defect region while the patterned structure corresponds to a main region. A first surface treatment is performed on... Agent: Quintero Law Office, PC

20080099430 - Method for connecting array of optical waveguides to an array of optical fibers with very small pitch: A method and apparatus are provided to decrease the diameter of the end of an optical fiber in order to make it possible to arrange optical fibers in an array with very high pitch. Also provided is an optical device comprising a plurality of optical fibers, each fiber formed of... Agent: Empk & Shiloh, LLP

20080099431 - Method and apparatus for photomask plasma etching: A method and apparatus for etching photomasks is provided herein. In one embodiment, the apparatus comprises a process chamber having a support pedestal adapted for receiving a photomask. An ion-neutral shield is disposed above the pedestal and a deflector plate assembly is provided above the ion-neutral shield. The deflector plate... Agent: Patterson & Sheridan, LLP

20080099432 - Process for etching a transparent workpiece including backside endpoint detection steps: A method is provided for defining a pattern on a workpiece such as a transparent substrate or mask or a workpiece that is at least transparent within a range of optical wavelengths. The method includes defining a photoresist pattern on the top surface of the mask, the pattern including a... Agent: Robert M. Wallace Law Office Of Robert M. Wallace

20080099433 - Automatic positioning/engraving method for laser engraving machine: In the automatic positioning/engraving method for a laser engraving machine, a pattern to be used for engraving is framed with a quadrilateral frame, then a first and a second coordinate position of two mutually opposite ends of a diagonal line of the quadrilateral frame are obtained by measuring; a pen... Agent: Troxell Law Office PLLC

20080099435 - Endpoint detection for photomask etching: Apparatus and method for endpoint detection are provided for photomask etching. The apparatus provides a plasma etch chamber with a substrate support member. The substrate support member has at least two optical components disposed therein for use in endpoint detection. Enhanced process monitoring for photomask etching are achieved by the... Agent: Patterson & Sheridan, LLP

20080099436 - Endpoint detection for photomask etching: Apparatus and method for endpoint detection are provided for photomask etching. The apparatus provides a plasma etch chamber with a substrate support member. The substrate support member has at least two optical components disposed therein for use in endpoint detection. Enhanced process monitoring for photomask etching are achieved by the... Agent: Patterson & Sheridan, LLP

20080099434 - Plasma mask etch method of controlling a reactor tunable element in accordance with the output of an array of optical sensors viewing the mask backside: A plasma etch method includes simultaneously illuminating an array of plural locations on front surface of the workpiece through the backside of the workpiece with light of a wavelength range for which the workpiece is transparent, while viewing light reflected from the array of plural locations to the backside of... Agent: Robert M. Wallace Law Office Of Robert M. Wallace

20080099439 - Apparatus and method for controlling relative particle speeds in a plasma: An apparatus for controlling a plasma etching process includes plasma control structure that can vary a size of a plasma flow passage, vary a speed of plasma flowing through the plasma flow passage, vary plasma concentration flowing through the plasma flow passage, or a combination thereof.... Agent: Haynes And Boone, LLP

20080099437 - Plasma reactor for processing a transparent workpiece with backside process endpoint detection: A plasma reactor is provided for processing a workpiece such as a transparent mask or a semiconductor wafer that is transparent at least within a range of wavelengths. The reactor includes a vacuum chamber having a sidewall and a ceiling. A workpiece support pedestal has a support surface facing said... Agent: Robert M. Wallace Law Office Of Robert M. Wallace

20080099438 - Wavefront modulation methods for euv maskless lithography: Wavefront modulation methods based on a general multiple-scan imaging model are invented for EUV maskless lithography. The model includes the effects of both deterministic image blur caused by uniform linear scanning of the wafer and stochastic blur due to laser's random timing jitter. It is shown that the expected blurred... Agent: Yijian Chen

20080099443 - Peak-based endpointing for chemical mechanical polishing: A polishing system receives one or more target parameters for a selected peak in a spectrum of light, polishes a substrate, measures a current spectrum of light reflected from the substrate while the substrate is being polished, identifies the selected peak in the current spectrum, measures one or more current... Agent: Fish & Richardson P.C.

20080099444 - Micro-fabrication method: A micro-fabrication method characterized by comprising the steps of applying a pulse laser beam to a plastic material to be processed exhibiting a glass phase transition by heating and having a heat-shrinkage to form laser-processed patterns on the surface of or in the above plastic material to be processed, and... Agent: Wenderoth, Lind & Ponack, L.L.P.

20080099428 - Piezoelectric electronic component, process for producing the same, and communication apparatus: A piezoelectric electronic component for use in a cellular phone or the like and capable of achieving reductions in size and profile is provided. A piezoelectric element oscillating in response to application of an input signal and outputting an output signal corresponding to the oscillations is provided on a substrate.... Agent: Dickstein Shapiro LLP

20080099441 - Apparatus and method for reactive atom plasma processing for material deposition: A method for shaping a surface of a workpiece, comprises positioning at least one of a workpiece and an inductively-coupled plasma (ICP) torch including three concentrically arranged tubes. A plasma gas is introduced to an outer tube of the ICP torch and energy is transferred from a radio frequency (RF)... Agent: Fliesler Meyer LLP

20080099440 - Substrate processing method and substrate processing system: A substrate processing method capable of preventing a reduction in productivity of the fabrication of a semiconductor device from a substrate. An HF gas is supplied toward a wafer having a thermally-oxidized film, a BPSG film, and a deposit film, to thereby selectively etch the BPSG film and the deposit... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080099442 - Method of polishing implantable medical devices to lower thrombogenecity and increase mechanical stability: The present invention relates to a method of polishing an implantable medical device. The method may include positioning an implantable medical device on a support. At least a portion of a surface of the implantable medical device may include a polymer. A fluid may be contacted with at least a... Agent: Squire, Sanders & Dempsey LLP