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Etching a substrate: processes inventions 03/08

Recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing format for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
  
03/27/2008 > patent applications in patent subcategories.

20080073318 - Method of manufacturing piezoelectric resonator: When forming an opening conforming to a groove of a quartz resonator in a metal film serving as a mask of the quartz resonator by conducting etching, the outer periphery of the metal film is wavingly etched. Therefore, when the groove is formed on the quartz resonator, the quartz resonator... Agent: Jordan And Hamburg LLP

20080073319 - Method of manufacturing liquid ejection head: A method of manufacturing a liquid ejection head in which a pressure chamber for storing an ejection liquid is connected with an ink supply channel through a restrictor, includes the steps of: forming first spaces for the liquid supply channel and the pressure chamber in a silicon substrate by performing... Agent: Birch Stewart Kolasch & Birch

20080073321 - Method of patterning an anti-reflective coating by partial etching: A method of patterning a thin film is described. The method comprises forming a thin film to be patterned on a substrate, forming an anti-reflective coating (ARC) layer on the thin film, and forming a mask layer on the ARC layer. Thereafter, the mask layer is patterned to form a... Agent: Wood, Herron & Evans, LLP (tokyo Electron)

20080073322 - Resist pattern thickening material, method for forming resist pattern, semiconductor device and method for manufacturing the same: The present invention provides a resist pattern thickening material, which can utilize ArF excimer laser light; which, when applied over a resist pattern to be thickened, e.g., in form of lines and spaces pattern, can thicken the resist pattern to be thickened regardless of the size of the resist pattern... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20080073320 - Bubble-ink jet print head and fabrication method thereof: A bubble-ink jet print head includes: a substrate having ink chambers to store ink and resistance heat emitting bodies to heat ink disposed thereover; and an ink supply passage which penetrates the substrate and which is connected with the ink chambers. The ink supply passage includes: a first trench formed... Agent: Staas & Halsey LLP

20080073323 - Adhesive microstructure and method of forming same: A method of forming an adhesive force includes removing a seta from a living specimen, attaching the seta to a substrate, and applying the seta to a surface so as to establish an adhesive force between the substrate and the surface. The seta is applied to the surface with a... Agent: Morrison & Foerster LLP

20080073324 - Method for processing outer periphery of substrate and apparatus thereof: To make an arrangement so as not to give any damage to the central part of a substrate during the operation for removing unnecessary film coated on the outer peripheral part of the substrate. The stage is provided therein with a refrigerant chamber 41 as a heat absorber and a... Agent: Sughrue Mion, PLLC

20080073325 - Mirror etching solution: A mirror etching solution is a solution of water and sulfated potash and when applied to the electroplated surface on the back, or non-reflective surface, of a mirror, effectively simulates the appearance of a tarnished or deteriorated “antique” mirror. The electroplated surface applied to the back of new mirrors is... Agent: Baker, Donelson, Bearman, Caldwell & Berkowitz

  
03/20/2008 > patent applications in patent subcategories.

20080067145 - Method of recycling dummy wafer: A method of recycling dummy wafer is provided. The dummy wafer has at least one low-k dielectric material layer formed thereon. A treatment process is performed to the low-k dielectric material layer on the dummy wafer so that a component or impurity in the low-k dielectric material layer reacts to... Agent: Jianq Chyun Intellectual Property Office

20080067146 - Plasma processing apparatus, method for detecting abnormality of plasma processing apparatus and plasma processing method: The plasma processing apparatus relating to the present invention is provided with a process chamber, a pressure measuring unit for measuring the pressure inside of the process chamber and a pump for exhausting a gas in the process chamber. A pressure control valve for maintaining the pressure inside of the... Agent: Mcdermott Will & Emery LLP

20080067148 - Etchant for patterning composite layer and method of fabricating patterned conductive layer of electronic device using the same: An etchant for patterning composite layer containing copper is provided. The etchant includes peracetic acid being about 5% to 40% by weight and serving as a major component, a peracetic acid stabilizer being about 5% to 15% by weight, an organic acid being about 5% to 10% by weight, an... Agent: Jianq Chyun Intellectual Property Office

20080067143 - Cpl mask and a method and program product for generating the same: A method of generating a mask for printing a pattern including a plurality of features. The method includes the steps of depositing a layer of transmissive material having a predefined percentage transmission on a substrate; depositing a layer of opaque material on the transmissive material; etching a portion of the... Agent: Mcdermott Will & Emery LLP

20080067144 - Manufacturing method for vibrator: After an external shape of a photoresist layer is patterned with use of a Cr film as an underlayer, i.e., a metal film to serve as an anticorrosive film that resists crystal etching, and an Au film as a surface layer, the Au film is etched. After groove portions are... Agent: Michael A Makuch Smith Gmbrel&russel

20080067147 - Processing apparatus and processing method: The present invention provides a processing apparatus and a processing method, both of which can carry out a low-temperature process to allow active gas species to react with an oxide film on an object to be processed to form a product film and a heating process to heat the object... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080067149 - Stabilizer for acidic, metal-containing polishing baths: The present invention relates to the use of a mixture of urea and one or more alkane-diphosphonic acids, optionally substituted with one or more hydroxyl or amino groups, or salts thereof for the stabilization of an acidic, metal- and peroxide-containing polishing solution. The invention also relates to peroxide-containing solutions that... Agent: Borden Ladner Gervais LLP Gail C. Silver

  
03/13/2008 > patent applications in patent subcategories.

20080061027 - Method for forming a micro fuel cell: A method is provided for fabricating a fuel cell that requires only front side alignment techniques to fabricate gas access holes. The method comprises etching the front side of a substrate (12) to provide a channel (24, 26), and forming a pedestal (54, 88) on the front side of the... Agent: Ingrassia Fisher & Lorenz, P.C.

20080061030 - Methods for patterning indium tin oxide films: A method of patterning an indium tin oxide film includes the steps of forming a cap layer over the indium tin oxide film and subjecting exposed areas of the indium tin oxide film to a water plasma.... Agent: Duane Morris LLPIPDepartment (tsmc)

20080061032 - Electrostatic chuck cleaning during semiconductor substrate processing: Methods and apparatus for cleaning electrostatic chucks in processing chambers are provided. The process comprises flowing a backside gas comprising a reactive agent into a zone in a process chamber, the zone defined by a space between a surface of an electrostatic chuck or of a cleaning station and a... Agent: Diehl Servilla LLC

20080061033 - Processing method of polymer products: A processing method of a polymer product is provided. This method first supplies a gas to an atmospheric pressure plasma machine to generate an ionized gas. Then, bombard the ionized gas to the surface of the polymer product to create a surface reaction. Afterwards, a dying treatment or an electroplating... Agent: J.c. Patents

20080061034 - Etching apparatus and etching method using the same: An etching apparatus includes a chamber, a substrate support in the chamber, a substrate-screening unit over the substrate support, wherein a diameter of the substrate-screening unit is smaller than as or equals to a substrate, a gas injection means injecting gases onto a periphery of the substrate, a power supply... Agent: Marger Johnson & Mccollom, P.C.

20080061026 - Gimbal-less micro-electro-mechanical-system tip-tilt and tip-tilt-piston actuators and a method for forming the same: Fully monolithic gimbal-less micro-electro-mechanical-system (MEMS) devices with large static optical beam deflection and fabrications methods are disclosed. The devices can achieve high speed of operation for both axes. Actuators are connected to a device, or device mount by linkages that allow static two-axis rotation in addition to pistoning without the... Agent: Joshua D. Isenberg Jdi Patent

20080061028 - Method for producing optical member and method for producing molding die for optical member: The present invention provides a method for producing an optical member including the steps of subjecting a surface of a resin film to laser beam irradiation via a projection mask,.while sequentially moving either the resin film or the projection mask, or the both, and etching the resin film plural times... Agent: Birch Stewart Kolasch & Birch

20080061029 - method for plasma etching of positively sloped structures: The present invention provides a method of etching features in a substrate. The method comprising the steps of placing the substrate on a substrate support in a vacuum chamber. An alternatingly and repeating process is performed on the substrate until a predetermined trench depth and a predetermined sidewall angle are... Agent: Harvey S. Kauget Phelps Dunbar, LLP

20080061031 - Nano-gripper and method of producing same: The nano-gripper of the present invention comprises (i) a pair of arms 71 and 71 disposed side by side, each arm 71 having a face at its front end, the front-end faces of the arms 71 and 71 facing each other, (ii) and a protrusion 72 with a tip formed... Agent: Beyer Weaver LLP

20080061035 - Plasma generator, substrate treating apparatus including the same and substrate treating method: A plasma generator includes a gas supply member configured to supply source gas and a plurality of electrodes for generating plasma using the source gas. The plurality of electrodes have a long rod shape in a first direction and are arranged abreast in a second direction vertical to the first... Agent: Jenkins, Wilson, Taylor & Hunt, P. A.

20080061036 - Method for producing flexographic printing plates using direct laser engraving: Process for the production of flexographic printing plates by means of direct laser engraving by engraving a print relief in the relief-forming layer with the aid of a laser and cleaning the resulting printing plate with a liquid cleaning agent.... Agent: Connolly Bove Lodge & Hutz, LLP

  
03/06/2008 > patent applications in patent subcategories.

20080053952 - Rectifying device, electronic circuit using the same, and method of manufacturing rectifying device: A rectifying device comprising a pair of electrodes, and a carrier transporter consisting of one or more of carbon nanotubes provided between the pair of electrodes wherein high frequency response and heat resistance of the carrier transporter are enhanced by differentiating two connection structures such that the barrier level between... Agent: Oliff & Berridge, PLC

20080053955 - Method for enlarging a nano-structure: A method and system for fabricating nano-scale structures, such as channels (i.e., nano-channels) or vias (i.e., nano-vias. An open nano-structure, is formed in a substrate. Thereafter, an optional conformal material film may be deposited within and over the nano-structure using a first deposition process condition, and then the open nano-structure... Agent: Dla Piper US LLP

20080053956 - Stripping method: Methods are provided for manufacturing optical display devices which remove an etch resist and residual post-etch metal in a single step. These methods are particularly useful in the manufacture of LCDs.... Agent: S. Matthew Cairns Rohm And Haas Electronic Materials LLC

20080053951 - Method of transferring patterned non-densely packed interfacial particle films onto substrates: A process for transferring patterned non-densely packed interfacial particle films onto substrates by providing a substrate, modifying the substrate so that it is non-water wetting, providing an interfacial film of charged particles, applying a surface modifying procedure to said particles, and applying the interfacial particle film to the modified substrate... Agent: Roetzel And Andress

20080053953 - Production method for color filter: The present invention provides a production method for a color filter including forming a first colored layer on a support, forming a photoresist layer on the first colored layer, forming an image on the first colored layer by removing the photoresist layer in the form of an image pattern, etching... Agent: Sughrue Mion, PLLC

20080053954 - Substrate preparation method for a mems fabrication process: Provided is a substrate preparation method for a micro-electromechanical system (MEMS) fabrication process. The method includes the step of depositing at least four metal layers interspersed with interlayer dielectric (ILD) layers onto a silicon wafer substrate. A passivation layer is deposited onto an outermost metal layer and at least a... Agent: Silverbrook Research Pty Ltd

20080053959 - Method for low temperature bonding and bonded structure: A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. One etching process The method may also include removing by-products of interface polymerization to prevent a reverse polymerization reaction to allow room temperature chemical bonding of materials such as silicon,... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080053958 - Plasma processing apparatus: A plasma processing apparatus for processing a specimen placed on a table disposed inside of a processing chamber by using plasmas formed in the processing chamber in which the table is disposed. A first member is placed in contact with the specimen and a second member is disposed below the... Agent: Antonelli, Terry, Stout & Kraus, LLP

20080053957 - Substrate processing system, substrate processing method and storage medium: [Object]To provide a technique capable of avoiding or reducing the adverse influence on the equipment of an atmospheric carrying chamber when a substrate processed by the vacuum process is carried to the atmospheric carrying chamber. [Means for Solving the Problems]In the present invention, a posttreatment chamber for carrying out a... Agent: Smith, Gambrell & Russell

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