Etching a substrate: processes inventions 01/08

20080023437 - Method for manufacturing piezoelectric resonator: To provide a method for manufacturing a piezoelectric resonator which can widen the range of frequency adjustment while saving metal thereby suppressing reduction of the yields when forming a metal film for frequency adjustment at the tip of an vibrating arm. The method of manufacturing the piezoelectric resonator according to... Agent: Jordan And Hamburg LLP

20080023438 - Method of manufacturing a liquid crystal display apparatus: A method of manufacturing a liquid crystal display apparatus includes forming at least one assembly for forming a plurality of finished liquid crystal display apparatuses, by opposing two glass substrates to have a space therebetween and sealing a periphery of the space between the two glass substrates by an outer... Agent: Frishauf, Holtz, Goodman & Chick, PC

20080023440 - Method and system for controlling the uniformity of a ballistic electron beam by rf modulation: A method and system for treating a substrate using a ballistic electron beam is described, whereby the radial uniformity of the electron beam flux is adjusted by modulating the source radio frequency (RF) power. For example, a plasma processing system is described having a first RF power coupled to a... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080023441 - Method of deep etching: A method of deep etching is disclosed. Initially, a wafer is provided, and a patterned mask having at least an opening to expose a surface of the wafer is formed on the surface of the wafer. A deposition process is performed to form a polymer layer on the patterned mask... Agent: North America Intellectual Property Corporation

20080023444 - Substrate processing apparatus and substrate processing method: A substrate processing apparatus includes a high-speed supply system having a relatively small opening for ejecting a processing liquid through the relatively small opening to supply the processing liquid into a processing bath, and a low-speed supply system having a relatively large opening for ejecting the processing liquid through the... Agent: Ostrolenk Faber Gerb & Soffen

20080023435 - Method for self-assembling microstructures: A method for self-assembling a plurality of microstructures onto a substrate comprising using a bonding material to make the microstructure assembled onto the substrate by a physical attraction force The microstructures are self-aligned with the substrate, and further permanently fixed on and electrical connection with the substrate by the solder... Agent: Birch Stewart Kolasch & Birch

20080023436 - Deposition by adsorption under an electrical field: A method for depositing a material by adsorption onto a substrate, includes a step of exposing the substrate to a precursor molecule in the gaseous phase. These precursor molecules present a non-zero dipole moment. An electrical field is applied during the substrate exposing step to cause a reactive branch of... Agent: Gardere Wynne Sewell LLP Intellectual Property Section

20080023439 - Hierarchically-dimensioned-microfiber-based dry adhesive materials: Embodiments of the present invention include hierarchically-dimensioned, microfiber-based dry adhesive materials featuring dense arrays of microfibers with free tips terminating in numerous microfibrils. In certain embodiments, more than two levels of microfiber-dimension hierarchy may be employed, each dimension involving smaller microfibrils emanating from the tips of the microfibers or microfibrils... Agent: Hewlett Packard Company

20080023442 - Method for manufacturing electronic device: A method for manufacturing an electronic device using a closed-type transport container, includes: controlling relative humidity inside the closed-type transport container to be lower than ambient relative humidity outside the closed-type transport container on a particular interprocess transport path in which an intermediate product stored in the closed-type transport container... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080023443 - Alternating asymmetrical plasma generation in a process chamber: Embodiments of the invention generally provide etch or CVD plasma processing methods and apparatus used to generate a uniform plasma across the surface of a substrate by modulation pulsing the power delivered to a plurality of plasma controlling devices found in a plasma processing chamber. The plasma generated and/or sustained... Agent: Patent Counsel Applied Materials, Inc.

20080017606 - Method of forming structure, bank structure, electronic circuit, electronic device and electronic apparatus: A method for forming a surface energy difference bank includes: providing a material for forming a self-assembled molecular film onto a contact region of a stamps the contact region being formed of a plurality of apical faces of a plurality of elastic elements protruding out from a base part of... Agent: Oliff & Berridge, PLC

20080017607 - Method for producing color filter: The invention provides a color filter producing method that is based on dry etching and makes it possible to produce a color filter which has fine and rectangular pixels and is excellent in flatness, and color filters produced by the method. The method is a color filter producing method of... Agent: Sughrue Mion, PLLC

20080017610 - Process for producing glass substrate for magnetic disk: A process for producing a glass substrate for a magnetic disk, which comprises etching an edge surface of circular glass, followed by polishing.... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080017611 - Etching apparatus and method: An etching apparatus and an etching method, wherein pressure exerted on a substrate is minimized, and an entire surface of the substrate is uniformly pressed during an etching process. The breakage of the substrate is prevented, and the substrate is uniformly etched. Accordingly, the thickness of the substrate may be... Agent: F. Chau & Associates, LLC

20080017612 - Method of fabricating a hinge: The present invention provides a method of fabricating a hinge. First, a wafer is provided, and a hinge region and at least two through regions are defined on the wafer. The wafer in the hinge region is partially removed from a bottom surface of the wafer. Subsequently, the wafer in... Agent: North America Intellectual Property Corporation

20080017608 - Method of protecting nozzle guarded printhead during fabrication: A method of fabricating a printhead is provided in which sacrificial material is deposited on a substrate having printing nozzles formed thereon so that a first portion of the sacrificial material encases the nozzles and a second portion of the sacrificial material forms part of a printing fluid containment formation... Agent: Silverbrook Research Pty Ltd

20080017609 - Probe head manufacturing method: A beam (32) of a probe bead (30) having a uniform thickness is formed by using a silicon layer (64) of a SOI substrate. The beam of the probe head is formed by growing a boron-doped diamond and non-doped diamond on a processing substrate, respectively.... Agent: Nixon & Vanderhye, PC

20080017613 - Method for processing outer periphery of substrate and apparatus thereof: A reactive gas is jetted out from a jet nozzle (75) toward a target spot (P) of the peripheral part of the substrate (90) in such a way that the reactive gas is made to flow approximately along a circumferential direction at the target spot (P) of the substrate (90)... Agent: Sughrue Mion, PLLC

20080011713 - Substrate processing apparatus, substrate processing method and substrate manufacturing method: A substrate processing apparatus of the invention has a self-propelled carrying mechanism 15 configured to enable a processing target substrate W to be carried to/from each of liquid processing apparatuses HB, COT and DEV where at least two liquid processing apparatuses W are linearly disposed and to be movable in... Agent: Kanesaka Berner And Partners LLP

20080011715 - Process and system for quality management and analysis of via drilling: A process for laser forming a blind via in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry can include, for at least one blind via to be formed in at least one layer of a circuit substrate, evaluating a capture pad... Agent: Young & Basile, P.C.

20080011714 - Photoresist stripping solution and a method of stripping photoresists using the same: A photoresist stripping solution which comprises (a) a salt of hydrofluoric acid with a base free from metal ions, (b) a water-soluble organic solvent, (c) a mercapto group containing corrosion inhibitor, and (d) water, and a method of stripping photoresists with the use of the same are disclosed. In case... Agent: Wenderoth, Lind & Ponack, L.L.P.

20080011716 - Plasma processing apparatus and method: A plasma processing method for a plasma processing apparatus which includes, a gas ring, a bell jar, an antenna, a sample table, a Faraday shield, and an RF power source circuit for supplying a power source voltage to the antenna and the Faraday shield. The RF power source circuit includes... Agent: Antonelli, Terry, Stout & Kraus, LLP

20080011717 - Chemical etch solution and technique for imaging a device's shallow junction profile: The present invention provides, in one aspect, a method of imaging a microelectronics device 100. The method comprises cleaning, when contaminants are preset, a sample of a microelectronics device 100 to be imaged with a first solution comprising hydrofluoric acid, an inorganic acid and water, exposing the sample to a... Agent: Texas Instruments Incorporated

20080011718 - Procedure for etching of materials at the surface with focussed electron beam induced chemical reactions at said surface: The invention refers to a procedure for etching of materials at the surface by focussed electron beam induced chemical reactions at said surface. The invention is characterized in that in a vacuum atmosphere the material which is to be etched is irradiated with at least one beam of molecules, at... Agent: Woodling, Krost And Rust

20080006602 - Apparatus and method for fabricating color filter: An exemplary coating apparatus (40) for fabricating a color filter (3) includes a supporting table (44) and a dispenser (48). The supporting table supports a substrate (30) that serves as a foundation of the color filter. The dispenser includes plural first nozzles (412) for spraying a first color photo-resist onto... Agent: Wei Te Chung Foxconn International, Inc.

20080006603 - Electron induced chemical etching and deposition for local circuit repair: A method of imaging and repairing defects on and below the surface of an integrated circuit (IC) is described. The method may be used in areas as small as one micron in diameter, and may remove the topmost material in the small spot, repeating with various layers, until a desired... Agent: Schwegman, Lundberg & Woessner, P.A.

20080006604 - Devices and methods for using electrofluid and colloidal technology: At least one exemplary embodiment is directed to a device that uses a charged photoresist which is subsequently patterned by electric and/or magnetic fields and subsequently exposed and developed to provide an etchable pattern in a semiconductor substrate.... Agent: Dr. John P. Keady Personics Holdings Inc.

20080006605 - Method of manufacturing a porous resin substrate having perforations and method of making a porous resin substrate including perforations having electrically conductive wall faces: A method of manufacturing a perforated porous resin substrate, the method including the following steps: Step 1 of forming at least one perforation penetrating in the thickness direction from a first surface to a second surface in a porous resin substrate made of a resin material containing a fluoropolymer; Step... Agent: Mcdermott Will & Emery LLP

20080006606 - Method of dissolving the solids formed in a nuclear plant: The method of dissolving the solids formed in the apparatus and pipework of a nuclear plant, in which the solids are brought into contact with an aqueous dissolving solution chosen from aqueous solutions of carbonate ions having a concentration of greater than or equal to 0.3M, aqueous solutions of bicarbonate... Agent: Hutchison Law Group PLLC