Etching a substrate: processes inventions 02/07

20070039920 - Method of fabricating nanochannels and nanochannels thus fabricated: A method of fabricating at least one nanochannel in a semiconductor material applied on a substrate, comprising the semiconductor material being subjected to an etching treatment and the substrate to a bonding treatment so as to attach a covering layer to the substrate, in which bonding treatment the semiconductor material... Agent: Peacock Myers, P.C.

20070039919 - Polymide thin film self-assembly process: The invention presents a novel polyimide-based thin film self-assembly technology, including five process steps described as follows: (1) deposits a sacrificial layer and a low-stress microstructure layer on a silicon substrate; (2) patterns and etches the low-stress microstructure layer to provide a stationary part and a movable part of the... Agent: Bacon & Thomas, PLLC

20070039921 - Etching solutions and processes for manufacturing flexible wiring boards: An etching solution of the invention includes 3-65% by weight of a diol containing 3 to 6 carbon atoms or a triol containing 4 to 6 carbon atoms, 10-55% by weight of an alkali compound, and water in an amount of 0.75-3.0 times the amount of the alkali compound. Such... Agent: Osha Liang L.L.P.

20070039922 - Perpendicular magnetic discrete track recording disk: A method of forming a discrete track recording pattern on a soft magnetic underlayer of a perpendicular magnetic recording disk. In one embodiment, the soft magnetic underlayer is continuous throughout the discrete track recording pattern.... Agent: Blakely Sokoloff Taylor & Zafman

20070039923 - Method for preventing charge-up in plasma process and semiconductor wafer manufactured using same: A method for preventing plasma charge-up of a semiconductor wafer includes defining a semiconductor chip region and a scribe line region on a semiconductor wafer, forming an interlayer insulating layer pattern on the wafer, the interlayer insulating layer pattern exposing the scribe line region, plasma etching the interlayer insulating layer... Agent: Marger Johnson & Mccollom, P.C.

20070039924 - Low-temperature oxide removal using fluorine: A method and system for processing a substrate includes providing the substrate in a process chamber, the substrate having an oxide layer formed thereon, and exposing the substrate to an etching gas containing F2 gas at a first temperature to remove the oxide layer from the substrate. The substrate may... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070039925 - Spectra based endpointing for chemical mechanical polishing: Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting two or more reference spectra. Each reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectra is selected for... Agent: Fish & Richardson P.C.

20070039926 - Abrasive-free polishing system: The invention provides a chemical-mechanical polishing system comprising a water-soluble silicate compound, an oxidizing agent that oxidizes at least a part of a substrate, water, and a polishing pad, wherein the polishing system is substantially free of abrasive particles. The invention further provides a method of chemically-mechanically polishing a substrate... Agent: Steven Weseman Associate General Counsel, I.p.

20070039927 - Cmp wafer contamination reduced by insitu clean: Reducing CMP wafer contamination by in-situ clean is disclosed herein. The invention can be employed in a method in which a conductive layer is formed on a surface of a semiconductor wafer. After a portion of the conductive layer is removed, an acidic solution is directly or indirectly applied to... Agent: Campbell Stephenson Ascolese, LLP

20070034596 - Printed wiring board fabrication method, printed wiring board photomask, and program for creating a photomask: The present invention is configured such that a wiring pattern, formed by forming an etching resist on metal foil that has been layered on an insulating resin board and performing etching via this etching resist, is provided with a circuit pattern constituting an electronic circuit and a dummy pattern provided... Agent: Birch Stewart Kolasch & Birch

20070034597 - Method for manufacturing a micro-electromechanical nozzle arrangement on a substrate with an integrated drive circutry layer: A method for manufacturing a micro-electromechanical printer nozzle arrangement on a substrate having a layer of integrated drive circuitry includes etching a nozzle region through the layer of integrated drive circuitry up to the substrate. Electrical contact regions are etched about the nozzle region. Metal and polytetrafluoroethylene (PTFE) layers are... Agent: Silverbrook Research Pty Ltd

20070034598 - Method of fabricating a printhead integrated circuit with a nozze chamber in a wafer substrate: A method of fabricating a printhead integrated circuit includes the step of forming a first layer of a polymeric material on a substrate that incorporates drive circuitry. A heater element is formed on the first layer of polymeric material to be connected to the drive circuitry. A second layer of... Agent: Silverbrook Research Pty Ltd

20070034599 - Nanoscale electric lithography: A nanoscale lithographic method in which a reusable conductive mask, having a pattern of conductive surfaces and insulating surfaces, is positioned upon a substrate whose surface contains an electrically responsive resist layer over a buried conductive layer. When an electric field is applied between the conductive mask and buried conductive... Agent: John P. O'banion O'banion & Ritchey LLP

20070034600 - Planarization method of patterning a substratte: The present invention includes a method for forming a pattern on a substrate with a composition by forming a cross-linked polymer from the composition upon exposing the same to radiation. The method includes depositing the composition to function as a planarization layer. Thereafter, a layer of polymerizable material into which... Agent: Molecular Imprints, Inc.

20070034601 - Surface treating method and surface-treating apparatus: The surface of a material for an electronic device is flattened by irradiating the surface of the material with at least part of plasma components, while supplying a liquid to the surface of the material for an electronic device. There are provided a method of treating the surfaces for favorably... Agent: C. Irvin Mcclelland Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070034602 - Structure having three-dimensional network skeleton, method for producing the structure, and fuel cell including the structure: The present invention provides a new method for producing a structure having a three-dimensional network skeleton. The method includes providing a film including a first material and a second material and removing the second material contained in the film by dry etching. The first material contains a noble metal and... Agent: Fitzpatrick Cella Harper & Scinto

20070034603 - Etching methods, rie methods, and methods of increasing the stability of photoresist during rie: An etching method includes applying a photoresist over a substrate, forming an opening in the photoresist, and etching the substrate under the opening using a plasma generated with a gas composition containing argon and an amount of higher atomic mass inert gas. The amount may be effective to increase photoresist... Agent: Wells St. John P.s.

20070034604 - Method and apparatus for tuning a set of plasma processing steps: In a plasma processing system, a method of tuning of a set of plasma processing steps is disclosed. The method includes striking a first plasma comprising neutrals and ions in a plasma reactor of the plasma processing system. The method also includes etching in a first etching step a set... Agent: Ipsg, P.C.

20070034605 - Evaporation control using coating: A novel arrangement and method for depositing evaporation control agents so as to coat immersion lithographic solutions which are employed on the surface of semiconductor wafers in connection with the etching of the surfaces of the wafer through the intermediary of an immersion lithographic process.... Agent: Scully, Scott, Murphy & Pressner, P.C.

20070034606 - Method for pickling metallic surfaces by using alkoxylated alkynols: Process for pickling metallic surfaces by treating the metallic surface with a composition which comprises water, at least one acid, an alkyne alkoxylate and optionally further additives. In a preferred embodiment, the alkyne alkoxylate is used together with a complexing agent.... Agent: Connolly Bove Lodge & Hutz, LLP

20070023386 - Hollow microneedle array: An inexpensive and rapid method for fabricating arrays of hollow microneedles uses a photoetchable glass. Furthermore, the glass hollow microneedle array can be used to form a negative mold for replicating microneedles in biocompatible polymers or metals. These microneedle arrays can be used to extract fluids from plants or animals.... Agent: Sandia Corporation

20070023388 - Conductor composition for use in ltcc photosensitive tape on substrate applications: The present invention is directed to a thick film conductor composition comprising: (a) 70 to 98 weight percent of one or more electrically functional powders; (b) 0.5 to 10 weight percent glass frit; (c) 0.5 to 6 weight percent inorganic borides; dispersed in (d) organic medium, based on total thick... Agent: E I Du Pont De Nemours And Company Legal Patent Records Center

20070023387 - Printed circuit board interconnection and method: A product of and method for laminating and interconnecting multiple layer printed circuit boards (14) includes at least two complementary substrates (10 and 12) each having a solder bump (30) formed from conductive material (28) applied to a desired component (22). A dam network (34) is formed about the bumps... Agent: Marsteller & Associates, P.C.

20070023389 - Substrate and method of forming substrate for fluid ejection device: A substrate for a fluid ejection device includes a first side, a second side opposite the first side, and a fluidic channel communicating with the first side and the second side. A first portion of the fluidic channel extends from the first side toward the second side, a second portion... Agent: Hewlett-packard Company Intellectual Property Administration

20070023390 - Cluster tool and method for process integration in manufacturing of a photomask: A method and apparatus for process integration in manufacture of a photomask are disclosed. In one embodiment, a cluster tool suitable for process integration in manufacture of a photomask including a vacuum transfer chamber having coupled thereto at least one hard mask deposition chamber and at least one plasma chamber... Agent: Patterson & Sheridan, LLP

20070023391 - Temperature exchanging element made by extrusion, and its applications: The invention relates to a temperature exchanging element made by extrusion and able to receive a heating element and/or heat conducting element, and radiation fins. It is constituted of a single-piece base incorporating an external face equipped with means to receive the radiation fins, and an inner face equipped with... Agent: Oliff & Berridge, PLC

20070023392 - Method for removing at least one area of a layer of a component consisting of metal or a metal compound: The invention relates to a method for removing an area of a layer of a component consisting of metal or a metal compound. According to prior art, corrosion products of a component are removed in a first step by applying a molten mass or by heating in a voluminous powder... Agent: Siemens Corporation Intellectual Property Department

20070023393 - Interferometer endpoint monitoring device: A photomask etch chamber, which includes a substrate support member disposed inside the chamber. The substrate support member is configured to support a photomask substrate. The chamber further includes a ceiling disposed on the chamber and an endpoint detection system configured to detect a peripheral region of the photomask substrate.... Agent: Patent Counsel Applied Materials, Inc.

20070023394 - Etching method and etching apparatus: Etching and protective-film deposition operations E and D are in alternation repeatedly executed on a silicon substrate carried on a platform within a processing chamber. With gas inside the processing chamber having been exhausted to pump down the chamber interior, in the etching operation E, the substrate is etched by... Agent: Judge & MurakamiIPAssociates

20070023395 - Production method for semiconductor wafer: A production method for a semiconductor wafer is provided in which semi-fixed abrasive grain grinding with free abrasive grains reduces minute surface undulations generated by wire saw slicing or double disc grinding as well as simplifying conventional semiconductor wafer fabrication process steps. A production method for a semiconductor wafer characterized... Agent: Breiner & Breiner, L.L.C.

20070023396 - Etch compositions and methods of processing a substrate: The invention includes an etchant composition containing isopropyl alcohol and one or more of HF, NH4F and tetramethyl ammonium fluoride (TMAF). The invention encompasses a method of processing a substrate. A substrate is provided which has a first material containing at least one of polysilicon, monocrystalline silicon and amorphous silicon,... Agent: Wells St. John P.s.