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05/10/07 | 1 views | #20070103662 | Prev - Next | USPTO Class 355 | About this Page  355 rss/xml feed  monitor keywords

Environmental system including vacuum scavenge for an immersion lithography apparatus

USPTO Application #: 20070103662
Title: Environmental system including vacuum scavenge for an immersion lithography apparatus
Abstract: A lithographic apparatus includes an illumination system configured to condition a beam of radiation, and a support structure configured to hold a patterning device, the patterning device serving to impart the beam of radiation with a pattern in its cross-section. The apparatus also includes a substrate table configured to hold a substrate, a projection system configured to project the patterned beam onto a target portion of the substrate and a fluid supply system configured to provide a fluid to a volume, the volume comprising at least a portion of the projection system, at least a portion of the illumination system, or both. The apparatus also includes a coupling device configured to couple the fluid supply system to the substrate table, substrate, support structure, patterning device, or any combination thereof.
(end of abstract)
Agent: Oliff & Berridge, PLC - Alexandria, VA, US
Inventors: Andrew J. Hazelton, Michael Sogard
USPTO Applicaton #: 20070103662 - Class: 355053000 (USPTO)

The Patent Description & Claims data below is from USPTO Patent Application 20070103662.
Brief Patent Description - Full Patent Description - Patent Application Claims  monitor keywords

RELATED APPLICATION

[0001] This is a Divisional of application Ser. No. 11/237,799 filed Sep. 29, 2005, which in turn is a Continuation of International Application No. PCT/IB2004/002704 filed Mar. 29, 2004, which claims the benefit of U.S. Provisional Patent Application No. 60/462,112 filed on Apr. 10, 2003 and U.S. Provisional Patent Application No. 60/484,476 filed on Jul. 1, 2003. The disclosures of these applications are incorporated herein by reference in their entireties.

BACKGROUND

[0002] Lithography exposure apparatus are commonly used to transfer images from a reticle onto a semiconductor wafer during semiconductor processing. A typical exposure apparatus includes an illumination source, a reticle stage assembly that positions a reticle, an optical assembly, a wafer stage assembly that positions a semiconductor wafer, and a measurement system that precisely monitors the position of the reticle and the wafer.

[0003] Immersion lithography systems utilize a layer of immersion fluid that completely fills a gap between the optical assembly and the wafer. The wafer is moved rapidly in a typical lithography system and it would be expected to carry the immersion fluid away from the gap. This immersion fluid that escapes from the gap can interfere with the operation of other components of the lithography system. For example, the immersion fluid and its vapor can interfere with the measurement system that monitors the position of the wafer.

SUMMARY

[0004] The invention is directed to an environmental system for controlling an environment in a gap between an optical assembly and a device that is retained by a device stage. The environmental system includes a fluid barrier and an immersion fluid system. The fluid barrier is positioned near the device and encircles the gap. The immersion fluid system delivers an immersion fluid that fills the gap.

[0005] In one embodiment, the immersion fluid system collects the immersion fluid that is directly between the fluid barrier and at least one of the device and the device stage. In this embodiment, the fluid barrier includes a scavenge inlet that is positioned near the device, and the immersion fluid system includes a low pressure source that is in fluid communication with the scavenge inlet. Additionally, the fluid barrier can confine and contain the immersion fluid and any of the vapor from the immersion fluid in the area near the gap.

[0006] In another embodiment, the environmental system includes a bearing fluid source that directs a bearing fluid between the fluid barrier and the device to support the fluid barrier relative to the device. In this embodiment, the fluid barrier includes a bearing outlet that is positioned near the device. Further, the bearing outlet is in fluid communication with the bearing fluid source.

[0007] Additionally, the environmental system can include a pressure equalizer that allows the pressure in the gap to be approximately equal to the pressure outside the fluid barrier. In one embodiment, for example, the pressure equalizer is a channel that extends through the fluid barrier.

[0008] Moreover, the device stage can include a stage surface that is in approximately the same plane as an exposed surface of the device. As an example, the device stage can include a device holder that retains the device, a guard that defines the stage surface, and a mover assembly that moves one of the device holder and the guard so that the exposed surface of the device is approximately in the same plane as the stage surface. In one embodiment, the mover assembly moves the guard relative to the device and the device holder. In another embodiment, the mover assembly moves the device holder and the device relative to the guard.

[0009] The invention also is directed to an exposure apparatus, a wafer, a device, a method for controlling an environment in a gap, a method for making an exposure apparatus, a method for making a device, and a method for manufacturing a wafer.

BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The invention will be described in conjunction with the following drawings of exemplary embodiments in which like reference numerals designate like elements, and in which:

[0011] FIG. 1 is a side illustration of an exposure apparatus having features of the invention;

[0012] FIG. 2A is a cut-away view taken on line 2A-2A of FIG. 1;

[0013] FIG. 2B is a cut-away view taken on line 2B-2B of FIG. 2A;

[0014] FIG. 2C is a perspective view of a containment frame having features of the invention;

[0015] FIG. 2D is an enlarged detailed view taken on line 2D-2D in FIG. 2B;

[0016] FIG. 2E is an illustration of the portion of the exposure apparatus of FIG. 2A with a wafer stage moved relative to an optical assembly;

[0017] FIG. 3 is a side illustration of an injector/scavenge source having features of the invention;

[0018] FIG. 4A is an enlarged detailed view of a portion of another embodiment of a fluid barrier;

[0019] FIG. 4B is an enlarged detailed view of a portion of another embodiment of a fluid barrier;

[0020] FIG. 4C is an enlarged detailed view of a portion of another embodiment of a fluid barrier;

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Brief Patent Description - Full Patent Description - Patent Application Claims
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Position measuring apparatus and positional deviation measuring method
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Exposure apparatus, exposure method, and method for producing device
Industry Class:
Photocopying

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